| Patents for H05K 1 - Printed circuits (98,583) | 
|---|
| 09/11/2014 | US20140254112 Multi-layered film, electronic device, and manufacturing methods thereof | 
| 09/11/2014 | US20140254110 Electronic device with sensor assembly | 
| 09/11/2014 | US20140254109 Self-locating electronics package precursor structure, method for configuring an electronics package, and electronics package | 
| 09/11/2014 | US20140254108 Thermal isolation in printed circuit board assemblies | 
| 09/11/2014 | US20140254107 Electronic module with embedded jumper conductor | 
| 09/11/2014 | US20140254100 Cooling Apparatus for Fanless Desktop Enclosure of an Elastomericly Suspended Circuit Board | 
| 09/11/2014 | US20140253827 Conductive film, manufacturing method thereof, and touch screen having the same | 
| 09/11/2014 | US20140252612 Wiring substrate for a semiconductor device having differential signal paths | 
| 09/11/2014 | US20140251676 Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition | 
| 09/11/2014 | US20140251675 High speed printed circuit board with uniform via inside diameter | 
| 09/11/2014 | US20140251673 Micro-channel connection method | 
| 09/11/2014 | US20140251672 Micro-channel connection pad | 
| 09/11/2014 | US20140251671 Micro-channel with conductive particle | 
| 09/11/2014 | US20140251670 Module, method for manufacturing the module, and electronic apparatus including the module | 
| 09/11/2014 | US20140251669 Suspended inductor microelectronic structures | 
| 09/11/2014 | US20140251668 Automatic manufacturing process for providing buffer pads for a pcb and pcb structure using the same | 
| 09/11/2014 | US20140251667 Conductive Networks on Patterned Substrates | 
| 09/11/2014 | US20140251666 Laminated body and manufacturing process therefor | 
| 09/11/2014 | US20140251665 Device for storing electromagnetic energy | 
| 09/11/2014 | US20140251664 Circuit substrate | 
| 09/11/2014 | US20140251663 Simultaneous and selective wide gap partitioning of via structures using plating resist | 
| 09/11/2014 | US20140251662 Optically clear conductive adhesive and articles therefrom | 
| 09/11/2014 | US20140251661 Micro-channel structure with variable depths | 
| 09/11/2014 | US20140251660 Variable-depth micro-channel structure | 
| 09/11/2014 | US20140251659 Circuit board, and manufacturing method for circuit board | 
| 09/11/2014 | US20140251658 Thermally enhanced wiring board with built-in heat sink and build-up circuitry | 
| 09/11/2014 | US20140251657 Printed circuit board and method of manufacturing the same | 
| 09/11/2014 | US20140251656 Wiring board and method for manufacturing the same | 
| 09/11/2014 | US20140251655 Stabilization agents for silver nanowire based transparent conductive films | 
| 09/11/2014 | US20140251429 Conductive structure and method for manufacturing same | 
| 09/11/2014 | DE102014203738A1 Elektronisches teil und elektronische steuereinheit Electronic part and electronic control unit | 
| 09/11/2014 | DE102014203737A1 Elektronisches teil und elektronische steuereinheit Electronic part and electronic control unit | 
| 09/11/2014 | DE102014203736A1 Elektronisches teil und elektronische steuereinheit Electronic part and electronic control unit | 
| 09/11/2014 | DE102014203732A1 Elektronisches teil und elektronische steuereinheit Electronic part and electronic control unit | 
| 09/11/2014 | DE102014102944A1 Eine Package-Anordnung und ein Verfahren zur Herstellung einer Package-Anordnung A package assembly and a method of manufacturing a package assembly | 
| 09/11/2014 | DE102013203708A1 Verfahren zur eindeutigen Identifikation von mehrschichtigen Leiterplatten Method for unique identification of multi-layer printed circuit boards | 
| 09/11/2014 | DE102012110322B4 Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates A metal-ceramic substrate and method for manufacturing a metal-ceramic substrate | 
| 09/11/2014 | DE102007005554B4 Demodulator und Verfahren zum Verarbeiten eines PWM-Signals und Smart-Card Demodulator and method for processing a PWM signal, and the smart card | 
| 09/10/2014 | EP2775806A1 Optical receiver and transceiver using the same | 
| 09/10/2014 | EP2775511A1 Semiconductor device and manufacturing method thereof | 
| 09/10/2014 | EP2775375A1 Printed circuit board | 
| 09/10/2014 | EP2774945A1 Thermoplastic liquid crystal polymer film, and laminate and circuit board using same | 
| 09/10/2014 | EP2774461A1 Circuit board made of ain with copper structures | 
| 09/10/2014 | EP2774257A2 Power module and electric device for the combined powering and charging of an accumulator and a motor respectively | 
| 09/10/2014 | EP2774211A1 Device for emc filtering on a printed circuit | 
| 09/09/2014 | US8832344 Baseboard, extension module, and structure for connecting baseboard and extension module | 
| 09/09/2014 | US8831918 System for manufacturing laminated circuit boards | 
| 09/09/2014 | US8830694 Circuit device | 
| 09/09/2014 | US8830693 Planar transformer assemblies for implantable cardioverter defibrillators | 
| 09/09/2014 | US8830691 Printed circuit board and method of manufacturing printed circuit board | 
