| Patents for H05K 1 - Printed circuits (98,583) |
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| 06/26/2014 | WO2014097836A1 Chip component mounting structure, and module component |
| 06/26/2014 | WO2014097580A1 Electronic circuit board and connector connection structure |
| 06/26/2014 | WO2014097061A1 Procedure for the manufacture and assembly of electronic boards and electronic device thus obtainable |
| 06/26/2014 | WO2014096140A1 Component, method for producing a component, component arrangement and method for applying a component |
| 06/26/2014 | WO2014096049A1 Method for producing a magnetically permeable circuit |
| 06/26/2014 | WO2014095599A1 Method for brazing a printed circuit |
| 06/26/2014 | WO2014095587A1 Component carrier and component carrier arrangement |
| 06/26/2014 | WO2014095315A1 Electronic device and method for producing an electronic device |
| 06/26/2014 | WO2014095270A1 Method for producing a multilayer carrier body |
| 06/26/2014 | WO2014095202A1 Heat sink for cooling an electric component |
| 06/26/2014 | WO2014095199A1 Electric assembly to be mounted on a top-hat rail |
| 06/26/2014 | WO2014095146A1 Battery cell having a monitoring circuit |
| 06/26/2014 | WO2014095007A1 Circuit board with real wood ply composite material |
| 06/26/2014 | WO2014094636A1 Electronic device and lga module |
| 06/26/2014 | WO2014094562A1 Light-emitting diode (led) display module |
| 06/26/2014 | WO2014094120A1 Electronic devices comprising butyl rubber |
| 06/26/2014 | WO2014094028A1 Semi-finished product for the production of a printed circuit board, method for producing a printed circuit board and printed circuit board |
| 06/26/2014 | WO2014094020A1 Printed circuit board |
| 06/26/2014 | WO2013139470A3 Substrate for a portable data carrier |
| 06/26/2014 | US20140179162 Apparatus for Differential Far-End Crosstalk Reduction |
| 06/26/2014 | US20140179127 Interconnection device for electronic circuits, notably microwave electronic circuits |
| 06/26/2014 | US20140178697 Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same |
| 06/26/2014 | US20140178656 Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same |
| 06/26/2014 | US20140178573 Low firing temperature copper composition |
| 06/26/2014 | US20140177195 Expansion apparatus with serial advanced technology attachment dual in-line memory module device |
| 06/26/2014 | US20140177194 Dbf film as a thermal interface material |
| 06/26/2014 | US20140177193 Bumpless build-up layer package including a release layer |
| 06/26/2014 | US20140177192 Core substrate and method for manufacturing the same, and substrate with built-in electronic components and method for manufacturing the same |
| 06/26/2014 | US20140177191 Motherboard |
| 06/26/2014 | US20140177189 Chip stacking structure |
| 06/26/2014 | US20140177180 Electromagnetic Interference Shielding and Strain Relief Structures For Coupled Printed Circuits |
| 06/26/2014 | US20140177179 Wiring substrate, electronic device, and electronic module |
| 06/26/2014 | US20140177178 Printed electronics |
| 06/26/2014 | US20140177177 Electronic device and fabrication method thereof |
| 06/26/2014 | US20140177176 Panel unit that reduces influence of static electricity, and electronic apparatus |
| 06/26/2014 | US20140177175 Gold Pad Mini PCB Module |
| 06/26/2014 | US20140177150 Crosstalk cancelation in striplines |
| 06/26/2014 | US20140177129 Multilayer ceramic capacitor, manufacturing method of the same, and circuit board with multilayer ceramic capacitor mounted thereon |
| 06/26/2014 | US20140176840 Electronic equipment and flexible printed circuit |
| 06/26/2014 | US20140175942 Multilayer ceramic electronic component and method for manufacturing multilayer ceramic electronic component |
| 06/26/2014 | US20140175680 Electrical characteristics of package substrates and semiconductor packages including the same |
| 06/26/2014 | US20140175671 Structure for microelectronic packaging with bond elements to encapsulation surface |
| 06/26/2014 | US20140175666 Integrated circuit device with stitched interposer |
| 06/26/2014 | US20140174811 Printed circuit board and manufacturing method thereof |
| 06/26/2014 | US20140174810 Printed circuit board and method of manufacturing the same |
| 06/26/2014 | US20140174809 Circuit board and method of manufacturing the same |
| 06/26/2014 | US20140174808 Reduced capacitance land pad |
| 06/26/2014 | US20140174807 High density organic bridge device and method |
| 06/26/2014 | US20140174806 Multilayer ceramic capacitor and board for mounting the same |
| 06/26/2014 | US20140174804 Electrical device package structure and method of fabricating the same |
| 06/26/2014 | US20140174803 Wiring substrate and multi-piece wiring substrate |
| 06/26/2014 | US20140174802 Lowdielectric resin composition, copper clad laminate using the same, and printed circuit board using the same |
| 06/26/2014 | US20140174801 Conductive material and process |
