Patents for H05K 1 - Printed circuits (98,583)
10/2014
10/16/2014US20140305692 Terminal block cover
10/16/2014US20140305688 Printed wiring board and printed circuit board
10/16/2014US20140305687 Circuit substrate, electronic device, method of manufacturing electronic device, electronic apparatus, and moving object
10/16/2014US20140305686 Multilayer wiring substrate and module including same
10/16/2014US20140305685 Multilayer Glass Ceramic Substrate with Embedded Resistor
10/16/2014US20140305683 Compact rigid-flexible printed circuit board and method for manufacturing same
10/16/2014US20140305682 Electroconductive stack body and display body employing the same
10/14/2014US8863046 Controlling impedance and thickness variations for multilayer electronic structures
10/14/2014US8861222 Backplane, communication device and communication system
10/14/2014US8861221 Integrated circuit packaging system with a shield and method of manufacture thereof
10/14/2014US8861220 Method for generating an electronic system, method for generating a freeform surface having such a system, and electronic system and freeform surfaces having such a system
10/14/2014US8861219 Printed circuit board for providing operation voltages
10/14/2014US8861218 Device containing plurality of smaller MEMS devices in place of a larger MEMS device
10/14/2014US8861217 Systems and methods for providing vias through a modular component
10/14/2014US8861215 Semiconductor device
10/14/2014US8861205 Folded stacked package and method of manufacturing the same
10/14/2014US8861204 Electrical connector assembly having electrical connector and filter module
10/14/2014US8860905 Liquid crystal display with light emitting diode backlight assembly and liquid crystal display thereof
10/14/2014US8860698 Electro-optical module, power supply substrate, wiring substrate, and electronic apparatus
10/14/2014US8860531 Filter having electrical circuit arrangement with concentrated elements in multi-layer substrates
10/14/2014US8860296 Illumination devices and methods for making the same
10/14/2014US8860205 Method of stiffening coreless package substrate
10/14/2014US8860203 Stretchable base plate and stretchable organic light-emitting display device
10/14/2014US8860048 Three dimensional light emitting diode systems, and compositions and methods relating thereto
10/14/2014US8859912 Coreless package substrate and fabrication method thereof
10/14/2014US8859911 Touch panel comprising conductive pattern
10/14/2014US8859910 Circuit board with signal routing layer having consistent impedance
10/14/2014US8859909 Flexible cable for low profile electrical device
10/14/2014US8859908 Package carrier
10/14/2014US8859907 Method for assembling a circuit board
10/14/2014US8859191 Pattern-forming method, and composition for forming resist underlayer film
10/14/2014US8859077 Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate
10/14/2014US8858865 Silicon nitride substrate manufacturing method, silicon nitride substrate, silicon nitride circuit substrate, and semiconductor module
10/14/2014US8858842 Thick film paste containing bismuth-tellurium-oxide and its use in the manufacture of semiconductor devices
10/14/2014US8858751 Method for producing flexible metal laminate
10/14/2014US8858342 Flexibly configurable button panels for gaming machines
10/14/2014US8858238 Compression connector configured with three housing for retaining terminals there between
10/14/2014US8858034 Apparatus and method for thermal dissipation in a light
10/14/2014US8858007 Display devices, and display and electronic systems including the display devices
10/14/2014US8857045 Method of assembling a circuit board assembly
10/09/2014WO2014165761A1 Reduced length memory card
10/09/2014WO2014165488A1 Routing and shielding of signal lines to improve isolation
10/09/2014WO2014165371A1 Electrochemical cell including an integrated circuit
10/09/2014WO2014165369A1 Electrochemical cell including an integrated circuit
10/09/2014WO2014165368A1 Electrochemical cell including an integrated circuit
10/09/2014WO2014164215A1 Thermal isolation in printed circuit board assemblies
10/09/2014WO2014162685A1 Printed circuit board
10/09/2014WO2014162255A1 High modulus laser direct structuring polycarbonate composites with enhanced plating performance and broad laser window and methods for the manufacture and use thereof
10/09/2014WO2014161680A1 Optoelectronic assembly and method for producing an optoelectronic assembly
10/09/2014WO2014161245A1 Bonding finger and touchscreen
