| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 10/02/2014 | US20140290984 Transparent conductive film |
| 10/02/2014 | US20140290983 Stacked multilayer structure |
| 10/02/2014 | US20140290982 Printed circuit board and method for manufacturing the same |
| 10/02/2014 | US20140290981 Printed circuit board |
| 10/02/2014 | US20140290980 Touch screen and method of producing the same |
| 10/02/2014 | US20140290979 Method Of Manufacturing A Patterned Transparent Conductor |
| 10/02/2014 | US20140290286 Method and device for cooling soldered printed circuit boards |
| 10/02/2014 | DE102013218745A1 Verfahren zum Aufbringen einer Leiterbahn auf ein Objekt und Objekt A method for applying a conductive trace on an object and object |
| 10/02/2014 | DE102013205655A1 Mehrlagiges induktives passives Bauelement und Folienkörper zu dessen Herstellung Layered inductive passive component and film body for its production |
| 10/02/2014 | DE102013205532A1 Verfahren zur Bildung magnetisch gekoppelter Spulen in einer Leiterplatte A method for forming magnetically coupled coils in a circuit board |
| 10/02/2014 | DE102013114890A1 Transparenter elektrischer Leiter und Vorrichtung enthaltend denselben Transparent electrical conductor and device containing same |
| 10/01/2014 | EP2785156A1 Heating element for a motor vehicle |
| 10/01/2014 | EP2785155A2 Circuit board and electronic device |
| 10/01/2014 | EP2784837A1 Piezoelectric/electrostrictive element and wiring substrate |
| 10/01/2014 | EP2784808A1 Resin for electrical components, semiconductor device, and wiring board |
| 10/01/2014 | EP2784199A1 Woven electrical connection structure |
| 10/01/2014 | EP2783555A1 Electronic component module and method of manufacturing the same |
| 09/30/2014 | US8849074 Optical-electrical converting device |
| 09/30/2014 | US8848395 Securing mechanism and electronic device with connector cover |
| 09/30/2014 | US8848392 Co-support module and microelectronic assembly |
| 09/30/2014 | US8848391 Co-support component and microelectronic assembly |
| 09/30/2014 | US8848390 Capacitive proximity communication using tuned-inductor |
| 09/30/2014 | US8848389 Transmission device and method for manufacturing same, and wireless transmission device and wireless transmission method |
| 09/30/2014 | US8848388 Electrical device |
| 09/30/2014 | US8848386 Electronic circuit |
| 09/30/2014 | US8848385 Embedded isolation filter |
| 09/30/2014 | US8848384 Power transducer |
| 09/30/2014 | US8848358 Server with expansion card |
| 09/30/2014 | US8848313 Thermal solution for drive systems such as hard disk drives and digital versatile discs |
| 09/30/2014 | US8847726 Method for manufacturing ESD protection device and ESD protection device |
| 09/30/2014 | US8847696 Flexible interconnect cable having signal trace pairs and ground layer pairs disposed on opposite sides of a flexible dielectric |
| 09/30/2014 | US8847369 Packaging structures and methods for semiconductor devices |
| 09/30/2014 | US8847356 Component-built-in wiring board |
| 09/30/2014 | US8847251 Substrate, light-emitting device, and lighting apparatus having a largest gap between two lines at light-emitting element mounting position |
| 09/30/2014 | US8847083 Printed wiring board (PWB) with lands |
| 09/30/2014 | US8847082 Multilayer wiring substrate |
| 09/30/2014 | US8847081 Planar thermal dissipation patch |
| 09/30/2014 | US8847080 Laminated wiring board |
| 09/30/2014 | US8847079 Method for producing an integrated device |
| 09/30/2014 | US8847078 Printed wiring board and method for manufacturing printed wiring board |
| 09/30/2014 | US8846799 Epoxy resin composition, prepreg, and metal-clad laminate and multilayered printed wiring board |
| 09/30/2014 | US8846790 Resin composition, and prepreg and printed circuit board prepared using the same |
| 09/30/2014 | US8846454 Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer |
| 09/30/2014 | US8846199 Organic-inorganic electrospun fibers |
| 09/30/2014 | US8845910 Aluminum alloy composite and method for joining thereof |
| 09/30/2014 | US8845842 Method for manufacturing circuit board using electrically conductive particles and circuit board manufactured by the method |
| 09/30/2014 | US8844883 Cable holder and electronic system |
| 09/30/2014 | US8844351 Solid state fluid level sensor |
| 09/30/2014 | US8844125 Method of making an electronic device having a liquid crystal polymer solder mask and related devices |
| 09/25/2014 | WO2014152331A1 Connectors and systems having improved crosstalk performance |
| 09/25/2014 | WO2014150028A1 Electrodeposition methods and baths for use with printed circuit boards and other articles |
| 09/25/2014 | WO2014148538A1 Curable epoxy composition, film, laminate film, prepreg, laminate body, cured product, and composite body |