| 06/26/2014 | US20140174800 Embedded multilayer ceramic electronic component and method of manufacturing the same, and printed circuit board having embedded multilayer ceramic electronic component |
| 06/26/2014 | US20140174799 Touch electrode device |
| 06/26/2014 | US20140174798 Metal core substrate and method of manufacturing the same |
| 06/26/2014 | US20140174797 Build-up film structure, circuit board manufactured using the same, and method for manufacturing circuit board using the same |
| 06/26/2014 | US20140174796 Flexible printed circuit board and electronic device |
| 06/26/2014 | US20140174795 Printed wiring board, printed circuit board, and method for manufacturing printed circuit board |
| 06/26/2014 | US20140174794 Heat radiating substrate and manufacturing method thereof |
| 06/26/2014 | US20140174793 Printed circuit board and method for manufacturing the same |
| 06/26/2014 | US20140174792 Insulating film for printed circuit board having improved thermal conductivity, manufacturing method thereof, and printed circuit board using the same |
| 06/26/2014 | US20140174791 Circuit board and manufacturing method thereof |
| 06/26/2014 | US20140174790 Wiring substrate |
| 06/26/2014 | US20140174789 Touch panel and fabrication method thereof |
| 06/26/2014 | DE102013226897A1 Elektronische Ausrüstung und flexible gedruckte Schaltung Electronic equipment and flexible printed circuit |
| 06/26/2014 | DE102012223940A1 Device for electrically contacting printed circuit boards has opening that is formed at tip edge portion for insertion into first circuit board, and cutting edge that is formed at cutting portion for insertion into second circuit board |
| 06/26/2014 | DE102012203474B4 Kartenleser mit einem eine Leiterbahnstruktur aufweisenden Kunststoffspritzteil Card reader with a wiring pattern having a plastic injection molding |
| 06/26/2014 | DE102012112913A1 Electrically non-conductive substrate used in sensor components, has cavity whose surface is partially provided with four layers, and electrically conductive connection that is produced on outer surface of substrate |
| 06/26/2014 | DE102012112738A1 Elektronikmodul mit einer mit Kunststoff umhüllten elektronische Schaltung und Verfahren zu dessen Herstellung Electronic module having an electronic circuit wrapped with plastic and process for its preparation |
| 06/25/2014 | EP2747528A1 Interconnection device for electronic circuits, in particular hyperfrequency electronic circuits |
| 06/25/2014 | EP2747527A1 Flexible circuit board and bend structure and device comprising the flexible circuit board |
| 06/25/2014 | EP2747136A1 High density organic bridge device and method |
| 06/25/2014 | EP2745661A2 Electrical connection device, assembly including such a device and an electronic board, and method for electrically connecting an electronic board |
| 06/25/2014 | EP2745659A1 Electronic module, lighting device and manufacturing method of the electronic module |
| 06/25/2014 | EP2745657A1 Conductive pattern, method for forming the same, printed wiring board, and manufacturing method of the same |
| 06/25/2014 | EP2745655A2 Electronic device comprising a capacitor in a holder for a circuit board and method for production thereof |
| 06/25/2014 | CN203675445U 电机的控制装置 Motor control means |
| 06/25/2014 | CN203675444U 一种装有mt插芯的光学印刷电路板 One kind of an optical ferrule fitted mt printed circuit board |
| 06/25/2014 | CN203675443U 一种走线印制板 One kind of PCB traces |
| 06/25/2014 | CN203675442U 扁平布线材料 Flat wiring material |
| 06/25/2014 | CN203675441U 拼装式线路板 Assembled PCB |
| 06/25/2014 | CN203675440U 一种pcb板及使用该pcb板的电子产品 One kind pcb board pcb board using the same electronic products |
| 06/25/2014 | CN203675439U 一种高稳定多层挠性印制板 A highly stable multilayer flexible printed circuit board |
| 06/25/2014 | CN203675438U 一种pcb拼板 One kind pcb puzzle |
| 06/25/2014 | CN203675437U 电路板及具有此电路板的电子装置 The circuit board and an electronic device having the circuit board |
| 06/25/2014 | CN203675436U 剃须刀线路板 Shaver board |
| 06/25/2014 | CN203675435U 一种具有nfc非接触射频天线的手持设备 Having a non-contact RF antenna nfc handheld devices |
| 06/25/2014 | CN203675434U 一种防折刚挠结合线路板 An anti-fold rigid-flex circuit boards |
| 06/25/2014 | CN203675433U 一种耐压金属基线路板 One kind of pressure metal-based board |
| 06/25/2014 | CN203675432U 一种增厚蓝胶网 One kind of thick blue plastic mesh |
| 06/25/2014 | CN203675431U 柔性印制多层电路板 A multilayer flexible printed circuit board |
| 06/25/2014 | CN203675430U 柔性印制电路板 A flexible printed circuit board |
| 06/25/2014 | CN203675429U 高导热柔性印制电路板 High thermal conductivity of the flexible printed circuit board |
| 06/25/2014 | CN203675428U 一种无缺口半蚀刻钢片及其联版 A non-gap half-etched steel and its associated Edition |
| 06/25/2014 | CN203675427U 一种印制电路板及终端设备 One of a printed circuit board and terminal equipment |
| 06/25/2014 | CN203675426U 一种18w2g11管灯电路板 One kind 18w2g11 tube light circuit board |
| 06/25/2014 | CN203675425U 一种保护信号完整性的印刷电路板 A method of protecting a printed circuit board signal integrity |
| 06/25/2014 | CN203675424U 一种led工矿灯电路板 One kind of led mining lamp circuit board |
| 06/25/2014 | CN203675423U 电路板结构 Circuit board structure |