Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
09/2014
09/04/2014US20140246226 Method of fabricating copper-nickel micro mesh conductors
09/04/2014US20140246225 Transparent conductive element, input device, electronic apparatus, and master for producing transparent conductive element
09/04/2014US20140246224 Substrate for suspension, and production process thereof
09/04/2014US20140246223 Substrate
09/04/2014DE112012004940T5 Herstellung einer Leiterbahnstruktur und Substrat mit solcher Struktur Production of a conductor track structure and the substrate with such structure
09/04/2014DE102013203498A1 Leistungswandler Power converter
09/04/2014DE102013003542A1 Verfahren zur Herstellung einer funktionalisierten und umgeformten thermoplastischen Kunststofffolie und gemäß diesem Verfahren bearbeitete Kunststofffolie A process for producing a functionalized thermoplastic and the formed plastic film and processed in accordance with this method, plastic film
09/04/2014DE102013003541A1 Verfahren zur Herstellung einer funktionalisierten thermoplastischen Kunststofffolie mit hybriden Schichtstrukturen und gemäß diesem Verfahren bearbeitete Kunststofffolie A process for producing a functionalized thermoplastic plastic film with hybrid layer structures and according to this method machined plastic film
09/04/2014DE102005002508B4 Leiterplatte mit Oxidationsschicht PCB with oxidation layer
09/03/2014EP2773169A1 Circuit board and electronic apparatus provided with same
09/03/2014EP2773168A2 An electrical device
09/03/2014EP2772984A1 Electronic circuit and electronic device
09/03/2014EP2772797A2 Display device
09/03/2014EP2772328A1 Composition for bonding
09/03/2014EP2772123A1 An apparatus and associated methods
09/03/2014EP2772122A1 Gearbox control module with solder bridges or cold contacts between an inserted circuit carrier and a surrounding circuit carrier
09/03/2014EP2771591A1 Vibration damping device for a circuit carrier, and electronic device having a circuit carrier
09/02/2014US8824164 Laminate printed board and manufacturing method thereof
09/02/2014US8824163 RF layered module using three dimensional vertical wiring and disposing method thereof
09/02/2014US8824162 Electronic devices with moisture guiding structures
09/02/2014US8824150 Driving printed circuit board and liquid crystal display device including the same
09/02/2014US8824146 Directly injected forced convection cooling for electronics
09/02/2014US8823659 Method and apparatus for touch panel
09/02/2014US8823361 Electrical current sensor device
09/02/2014US8823187 Semiconductor package, semiconductor package manufacturing method and semiconductor device
09/02/2014US8823021 LED module and lighting device using the same
09/02/2014US8822843 Apparatus and associated methods
09/02/2014US8822841 Package substrate and fabricating method thereof
09/02/2014US8822840 Z-directed printed circuit board components having conductive channels for controlling transmission line impedance
09/02/2014US8822839 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
09/02/2014US8822838 Z-directed printed circuit board components having conductive channels for reducing radiated emissions
09/02/2014US8822837 Wiring board, electronic component embedded substrate, method of manufacturing wiring board, and method of manufacturing electronic component embedded substrate
09/02/2014US8822836 Bonding sheet, electronic circuit device and its manufacturing method
09/02/2014US8822834 Printed circuit board and method of manufacturing the same
09/02/2014US8822833 Touch sensor assembly and method of making the same
09/02/2014US8822832 Epoxy resin composition for printed circuit board, insulating film, prepreg, and multilayer printed circuit board
09/02/2014US8822831 Circuit board
09/02/2014US8822830 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
09/02/2014US8822829 Patterned conductive element
09/02/2014US8822828 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
09/02/2014US8822352 Devices containing carbon nanomaterial electrical interconnects overcoated with metal nitride films and methods for production thereof
09/02/2014US8822323 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
09/02/2014US8822034 Film-forming composition, diffusing agent composition, method for manufacturing film-forming composition, and method for manufacturing diffusing agent composition
09/02/2014US8821793 Sensor substrate and method of fabricating same
09/02/2014US8820232 Screen printing device and screen printing method
08/2014
08/28/2014WO2014130931A1 Strain relief structures for stretchable interconnects
