Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
11/2014
11/06/2014US20140326487 Flexible metal-cladded base material, method for producing flexible metal-cladded base material, printed wiring board, multilayer flexible printed wiring board, and flex-rigid printed wiring board
11/06/2014US20140326486 Printed circuit board
11/06/2014US20140326485 Printed circuit board with shallow solder pad and method for manufacturing the same
11/06/2014US20140326484 Shield Film, Shielded Printed Wiring Board, And Method for Manufacturing Shield Film
11/06/2014US20140326483 Printed circuit boards fabricated using congruent molds
11/06/2014US20140325995 Composite structure
11/04/2014US8880179 Vision regeneration assist apparatus and implantable apparatus
11/04/2014US8880165 Biocompatible bonding method and electronics package suitable for implantation
11/04/2014US8879276 Flexible circuit assembly and method thereof
11/04/2014US8879274 Method of manufacturing an electrical component
11/04/2014US8879273 Mobile terminal and casing connecting structure
11/04/2014US8879272 Multi-part substrate assemblies for low profile portable electronic devices
11/04/2014US8879235 Multilayered ceramic capacitor and mounting structure of circuit board having multilayered ceramic capacitor mounted thereon
11/04/2014US8879211 Suspension substrate, suspension, head suspension, hard disk drive, and method for manufacturing suspension substrate
11/04/2014US8878470 Methods and apparatus for reducing size and costs of motor controllers for electric motors
11/04/2014US8878353 Structure for microelectronic packaging with bond elements to encapsulation surface
11/04/2014US8878339 Chip-component structure and method of producing same
11/04/2014US8878228 Method for producing large lighting with power LED
11/04/2014US8878200 Light emitting package having a guiding member guiding an optical member
11/04/2014US8878078 Printed wiring board
11/04/2014US8878077 Wiring substrate and method of manufacturing the same
11/04/2014US8878076 Wiring substrate and manufacturing method for wiring substrate
11/04/2014US8878075 Connecting structure and a display device with said connecting structure
11/04/2014US8878074 Multi-level circuit board for high-frequency applications
11/04/2014US8878073 Printed circuit board and methods of manufacturing the same
11/04/2014US8878072 High reliability fluid-tight low-profile electrically conductive interconnects for large scale frame attachment
11/04/2014US8878071 Integrated device with defined heat flow
11/04/2014US8878070 Wiring board and method of manufacturing a semiconductor device
11/04/2014US8878064 Flexible printed circuit board
11/04/2014US8877878 Epoxy resin composition with sulfonium borate complex
11/04/2014US8877866 Curable epoxy resin compositions having improved adhesion to metal substrates and processes for making and using the same
11/04/2014US8877843 Resin composition and method for producing circuit board
11/04/2014US8877427 Photosensitive resin composition and circuit board with metal support using the same
11/04/2014US8876996 Method for the manufacture of double-sided metalized ceramic substrates
11/04/2014US8876548 Rack unit outlet spacing for power outlet units
11/04/2014US8876414 Optical communication module and method of manufacturing the same
11/04/2014US8876356 Illumination device and display device
11/04/2014US8876350 Light source device and display device provided with same
11/04/2014US8876274 Pattern forming method
11/04/2014US8875363 Thin film capacitors on metal foils and methods of manufacturing same
10/2014
10/30/2014US20140323968 Materials, electronic systems and modes for active and passive transience
10/30/2014US20140322984 Printed circuit board having improved characteristic impedance
10/30/2014US20140322868 Barrier layer on bump and non-wettable coating on trace
10/30/2014US20140322545 Resin composition, prepreg, and substrate employing the same
10/30/2014US20140322541 Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same
10/30/2014US20140321815 Optical connector and circuit board of same
10/30/2014US20140321091 Package substrate with high density interconnect design to capture conductive features on embedded die
10/30/2014US20140321090 Device for assembling capacitors for an electronic converter
10/30/2014US20140321089 Method of making an electronic device having a liquid crystal polymer solder mask and related devices