| 09/25/2014 | WO2014148155A1 Resin composition and adhesive film, coverlay film, and interlayer adhesive using resin composition |
| 09/25/2014 | WO2014148121A1 Structure, wireless communication device and method for manufucturing structure |
| 09/25/2014 | WO2014148091A1 Composition for conductive film formation, and method for producing conductive film using same |
| 09/25/2014 | WO2014147286A1 Batteryless activity monitor |
| 09/25/2014 | WO2014147154A1 Method for manufacturing a flexible printed circuit, flexible printed circuit obtained by said method, and chip card module comprising such a flexible printed circuit |
| 09/25/2014 | WO2014146830A1 Power module with at least one power component |
| 09/25/2014 | WO2014146808A1 Assembly for housing at least one solid state drive (ssd) |
| 09/25/2014 | WO2014146469A1 Package substrate, manufacturing method thereof, and substrate assembly |
| 09/25/2014 | US20140288240 Resin composition, prepreg, laminate and printed circuit board using the same |
| 09/25/2014 | US20140287299 Heat-Debonding Adhesives |
| 09/25/2014 | US20140287241 Epoxy resin, curable resin composition and cured product thereof, and printed wiring board |
| 09/25/2014 | US20140285990 Circuit board for connecting secondary battery |
| 09/25/2014 | US20140285989 Method of mounting semiconductor element, and semiconductor device |
| 09/25/2014 | US20140285988 Substrate with built-in electronic component |
| 09/25/2014 | US20140285983 Display device, mobile device using the same, method of manufacturing the display device |
| 09/25/2014 | US20140285982 Display apparatus |
| 09/25/2014 | US20140285980 Conversion of strain-inducing buffer to electrical insulator |
| 09/25/2014 | US20140285979 Minimizing printed circuit board warpage |
| 09/25/2014 | US20140285974 Substrate spacing member and inverter device |
| 09/25/2014 | US20140285970 Electric Power Conversion System |
| 09/25/2014 | US20140285737 Transparent conductive element, input device, electronic device, and master for fabrication of transparent conductive element |
| 09/25/2014 | US20140285213 Component-embedded circuit substrate and method of inspecting the same |
| 09/25/2014 | US20140284820 Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device |
| 09/25/2014 | US20140284093 Support apparatus, via adding method, and printed circuit board |
| 09/25/2014 | US20140284092 Split pad for circuit board |
| 09/25/2014 | US20140284090 Thin film substrate and method for manufacturing the same |
| 09/25/2014 | US20140284089 Electronic component and electronic component package |
| 09/25/2014 | US20140284088 Circuit board and electronic apparatus provided with same |
| 09/25/2014 | US20140284087 Circuit board made of ain with copper structures |
| 09/25/2014 | US20140284086 Vibration-proof material, vibration-proof structure, and vibration-proof method |
| 09/25/2014 | US20140284085 Wholly aromatic polyester amide copolymer resin, polymer film including the wholly aromatic polyester amide copolymer resin, flexible metal-clad laminate including the polymer film, and flexible printed circuit board including the flexible metal-clad laminate |
| 09/25/2014 | US20140284084 Optically diffuse micro-channel |
| 09/25/2014 | US20140284083 Patterned transparent conductors and related manufacturing methods |
| 09/25/2014 | US20140284082 Touchscreen and conductive layer thereof |
| 09/25/2014 | US20140284081 Wiring substrate |
| 09/25/2014 | US20140284080 Printed circuit board and method of mounting integrated circuit packaging component on the same |
| 09/25/2014 | US20140284079 Conductive layer of touch screen |
| 09/25/2014 | US20140284076 Low cost electrical terminals manufactured from conductive loaded resin-based materials |
| 09/25/2014 | US20140283971 Polymeric film substrate for use in radio-frequency responsive tags |
| 09/25/2014 | DE102013204889A1 Leistungsmodul mit mindestens einem Leistungsbauelement Power module with at least one power device |
| 09/25/2014 | DE102012220022B4 Verfahren zur Herstellung einer Spule und elektronisches Gerät A process for producing a coil and electronic device |
| 09/24/2014 | EP2782165A1 Protection apparatus for battery pack, method for manufacturing the protection apparatus, and battery pack having the protection apparatus |
| 09/24/2014 | EP2782123A1 Transfer substrate for forming metal wiring line and method for forming metal wiring line by means of said transfer substrate |
| 09/24/2014 | EP2781144A1 Fabrication of three-dimensional printed circuit board structures |
| 09/24/2014 | EP2781143A1 Embedded metal structures in ceramic substrates |
| 09/23/2014 | USRE45146 Composite multi-layer substrate and module using the substrate |
| 09/23/2014 | US8842952 Optical module |
| 09/23/2014 | US8842442 Electronic system and guide pin device thereof |