Patents for H05K 1 - Printed circuits (98,583)
07/2014
07/23/2014CN203734916U 基于控制边沿表贴sma连接器走线 Traces the edge of the table based on the control stick sma connectors
07/23/2014CN203734915U 铝镁合金嵌埋式线路板 Aluminum-magnesium alloy embedded style board
07/23/2014CN203734914U 高导热的陶瓷铝复合基板及给铝板热镀锡的超声波设备 High thermal conductivity of aluminum composite ceramic substrate and heat to the aluminum tin ultrasonic equipment
07/23/2014CN203734913U 一种离型阻隔膜 One kind of barrier film release
07/23/2014CN203734912U 叠层式万用电路板 Universal laminated board
07/23/2014CN203734911U 数字信号调制器中频板 IF board digital signal modulator
07/23/2014CN203734910U 一种柔性线路板 A flexible circuit board
07/23/2014CN203734632U 一种适用于高压霍尔电压传感器的电磁干扰滤波器 A high voltage applied to electromagnetic interference filters Hall voltage sensor
07/23/2014CN203734554U 一种具有pcb集成型变压器的开关电源模块 Switching power supply module having an integrated transformer pcb
07/23/2014CN103947307A 布线电路、布线基板及布线基板的制造方法 The method of manufacturing a wiring circuit, the wiring substrate and the wiring substrate
07/23/2014CN103947306A 包覆金属的柔性基材、用于制备包覆金属的柔性基材的方法、印刷线路板、多层柔性印刷线路板和柔性-刚性印刷线路板 Flexible substrate coated with metal, the method for the preparation of flexible substrates coated metals, printed circuit boards, multilayer flexible printed circuit boards and flexible - rigid printed circuit boards
07/23/2014CN103946927A 导电性组合物和导电膜 Electrically conductive composition and the conductive film
07/23/2014CN103946426A 表面处理铜箔、使用了它的层叠板、印刷布线板以及覆铜板 Surface-treated copper foil, the use of its laminated boards, printed wiring boards and laminates
07/23/2014CN103946425A 表面处理铜箔及使用了它的层叠板 And surface-treated copper foil laminated board using its
07/23/2014CN103946263A 使用环氧树脂组合物的绝缘材料 Insulating materials of the epoxy resin composition
07/23/2014CN103946021A 覆金属层压板及印刷线路板 Metal-clad laminates and printed circuit boards
07/23/2014CN103945646A 一种电路板 A circuit board
07/23/2014CN103945645A 一种电磁感应式天线板及其制作方法 An electromagnetic induction type antenna board and its manufacturing method
07/23/2014CN103945644A 齐平线路板及其制作方法 Flush with the board and its manufacturing method
07/23/2014CN103945643A 一种透明电路膜片及其制备方法 A transparent circuit membrane and preparation method
07/23/2014CN103945642A 布线电路基板及其制造方法 The method of manufacturing a wiring circuit board and
07/23/2014CN103945641A 高导热线路板及其制作方法 High thermal circuit board and manufacturing method thereof
07/23/2014CN103945640A 防静电线路板及其制作方法 Anti-static board and its production method
07/23/2014CN103945639A 一种pcb保护片层及其生产工艺 One kind of protective sheet layer pcb and its production process
07/23/2014CN103945638A 系统级封装中的多层复合媒质基板 System-level package substrate multilayer composite medium
07/23/2014CN103945637A 印刷电路板装置 A printed circuit board apparatus
07/23/2014CN103945636A 用于实施嵌入式混合电-光pcb构造的结构和方法 Structure and method of light pcb structure - for the implementation of embedded hybrid electric
07/23/2014CN103945635A 超薄油墨保护膜及其制造方法 Ultra-thin protective film of ink and its manufacturing method
07/23/2014CN103945634A 柔性电路板和具有该柔性电路板的照明装置 A flexible circuit board and an illumination device having the flexible circuit board
07/23/2014CN103944006A 改进的线缆组件及电路板 Improved cable assemblies and circuit boards
07/23/2014CN103943651A 一种oled显示装置及相应的柔性电路板 Oled one kind of display device and the corresponding flexible circuit board
07/23/2014CN103943585A 主板及其芯片封装模块和母板 Motherboard and chip package module and motherboard
07/23/2014CN103943034A 一种半导体的组件 A semiconductor component
07/23/2014CN103937157A 无卤树脂组合物及采用其制造半固化片及层压板的方法 Halogen-free resin composition and the use thereof and a method of manufacturing a prepreg laminate
07/23/2014CN102573292B 一种内埋置电阻器的印刷电路板及其制造方法 An internal resistor embedded printed circuit board and its manufacturing method
07/23/2014CN102548189B 电路板的特性阻抗精度控制结构 Accuracy of the impedance characteristics of the circuit board control structure
07/23/2014CN102301836B 产生印制或涂布功能件用基板的方法、基板、功能装置及其用途 Printing or coating a functional element produced by the method of the substrate, the substrate, functional devices and use thereof
07/23/2014CN102203504B 用于制造柔性的发光带的方法 The method of manufacturing a flexible light-emitting zone for