10/30/2014US20140321087 Integrated circuit package substrate
10/30/2014US20140321086 Component-embedded substrate
10/30/2014US20140321085 Component-embedded substrate
10/30/2014US20140321084 Printed circuit board including electronic component embedded therein and method for manufacturing the same
10/30/2014US20140321080 Electrical socket
10/30/2014US20140321076 Resin multilayer substrate
10/30/2014US20140321075 Electrical and mechanical interconnection for electronic components
10/30/2014US20140321073 Flexible display and fixing method thereof
10/30/2014US20140321072 Electronic device with folded display
10/30/2014US20140321071 Printed circuit board, display device and method of manufacturing printed circuit board
10/30/2014US20140321069 High-frequency module
10/30/2014US20140321066 Memory connection structure of storage device
10/30/2014US20140321065 Dc-dc converter
10/30/2014US20140321062 Heat sink
10/30/2014US20140321011 Esd protection mechanism for an hvac controller
10/30/2014US20140320147 Electrical circuit
10/30/2014US20140319200 Method of mounting electronic part, circuit substrate, and image forming apparatus
10/30/2014US20140318850 Printed circuit board and method of mounting components on the printed circuit board
10/30/2014US20140318849 Flat circuit body with terminal and manufacturing method thereof
10/30/2014US20140318848 Wiring board and fabrication method therefor
10/30/2014US20140318847 Multilayer wiring substrate
10/30/2014US20140318846 Wiring substrate and method for producing wiring substrate
10/30/2014US20140318845 Multilayer ceramic electronic component and board for mounting the same
10/30/2014US20140318844 Multilayer ceramic electronic component and mounting board therefor
10/30/2014US20140318843 Multilayer ceramic electronic component and mounting board therefor
10/30/2014US20140318842 Multilayer ceramic electronic component and board for mounting the same
10/30/2014US20140318841 Multilayered ceramic electronic component and board for mounting the same
10/30/2014US20140318840 Stacked structure and manufacturing method of the same
10/30/2014US20140318839 Epoxy resin compound and radiant heat circuit board using the same
10/30/2014US20140318838 Method of repairing probe board and probe board using the same
10/30/2014US20140318837 Circuit board interconnection structure and circuit board interconnection method
10/30/2014US20140318836 Conductive glass substrate and preparation method thereof
10/30/2014US20140318835 Epoxy resin compound and radiant heat circuit board using the same
10/30/2014US20140318834 Wiring board and method for manufacturing the same
10/30/2014US20140318833 Attenuation reduction grounding pattern structure for connection pads of flexible circuit board
10/30/2014US20140318832 Fabrication method of a rigid-flexible circuit board and rigid-flexible printed circuit board
10/30/2014US20140318831 Power module substrate, power module substrate with heat sink, power module, paste for forming flux component intrusion-preventing layer and method for bonding bonded body
10/30/2014US20140318830 Power electronics assemblies, insulated metal substrate assemblies, and vehicles incorporating the same
10/30/2014US20140318829 Printed wiring boards having thermal management features and thermal management apparatuses comprising the same
10/30/2014US20140318698 Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof
10/28/2014USRE45215 Integrated transceiver with lightpipe coupler
10/28/2014USRE45214 Integrated transceiver with lightpipe coupler
10/28/2014US8873265 Semiconductor memory system
10/28/2014US8873249 DIMM riser care with an angled DIMM socket and a straddle mount DIMM socket
10/28/2014US8873248 Decoration plate and electronic apparatus having the same
10/28/2014US8873246 Electronic device, wiring board, and method of shielding noise
10/28/2014US8873245 Embedded chip-on-chip package and package-on-package comprising same
10/28/2014US8873238 Chassis system and method for holding and protecting electronic modules
10/28/2014US8872600 High frequency circuit module with a filter disposed in a core layer of a circuit substrate
10/28/2014US8872334 Method for manufacturing semiconductor device
10/28/2014US8872333 System and method for integrated waveguide packaging
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