Patents for H05K 1 - Printed circuits (98,583)
07/2014
07/08/2014US8772648 Method for manufacturing printed wiring board and printed wiring board
07/08/2014US8772647 Single-cap via-in-pad and methods for forming thereof
07/08/2014US8772646 Printed wiring board and method for manufacturing printed wiring board
07/08/2014US8772645 Touch panel and display device including same
07/08/2014US8772644 Carrier with three-dimensional capacitor
07/08/2014US8772643 Multilayer wiring substrate, and method of manufacturing the same
07/08/2014US8771459 Method of encapsulating an electronic arrangement
07/08/2014CA2522694C Printed circuit device with integrated antenna and implantable sensor processing system with integrated printed circuit board antenna
07/04/2014DE202014101340U1 Heizkreis Heating circuit
07/03/2014WO2014105887A1 Parasitic inductance reduction circuit board layout designs for multilayered semiconductor devices
07/03/2014WO2014105121A1 Multi-channel memory module
07/03/2014WO2014104860A1 Flexible printed circuit board and method for manufacturing same
07/03/2014WO2014104739A1 Epoxy resin composition having excellent adhesive properties and resin composite copper foil using same
07/03/2014WO2014104737A1 Low-viscosity metal ink composition, and printed circuit board using same
07/03/2014WO2014104654A1 Printed circuit board, and method for manufacturing same
07/03/2014WO2014104559A1 Led heat-dissipation flexible module using carbon fiber substrate and method for manufacturing same
07/03/2014WO2014104543A1 Resin composition and metal core laminate comprising same
07/03/2014WO2014104328A1 Layered body with support substrate, method for fabricating same, and method for fabricating multi-layer wiring substrate
07/03/2014WO2014104300A1 Wiring board, electronic device, and light-emitting device
07/03/2014WO2014104233A1 Low spring-back electrolytic copper foil, and circuit board and flexible circuit board using said electrolytic copper foil
07/03/2014WO2014104053A1 Conductive paste for screen printing, method for producing wiring line, and method for producing electrode
07/03/2014WO2014103965A1 Substrate for power module, substrate for power module having metal member, power module having metal member, method for manufacturing substrate for power module, method for manufacturing substrate for power module having metal member
07/03/2014WO2014103896A1 Electrode forming paste
07/03/2014WO2014103706A1 Copper foil with carrier, and printed wiring board, printed circuit board and copper-clad laminate, using same
07/03/2014WO2014103637A1 Adhesive agent, adhesive film, and semiconductor device and method for manufacturing same
07/03/2014WO2014103541A1 Electronic component and method for manufacturing same
07/03/2014WO2014103509A1 Circuit board and electronic apparatus
07/03/2014WO2014102054A1 Conductor track arrangement and method for the production thereof
07/03/2014WO2014101050A1 Electronic component, power amplifier, and transceiver
07/03/2014WO2014100848A1 Semi-finished product for the production of a printed circuit board and method for producing the same
07/03/2014WO2014100845A1 Printed circuit board
07/03/2014US20140187687 Insulation materials, insulation composition comprising the same, and substrate using the same
07/03/2014US20140187679 Resin composition with good workability, insulating film, and prepreg
07/03/2014US20140187112 Prepreg, method for manufacturing the same, and copper clad laminate using the same
07/03/2014US20140186651 Printed circuit board having copper plated layer with roughness and method of manufacturing the same
07/03/2014US20140186593 Resin composition for printed circuit board, insulating film, prepreg, and printed circuit board
07/03/2014US20140186587 Transparent conductor and apparatus including the same
07/03/2014US20140186581 Primer-coated copper foil having superior adhesive strength and method for producing the same
07/03/2014US20140185260 Nanostructured electrolytic energy storage devices
07/03/2014US20140185259 Packaging substrate, method for manufacturing same, and chip packaging structure having same
07/03/2014US20140185258 Substrate embedding passive element
07/03/2014US20140185257 Printed circuit board with embedded component and method for manufacturing same
07/03/2014US20140185256 Method of manufacturing module and module
07/03/2014US20140185254 Printed circuit board and method of manufacturing the same
07/03/2014US20140185253 Miniature High Density Opto-Electronic Package
07/03/2014US20140185249 Wireless module
07/03/2014US20140185248 Module board
07/03/2014US20140185245 Switching circuit layout with heatsink
07/03/2014US20140185244 Thermally conductive film and circuit board module
07/03/2014US20140185217 Printed circuit board, design method thereof and mainboard of terminal product
