Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
09/2014
09/23/2014US8842441 Electronic device, electronic system, and circuit board interconnection architecture of the same
09/23/2014US8842440 Printed circuit board and method of manufacturing printed circuit board
09/23/2014US8842432 Arrangement of computing assets in a data center
09/23/2014US8842414 Anchor group for monolayers of organic compounds on metal and component produced therewith by means of organic electronics
09/23/2014US8842083 Touch screen and manufacturing method thereof
09/23/2014US8841978 Electronic component
09/23/2014US8841976 Printed wiring board including first and second insulating layers having dielectric loss tangents that are different by a predetermined relationship
09/23/2014US8841779 Semiconductor device and method of forming high routing density BOL BONL and BONP interconnect sites on substrate
09/23/2014US8841767 Bumping process and structure thereof
09/23/2014US8841561 High performance PCB
09/23/2014US8841560 Backplane slot interconnection system, method and apparatus
09/23/2014US8841559 Copper column
09/23/2014US8841558 Hermetic feedthrough
09/23/2014US8840967 Method for manufacturing printed circuit board including flame retardant insulation layer
09/23/2014US8840408 Crank-shaped board terminal with a protruding support portion
09/23/2014US8840271 In-plane bent printed circuit boards
09/23/2014US8839520 Mounted structure, liquid droplet ejection head, liquid droplet ejection apparatus and manufacturing method
09/23/2014US8839508 Method of making a high frequency device package
09/18/2014WO2014145830A1 Method and apparatus for creating perfect microwave absorbing printed circuit boards
09/18/2014WO2014144590A1 Photonic multi-chip module
09/18/2014WO2014143460A1 Implantable medical device and assembly thereof
09/18/2014WO2014143330A1 Memory module having unified pcb design for ssd applications
09/18/2014WO2014141990A1 Substrate reinforcing structure
09/18/2014WO2014141689A1 Prepreg, metal-clad laminate, and printed circuit board
09/18/2014WO2014141674A1 Printed circuit board with integrated coil, and magnetic device
09/18/2014WO2014141673A1 Printed circuit board with integrated coil, and magnetic device
09/18/2014WO2014141672A1 Magnetic device
09/18/2014WO2014141670A1 Magnetic device
09/18/2014WO2014141669A1 Magnetic device
09/18/2014WO2014141668A1 Magnetic device
09/18/2014WO2014141492A1 Circuit substrate
09/18/2014WO2014140815A1 Stress relief for array-based electronic devices
09/18/2014WO2014139860A1 Optoelectronic component, lighting module and motor vehicle headlight
09/18/2014WO2014139506A1 Flexirigid circuit board
09/18/2014WO2013171788A9 Hybrid resonators in multilayer substrates and filters based on these resonators
09/18/2014US20140275873 Sensor connector
09/18/2014US20140275335 Circuit board
09/18/2014US20140273552 Interconnect architecture with stacked flex cable
09/18/2014US20140273550 Right-angle board-mounted connectors
09/18/2014US20140272316 Transparent substrate having nano pattern and method of manufacturing the same
09/18/2014US20140272113 Gum rosin protective coating and methods of use
09/18/2014US20140268780 Flexible electronic assembly and method of manufacturing the same
09/18/2014US20140268620 Expandable backplane
09/18/2014US20140268619 Method of Manufacturing Substrate for Chip Packages and Method of Manufacturing Chip Package
09/18/2014US20140268618 Printed board, printed board unit, and method of manufacturing printed board
09/18/2014US20140268614 Coupled vias for channel cross-talk reduction
09/18/2014US20140268613 Apparatus for improved power distribution in an electrical component board
09/18/2014US20140268610 Method and system for forming a microvia in a printed circuit board
09/18/2014US20140268608 Component holding structures, system, and method
09/18/2014US20140268607 Methods and Systems For Connecting Inter-Layer Conductors and Components in 3D Structures, Structural Components, and Structural Electronic, Electromagnetic and Electromechanical Components/Devices
09/18/2014US20140268605 Electronic Package Mounting
09/18/2014US20140268604 Methods and Systems For Embedding Filaments in 3D Structures, Structural Components, and Structural Electronic, Electromagnetic and Electromechanical Components/Devices
