| Patents for H05K 1 - Printed circuits (98,583) |
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| 09/18/2014 | US20140262453 Transparent conductive electrodes and their structure design, and method of making the same |
| 09/18/2014 | US20140262452 Embossed micro-structure with cured transfer material method |
| 09/18/2014 | US20140262451 Wiring substrate and manufacturing method thereof |
| 09/18/2014 | US20140262450 Multilayer Printed Circuit Board Structure |
| 09/18/2014 | US20140262449 Apparatus and Method for a Back Plate for Heat Sink Mounting |
| 09/18/2014 | US20140262448 High-frequency signal line, method for producing same, and electronic device |
| 09/18/2014 | US20140262447 Multilayer printed wiring board for mounting semiconductor element |
| 09/18/2014 | US20140262446 Systems and methods for providing surface connectivity of oriented conductive channels |
| 09/18/2014 | US20140262445 Methods and circuit structures for mitigating voltage stresses on printed circuit board (pcb) in high voltage devices |
| 09/18/2014 | US20140262444 Circuitry with high aspect ratio traces |
| 09/18/2014 | US20140262443 Hybrid patterned nanostructure transparent conductors |
| 09/18/2014 | US20140262442 Module and method of manufacturing the same |
| 09/18/2014 | US20140262441 Circuit board with signal routing layer having uniform impedance |
| 09/18/2014 | US20140262440 Multi-layer core organic package substrate |
| 09/18/2014 | US20140262439 Method of manufacturing electrical circuit traces |
| 09/18/2014 | DE102014103548A1 System und Verfahren zum Verwenden einer Referenzebene um eine charakteristische Impedanz einer Übertragungsleitung zu steuern To control a characteristic impedance of a transmission line system and method for using a reference plane |
| 09/18/2014 | DE102013204337A1 Trägerbauteil mit einem Halbleiter-Substrat für elektronische Bauelemente und Verfahren zu dessen Herstellung Carrier component with a semiconductor substrate for electronic components and process for its preparation |
| 09/18/2014 | DE102013102637A1 Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates A metal-ceramic substrate and method for manufacturing a metal-ceramic substrate |
| 09/18/2014 | DE102013102542A1 Elektronisches Bauteil und Verfahren zum Herstellen eines elektronischen Bauteils Electronic component and method for manufacturing an electronic component |
| 09/18/2014 | DE102013004593A1 Semiflexible Leiterplatte Semi-flexible PCB |
| 09/18/2014 | DE102012109820B4 Durch In-Mould-Verfahren hergestellter Körper und Verfahren zu seiner Herstellung Through produced in-mold method body and method for its manufacture |
| 09/17/2014 | EP2779814A2 Flexible lighting device including a protective conformal coating |
| 09/17/2014 | EP2779813A2 Flexible lighting device |
| 09/17/2014 | EP2779812A2 Chip package connector assembly |
| 09/17/2014 | EP2779811A1 Drive circuit device |
| 09/17/2014 | EP2779810A2 Printed circuit board package structure and manufacturing method thereof |
| 09/17/2014 | EP2779809A2 Routing of dual strip lines to reduce crosstalk |
| 09/17/2014 | EP2779808A1 Differential passive equalizer |
| 09/17/2014 | EP2779807A1 Optic for a light source |
| 09/17/2014 | EP2779806A2 Flexible lighting device including a heat-spreading layer |
| 09/17/2014 | EP2779805A1 Method and apparatus pertaining to a cavity-bearing printed circuit board |
| 09/17/2014 | EP2778503A2 LED lighting device with cured structural support |
| 09/17/2014 | EP2778502A2 LED light bulb with structural support |
| 09/17/2014 | EP2777845A1 Method for producing silver conductive film |
| 09/17/2014 | EP2777372A1 Apparatus for making contact with a direction-dependent electrical and/or electronic component, and corresponidng component arrangement |
| 09/17/2014 | EP2777370A2 Printed circuit boards with embedded electro-optical passive element for higher bandwidth transmission |
| 09/17/2014 | EP2777369A1 Method and system for producing circuit boards |
| 09/17/2014 | EP2777368A1 Moulded part for pressing into a circuit board |
| 09/16/2014 | US8837872 Waveguide structures for signal and/or power transmission in a semiconductor device |
| 09/16/2014 | US8837212 Electronic devices including two or more substrates electrically connected together and methods of forming such electronic devices |
| 09/16/2014 | US8837168 Electronic package structure |
| 09/16/2014 | US8837163 Integrated flex tail circuit packaging |
| 09/16/2014 | US8837162 Circuit board socket with support structure |
| 09/16/2014 | US8837161 Multi-configuration processor-memory substrate device |
| 09/16/2014 | US8837160 High-dielectric sheet, a printed circuit board having the high-dielectric sheet and production methods thereof |
| 09/16/2014 | US8837159 Low-profile circuit board assembly |