07/03/2014US20140184782 System of measuring warpage and method of measuring warpage
07/03/2014US20140182920 Wiring substrate
07/03/2014US20140182919 Printed circuit board and method for manufacturing the same
07/03/2014US20140182918 Method of manufacturing module and terminal assembly
07/03/2014US20140182917 Method for forming cavity, apparatus for forming cavity, method for manufacturing circuit board, and circuit board
07/03/2014US20140182916 Circuit board and method of manufacturing the same
07/03/2014US20140182915 Circuit board and method for manufacturing the same
07/03/2014US20140182914 Universal serial bus hybrid footprint design
07/03/2014US20140182913 Packaging substrate and method of fabricating the same
07/03/2014US20140182912 Packaging substrate
07/03/2014US20140182911 Printed circuit board including embedded electronic component and method for manufacturing the same
07/03/2014US20140182910 Multilayer ceramic capacitor and mounting board therefor
07/03/2014US20140182909 Heat transfer device for wave soldering
07/03/2014US20140182908 Epoxy resin composition for insulating film, insulating film, and printed circuit board having the same
07/03/2014US20140182907 Embedded multilayer ceramic electronic component and printed circuit board having embedded multilayer ceramic electronic component
07/03/2014US20140182906 Interposer and packaging substrate having the interposer
07/03/2014US20140182905 Printed circuit board and surface treatment method of printed circuit board
07/03/2014US20140182904 Printed circuit board and method for manufacturing the same
07/03/2014US20140182903 Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board
07/03/2014US20140182902 Circuit board with signal routing layer having uniform impedance
07/03/2014US20140182901 Room Temperature Low Contact Pressure Method
07/03/2014US20140182900 Rigid-flex printed circuit board and method for making same
07/03/2014US20140182899 Rigid-flexible printed circuit board and method for manufacturing same
07/03/2014US20140182898 Printed Circuit Board and Control Device for a Vehicle Transmission Comprising the Printed Circuit Board
07/03/2014US20140182897 Circuit board and method of manufacturing the same
07/03/2014US20140182896 Substrate having electronic component embedded therein and method of manufacturing the same
07/03/2014US20140182895 Multilayered substrate and method of manufacturing the same
07/03/2014US20140182893 Printed circuit board
07/03/2014US20140182892 Printed circuit board with embedded component and method for manufactruing same
07/03/2014US20140182891 Geometrics for improving performance of connector footprints
07/03/2014US20140182890 Electrical cable assembly
07/03/2014US20140182889 Multilayered substrate
07/03/2014US20140182888 Touch panel
07/03/2014US20140182887 Three-dimensional structure for wiring formation
07/03/2014US20140182674 Transparent conductive film, method of producing the same, flexible organic electronic device, and organic thin-film solar battery
07/03/2014DE102013227223A1 Complex adhesive boundary apparatus for touch sensor has flexible printed circuit (FPC) in which portion extends through channel perpendicular to cover panel inner surface, and parallel to gasket seal inner surface
07/03/2014DE102013111765A1 Vorrichtung zum Verhindern eines Leiterbahnbreitendefekts und Verfahren zum Verhindern eines Leiterbahnbreitendefekts An apparatus for preventing a line width defect, and method for preventing a line width defect
07/03/2014DE102009044368B4 Kühlanordnung Cooling arrangement
07/03/2014DE102004048529B4 Elektronisches Gerät mit Halbleiterchip, der über eine Lötmittelschicht mit einem metallischen Leiterteil flächig verbunden ist An electronic device having the semiconductor chip, which is connected via a solder layer surface with a metallic conductor portion
07/02/2014EP2750490A1 Component-mounting printed circuit board and manufacturing method for same
07/02/2014EP2750488A1 Method for printing thin metal layers in a ceramic layer structure and electronic components contained therein
07/02/2014EP2750487A1 Electronic component and printed circuit board with RFID tag
07/02/2014EP2750148A1 Magnetic metal substrate and inductance element
07/02/2014EP2749155A2 Wiring board in which a component is mounted
07/02/2014EP2749154A1 Metal clad circuit board
07/02/2014EP2749153A1 Electronic textile with means for facilitating waste sorting
07/02/2014EP2749152A1 Electromagnetic interference shielding techniques
07/02/2014CN203691831U 一种电源模块印刷电路板及其形成的系统 A power supply module printed circuit board and the formation of the system
07/02/2014CN203691758U 一种柔性印刷线路板 A flexible printed circuit board
07/02/2014CN203691757U 一种印制板 One kind of PCB
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