08/28/2014WO2014130928A2 Strain isolation structures for stretchable electronics
08/28/2014WO2014127450A1 Led light
08/28/2014WO2014080963A4 Printed wiring board and printed circuit board
08/28/2014US20140242757 Adhesive for electronic component
08/28/2014US20140240985 Electronic Device With Reduced-Stress Flexible Display
08/28/2014US20140240943 Solder in cavity interconnection technology
08/28/2014US20140240942 Electronic part and electronic control unit
08/28/2014US20140240941 Electronic part and electronic control unit
08/28/2014US20140240940 Electronic component connection structure
08/28/2014US20140240939 Method for producing a microelectronic device
08/28/2014US20140240938 Carrier-less silicon interposer
08/28/2014US20140240934 Multilayer wiring board for an electronic device
08/28/2014US20140240932 Strain isolation structures for stretchable electronics
08/28/2014US20140240929 Heterogeneous thermal interface
08/28/2014US20140240928 Thermal grease having low thermal resistance
08/28/2014US20140240885 Electronic part and electronic control unit
08/28/2014US20140239973 Printed board, electronic control apparatus and inspection method of printed board
08/28/2014US20140238833 Fused metal nanostructured networks, fusing solutions with reducing agents and methods for forming metal networks
08/28/2014US20140238733 Systems and methods for frequency shifting resonance of an unused via in a printed circuit board
08/28/2014US20140238732 Electronic part and electronic control unit
08/28/2014US20140238731 Film constructions for interdigitated electrodes with bus bars and methods of making same
08/28/2014US20140238730 Electroconductive sheet and touch panel
08/28/2014US20140238729 Printed circuit board structure with heat dissipation function
08/28/2014US20140238728 Plastic Film having Lines for a Multi-Modal Input Device and Method for Producing
08/28/2014US20140238727 Transparent Conductive Multilayer Electrode And Associated Manufacturing Process
08/28/2014US20140238725 Method of flattening surface of conductive structure and conductive structure with flattened surface
08/28/2014US20140238724 Fabrication of three-dimensional printed circuit board structures
08/28/2014DE102014203755A1 Elektronisches teil und elektronische steuereinheit Electronic part and electronic control unit
08/28/2014DE102013102540A1 Metall-Keramik-Substrat, Modulanordnung sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates A metal-ceramic substrate, module assembly and method of manufacturing a metal-ceramic substrate
08/27/2014EP2770025A1 Halogen-free low-dielectric resin composition, and prepreg and copper foil laminate made by using same
08/27/2014EP2770024A1 Epoxy resin composition and prepreg and copper clad laminate manufactured by using the same
08/27/2014EP2770005A1 Epoxy resin composition and high frequency electronic-circuit substrate manufactured by using the same
08/27/2014EP2769601A1 System for fast and accurate filling of a two-phase cooling device, notably a heat pipe, adapted for use in an automated process
08/27/2014EP2769477A1 Low-profile wireless connectors
08/26/2014US8818004 Condenser microphone
08/26/2014US8817485 Single-layer component package
08/26/2014US8817480 Seal structure
08/26/2014US8817479 Thin-film transistor forming substrate, semiconductor device, and electric apparatus
08/26/2014US8817478 Communication device and method of coupling electrically circuit boards
08/26/2014US8817458 Flexible circuit board and connection system
08/26/2014US8816711 Electrical probe assembly
08/26/2014US8816707 Misalignment detection devices
08/26/2014US8816218 Multilayer electronic structures with vias having different dimensions
08/26/2014US8816217 Polyimides and fluoropolymer bonding layer with improved copper heat seal strength
08/26/2014US8816216 Encapsulation substrate for organic light emitting diode display and method of manufacturing the encapsulation substrate
08/26/2014US8816215 Disk with an electrical connection element
08/26/2014US8816214 Disk with an electrical connection element
08/26/2014US8816213 Terminal structure, printed wiring board, module substrate, and electronic device
08/26/2014US8816212 Flexible device and fabricating method thereof
08/26/2014US8816211 Articles with photocurable and photocured compositions
08/26/2014US8815334 Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board
08/26/2014US8815161 Gas sensor
08/26/2014US8815126 Method and composition for screen printing of conductive features
08/26/2014US8813356 Method for manufacturing magnetic substrate and common mode filter
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