09/18/2014US20140268603 Area array device connection structures with complimentary warp characteristics
09/18/2014US20140268601 Filter Packaging for System for Wireless, Motion and Position-Sensing, Integrating Radiation Sensor for Occupational and Environmental Dosimetry
09/18/2014US20140268596 Flexible Metal Interconnect Structure
09/18/2014US20140268595 Flexible display device
09/18/2014US20140268594 Method of embedding a pre-assembled unit including a device into a flexible printed circuit and corresponding assembly
09/18/2014US20140268593 Flexible interconnect structure for a sensor assembly
09/18/2014US20140268592 Assembling and Handling Edge Interconnect Packaging System
09/18/2014US20140268591 Printing complex electronic circuits
09/18/2014US20140268589 Circuit board and electronic device provided with same
09/18/2014US20140268587 Module and method of manufacturing the same
09/18/2014US20140268586 Semiconductor package and printed circuit board
09/18/2014US20140268581 Wiring substrate and manufacturing method thereof
09/18/2014US20140268580 Method and apparatus for providing a ground and a heat transfer interface on a printed circuit board
09/18/2014US20140268578 Electronic Device With Heat Dissipating Electromagnetic Interference Shielding Structures
09/18/2014US20140268577 Chip package connector assembly
09/18/2014US20140268574 Component built-in board and method of manufacturing the same, and component built-in board mounting body
09/18/2014US20140268534 Methods of adding dopants to conductive interconnect structures in substrate technologies and structures formed thereby
09/18/2014US20140267998 Flexible cable and liquid crystal display apparatus having the same
09/18/2014US20140267954 Transparent electrode sheet, method for manufacturing transparent electrode sheet, and capacitive touch panel using such transparent electrode sheet
09/18/2014US20140267949 Flexible display module
09/18/2014US20140266549 Printed circuit board package structure and manufacturing method thereof
09/18/2014US20140266515 Coaxial Waveguide Microstructures Having an Active Device and Methods of Formation Thereof
09/18/2014US20140266490 Routing of dual strip lines to reduce crosstalk
09/18/2014US20140266416 On-package multiprocessor ground-referenced single-ended interconnect
09/18/2014US20140266374 Fractional Order Capacitor
09/18/2014US20140265809 Connector devices, systems, and related methods for light emitter components
09/18/2014US20140264857 Package-on-Package with Via on Pad Connections
09/18/2014US20140264835 Semiconductor packages and methods of packaging semiconductor devices
09/18/2014US20140264794 Low cte interposer without tsv structure
09/18/2014US20140264417 Wiring board and light emitting device
09/18/2014US20140262484 Battery holder for an electronic device
09/18/2014US20140262477 Method and Apparatus Pertaining to a Cavity-Bearing Printed Circuit Board
09/18/2014US20140262470 Metal Post Bonding Using Pre-Fabricated Metal Posts
09/18/2014US20140262469 Radio frequency feedthrough
09/18/2014US20140262468 System and Method for an Improved Interconnect Structure
09/18/2014US20140262467 Contact surface for a pin hole
09/18/2014US20140262466 Lowering the Sheet Resistance of a Conductive Layer
09/18/2014US20140262465 Wiring substrate and method of manufacturing the same
09/18/2014US20140262464 Laterally coupled isolator devices
09/18/2014US20140262463 Embedded multilayer ceramic electronic component and printed circuit board having the same
09/18/2014US20140262462 Depositing bulk or micro-scale electrodes
09/18/2014US20140262461 Process for Forming Self-Assembled Monolayer on Metal Surface and Printed Circuit Board Comprising Self-Assembled Monolayer
09/18/2014US20140262460 Connection Component with Posts and Pads
09/18/2014US20140262458 Under ball metallurgy (ubm) for improved electromigration
09/18/2014US20140262457 Porous alumina templates for electronic packages
09/18/2014US20140262456 High aspect ratio traces, circuits, and methods for manufacturing and using the same
09/18/2014US20140262455 Simultaneous and selective wide gap partitioning of via structures using plating resist
09/18/2014US20140262454 Stabilization agents for silver nanowire based transparent conductive films
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