| 09/09/2014 | US8830690 Minimizing plating stub reflections in a chip package using capacitance | 
| 09/09/2014 | US8830689 Interposer-embedded printed circuit board | 
| 09/09/2014 | US8830688 Wireless signal receiver | 
| 09/09/2014 | US8830687 Lightweight audio system for automotive applications and method | 
| 09/09/2014 | US8830685 Tailorable flexible sheet of monolithically fabricated array of separable cells each comprising a wholly organic, integrated circuit adapted to perform a specific function | 
| 09/09/2014 | US8830684 Cable storage structure of slide components, slide unit, electronic device, and cable storage method | 
| 09/09/2014 | US8830683 Expansion card and motherboard for supporting the expansion card | 
| 09/09/2014 | US8830653 Graphene mounted on aerogel | 
| 09/09/2014 | US8830195 Touch screen panel active matrix organic light emitting diode display device | 
| 09/09/2014 | US8830010 High frequency circuit module with a filter in a core layer of a circuit substrate | 
| 09/09/2014 | US8829776 Light-source circuit unit, illumination device, and display device | 
| 09/09/2014 | US8829557 Light emitting device module and lighting system including the same | 
| 09/09/2014 | US8829537 Integrated apparatus including driver chips, a power supply and LED chips on an isolative substrate | 
| 09/09/2014 | US8829362 Electronic device having member which functions as ground conductor and radiator | 
| 09/09/2014 | US8829361 Wiring board and mounting structure using the same | 
| 09/09/2014 | US8829360 Connector for PV cells and method for its production | 
| 09/09/2014 | US8829359 Electrical device including a functional element in a cavity | 
| 09/09/2014 | US8829358 Z-directed pass-through components for printed circuit boards | 
| 09/09/2014 | US8829357 Wiring board and method for manufacturing the same | 
| 09/09/2014 | US8829356 Packaging substrate having a passive element embedded therein and method of fabricating the same | 
| 09/09/2014 | US8829355 Multilayer printed wiring board | 
| 09/09/2014 | US8828536 Conductive article having silver nanoparticles | 
| 09/09/2014 | US8828525 Flexible printed circuit board integrated with reinforcing plate, and method for manufacturing flexible printed circuit board integrated with reinforcing plate | 
| 09/09/2014 | US8827494 Circuit board support structure having fixed circuit board connection device | 
| 09/09/2014 | US8827493 LED module for lighting | 
| 09/09/2014 | US8826532 Method for reducing crosstalk in electrical connectors | 
| 09/09/2014 | US8826527 Electronic component-embedded printed circuit board and method of manufacturing the same | 
| 09/09/2014 | US8826526 Method of manufacturing multilayer wiring substrate | 
| 09/04/2014 | WO2014134192A1 Methods and apparatus for optimizing electrical interconnects on laminated composite assemblies | 
| 09/04/2014 | WO2014134059A2 Package substrate with testing pads on fine pitch traces | 
| 09/04/2014 | WO2014133991A1 High thermal conductivity prepreg, printed wiring board and multilayer printed wiring board using the prepreg, and semiconductor device using the multilayer printed wiring board | 
| 09/04/2014 | WO2014133890A2 Fused metal nanostructured networks, fusing solutions with reducing agents and methods for forming metal networks | 
| 09/04/2014 | WO2014132114A1 Anti-tamper system based on dual random bits generators for integrated circuits | 
| 09/04/2014 | WO2014131071A2 Semi-finished product for the production of a printed circuit board and method for producing the same | 
| 09/04/2014 | WO2014110480A3 Diplexer design using through glass via technology | 
| 09/04/2014 | WO2014081917A3 Multilayer film including first and second dielectric layers | 
| 09/04/2014 | US20140249034 Superconducting element for superconducting fault current limiter, method for manufacturing superconducting element for superconducting fault current limiter, and superconducting fault current limiter | 
| 09/04/2014 | US20140247610 Light emitting device array and light system | 
| 09/04/2014 | US20140247575 Electronic structure and electronic package component for increasing the bonding strength between inside and outside electrodes | 
| 09/04/2014 | US20140247573 Package substrate with testing pads on fine pitch traces | 
| 09/04/2014 | US20140247572 Printed circuit board | 
| 09/04/2014 | US20140247571 Wiring board with built-in electronic component and method for manufacturing the same | 
| 09/04/2014 | US20140247570 Circuit board structure having electronic components embedded therein and method of fabricating the same | 
| 09/04/2014 | US20140247567 Ejectable component assemblies in electronic devices | 
| 09/04/2014 | US20140247566 Display apparatus | 
| 09/04/2014 | US20140247565 Module, electronic apparatus and moving object | 
| 09/04/2014 | US20140247561 Printed wiring board | 
| 09/04/2014 | US20140247535 Low Passive Inter-Modulation Capacitor | 
| 09/04/2014 | US20140246771 Package substrate, method of manufacturing the package substrate and semiconductor package including the package substrate | 
| 09/04/2014 | US20140246765 Printed wiring board |