| 09/16/2014 | US8837155 Mobile terminal |
| 09/16/2014 | US8837150 Electronic device for switching currents and method for producing the same |
| 09/16/2014 | US8837134 Side-push type retractable USB memory stick |
| 09/16/2014 | US8837117 Modular electrical card for power components |
| 09/16/2014 | US8837110 Graphene mounted on aerogel |
| 09/16/2014 | US8836830 Flexible printed circuit board assembly with stiffener and camera module |
| 09/16/2014 | US8836675 Display device to reduce the number of defective connections |
| 09/16/2014 | US8836138 Wiring substrate and semiconductor package |
| 09/16/2014 | US8836114 Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers |
| 09/16/2014 | US8836095 Electronic component package and base of the same |
| 09/16/2014 | US8835944 Lighting device |
| 09/16/2014 | US8835775 Localized skew compensation technique for reducing electromagnetic radiation |
| 09/16/2014 | US8835774 Circuit board assembly and method of assembling circuit boards |
| 09/16/2014 | US8835773 Wiring board and method of manufacturing the same |
| 09/16/2014 | US8835772 Production method of connection structure |
| 09/16/2014 | US8835771 PCB terminal and method for manufacturing the same |
| 09/16/2014 | US8835770 Electronic component and method for manufacturing the same |
| 09/16/2014 | US8835769 High speed serial interface |
| 09/16/2014 | US8835768 Flexible circuit board |
| 09/16/2014 | US8835767 Suspension board with circuit |
| 09/16/2014 | US8835761 Sealing structure |
| 09/16/2014 | US8834957 Preparation method for an electroconductive patterned copper layer |
| 09/16/2014 | US8834747 Compositions containing tin nanoparticles and methods for use thereof |
| 09/16/2014 | US8834729 Method of making bondable printed wiring member |
| 09/16/2014 | US8834207 Methods and apparatus for reducing crosstalk in electrical connectors |
| 09/16/2014 | US8834184 Space and cost efficient incorporation of specialized input-output pins on integrated circuit substrates |
| 09/16/2014 | US8833972 All in one snow crystal-shaped LED module |
| 09/16/2014 | US8833668 Chip card contact array arrangement |
| 09/16/2014 | US8833251 Screen printing device and screen printing method |
| 09/16/2014 | US8832932 Method of mounting an electronic component on a circuit board |
| 09/16/2014 | US8832929 Method of manufacturing a flexible printed circuit board |
| 09/12/2014 | WO2014138465A1 Processing techniques for silicon-based transient devices |
| 09/12/2014 | WO2014138342A1 Compensation networks and communication connectors using said compensation networks |
| 09/12/2014 | WO2014138181A1 Systems and methods for harvesting dissipated heat from integrated circuits (ics) in electronic devices into electrical energy for providing power for the electronic devices |
| 09/12/2014 | WO2014137749A1 Smart phone on a chip and method making same |
| 09/12/2014 | WO2014137646A1 High density, low loss 3-d through-glass inductor with magnetic core |
| 09/12/2014 | WO2014137604A2 Self-locating electronics package precursor structure, method for configuring an electronics package, and electronics package |
| 09/12/2014 | WO2014137002A1 Soldering joint structure of printed circuit board with excellent solder discharge property |
| 09/12/2014 | WO2014136785A1 Copper foil with attached carrier, copper-clad laminate using same, printed circuit board, electronic device, and method for manufacturing printed circuit board |
| 09/12/2014 | WO2014136175A1 Heat-dissipating substrate and method for producing same |
| 09/12/2014 | WO2014135958A1 Method of printing electronic systems on textile substrates |
| 09/12/2014 | WO2014135742A1 Circuit board and a manufacturing method thereon |
| 09/12/2014 | WO2014135373A1 Electronic, optoelectronic or electric arrangement |
| 09/12/2014 | WO2014134809A1 Liquid crystal module and fixing component thereof |
| 09/12/2014 | WO2014134650A2 The invention relates to a method for producing a printed circuit board with multilayer sub-areas in sections |
| 09/11/2014 | US20140256190 Communications Connector with Improved Contacts |
| 09/11/2014 | US20140255709 Laminate, method for producing the same, and method for forming conductive pattern |
| 09/11/2014 | US20140254121 Printed circuit board |
| 09/11/2014 | US20140254120 Device packaging structure and device packaging method |
| 09/11/2014 | US20140254118 Mounting board, sensor unit, electronic apparatus, and moving body |
| 09/11/2014 | US20140254117 Anisotropic conductive film and display apparatus having the same |
| 09/11/2014 | US20140254116 Semiconductor device |
| 09/11/2014 | US20140254114 Flexible circuit board and method for producing same and bend structure of flexible circuit board |
| 09/11/2014 | US20140254113 Method of providing an electronic device structure and related electronic device structures |