10/09/2014WO2014161020A1 Method for producing a circuit board element
10/09/2014US20140302333 Thick film conductive inks for electronic devices
10/09/2014US20140302292 Inkjet printed electronic device
10/09/2014US20140301125 Printed circuit board and memory module including the same
10/09/2014US20140301093 Product packaging
10/09/2014US20140301058 Wiring substrate and semiconductor device
10/09/2014US20140301057 Power converters with integrated capacitors
10/09/2014US20140301056 Method and System for Optimizing Routing Layers and Board Space Requirements for a Ball Grid Array Land Pattern
10/09/2014US20140301054 Wiring board for having light emitting element mounted thereon
10/09/2014US20140301053 Multilayer ceramic substrate and electronic component using same
10/09/2014US20140301050 Substrate assembly, method of manufacturing substrate assembly and method of manufacturing chip package
10/09/2014US20140301047 Circuit board and electronic device
10/09/2014US20140301042 Manufacturing of a heat sink by wave soldering
10/09/2014US20140300836 Conductive structure body and method for manufacturing the same
10/09/2014US20140300001 Printed circuit board and manufacturing method thereof, and semiconductor package including the printed circuit board
10/09/2014US20140299368 Contact pin
10/09/2014US20140299367 Component-Embedded Substrate Manufacturing Method and Component-Embedded Substrate Manufactured Using the Same
10/09/2014US20140299366 Hot melt ink composition, method for preparing a hot melt ink composition and use thereof
10/09/2014US20140299365 Flexible touch sensor with fine pitch interconnect
10/09/2014US20140299364 Electrically conductive article with high optical transmission
10/09/2014US20140299363 Structure of via hole of electrical circuit board and manufacturing method thereof
10/09/2014US20140299362 Stretchable electric device and manufacturing method thereof
10/09/2014US20140299361 Conductive sheet and touch panel
10/09/2014US20140299360 Conductive sheet and method for fabricating the same
10/09/2014US20140299359 Structures with surface-embedded additives and related manufacturing methods
10/09/2014US20140299358 Multilayer circuit substrate
10/09/2014US20140299357 Conductive sheet and touch panel
10/09/2014US20140299356 Protective film with dye materials for laser absorption enhancement for via drilling
10/09/2014DE102014204729A1 Dickschicht-Leitfähigkeitstinten für Elektronikvorrichtungen Thick-film conductivity inks for electronics devices
10/09/2014DE102013205998A1 Optoelektronische Baugruppe und Verfahren zum Herstellen einer optoelektronischen Baugruppe The optoelectronic assembly and method of making an optoelectronic assembly
10/08/2014EP2787101A1 Electrolysis copper alloy foil and electrolysis copper alloy foil with carrier foil
10/08/2014EP2786645A1 Method of providing an electronic device structure and related electronic device structures
10/08/2014EP2786644A2 Transient devices designed to undergo programmable transformations
10/08/2014EP2786189A1 Optical fiber connector assembly with printed circuit board stabilization features
10/07/2014US8856717 Shielded pattern generation for a circuit design board
10/07/2014US8855456 Mounting devices for optical devices, and related sub-assemblies, apparatuses, and methods
10/07/2014US8854833 Serial advanced technology attachment dual in-line memory module
10/07/2014US8854830 Semiconductor package substrate in particular for MEMS devices
10/07/2014US8854826 Suspension board with circuit
10/07/2014US8854570 Light-emitting device for liquid crystal display apparatus and liquid crystal display apparatus
10/07/2014US8854123 On-package multiprocessor ground-referenced single-ended interconnect
10/07/2014US8853866 Semiconductor device and stacked-type semiconductor device
10/07/2014US8853864 Semiconductor device and a method of manufacturing the same
10/07/2014US8853848 Interconnection structure, apparatus therewith, circuit structure therewith
10/07/2014US8853728 LED mounting substrate and method of manufacturing the same
10/07/2014US8853561 Printed wiring board with improved corrosion resistance and yield
10/07/2014US8853560 Electromagnetic bandgap structure and printed circuit board
10/07/2014US8853559 Insulation circuit board, and power semiconductor device or inverter module using the same
10/07/2014US8853558 Interconnect structure
10/07/2014US8853557 Wiring board and mount structure
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