07/23/2014CN102149542B 高导热性聚酰亚胺膜、高导热性覆金属层合体及其制造方法 Highly heat conductive polyimide film, a highly heat conductive metal-clad laminate and manufacturing method thereof
07/23/2014CN102120920B 各向异性导电粘性复合物和膜,及电路连接结构 A conductive adhesive and an anisotropic composite membrane, and circuit connection structure
07/23/2014CN102076166B 多层印刷电路板以及具有该印刷电路板的液晶显示设备 The multilayer printed circuit board and the printed circuit board having a liquid crystal display apparatus
07/23/2014CA2838641A1 Led light
07/22/2014US8787034 Co-support system and microelectronic assembly
07/22/2014US8787033 Electronic component and electronic device
07/22/2014US8787032 Enhanced stacked microelectronic assemblies with central contacts
07/22/2014US8787028 Terminal structure, printed circuit board, module board, electronic device, and method for manufacturing terminal structure
07/22/2014US8787025 Electronic module with improved latch mechanism
07/22/2014US8786514 System and method for payload enclosure
07/22/2014US8786510 Radio frequency (RF) antenna containing element and methods of making the same
07/22/2014US8785791 Through wiring substrate and manufacturing method thereof
07/22/2014US8785790 High strength through-substrate vias
07/22/2014US8785789 Printed circuit board and method for manufacturing the same
07/22/2014US8785788 Wiring board with built-in electronic component and method for manufacturing the same
07/22/2014US8785787 Metal-based circuit board
07/22/2014US8785786 Wiring board and method of manufacturing the same
07/22/2014US8785785 Ceramic circuit board and process for producing same
07/22/2014US8785784 Methods and apparatus for optimizing structural layout of multi-circuit laminated composite assembly
07/22/2014US8785783 Protective cover for a flexible printed circuit board
07/22/2014US8784931 ULSI wiring and method of manufacturing the same
07/22/2014US8784682 Thermosetting composition and printed circuit board using the same
07/22/2014US8782882 Method of manufacturing multi-layer printed circuit board
07/17/2014WO2014110068A1 Substrate for mounting electrical connector
07/17/2014US20140199533 Adhesive film, multilayer printed wiring board using adhesive film, and method for manufacturing multilayer printed wiring board
07/17/2014US20140198471 Connecting system of circuit boards
07/17/2014US20140198470 Printed circuit board stack
07/17/2014US20140198469 Electronic circuit, light source device, and method of manufacturing electronic circuit
07/17/2014US20140198467 Electrical junction box
07/17/2014US20140198465 Display device
07/17/2014US20140198464 Frame structure for preventing deformation, and electronic device including the same
07/17/2014US20140198463 Printed circuit board and magnetic field or current sensor
07/17/2014US20140198462 Display panel integrating a driving circuit
07/17/2014US20140198269 Transparent conductive substrate and method for manufacturing same
07/17/2014US20140198264 Metal mesh conductive layer and touch panel having the same
07/17/2014US20140196941 Optimized via cutouts with ground references
07/17/2014US20140196940 Through mold via relief gutter on molded laser package (mlp) packages
07/17/2014US20140196939 Wiring board
07/17/2014US20140196937 Multi-layered capacitor and circuit board mounted with multi-layered capacitor
07/17/2014US20140196936 Multilayer ceramic capacitor, mounting board therefor, and manufacturing method thereof
07/17/2014US20140196935 Ceramic substrate and process for producing same
07/17/2014US20140196934 Wiring substrate and electronic device
07/17/2014US20140196933 Method for fabricating thin sheets of glass
07/17/2014US20140196540 Two-axis vertical mount package assembly
07/17/2014DE102013200697A1 Verfahren zur Herstellung von strukturierten elektrischen Trägermaterialien A process for producing patterned electrical carrier materials
07/17/2014DE102013200652A1 Vorrichtung zum Schalten hoher Ströme Apparatus for switching high currents
07/17/2014DE102013200635A1 Vorrichtung zur Aufnahme von Elektronikbauteilen An apparatus for receiving electronic components
07/17/2014DE102013200354A1 Verfahren und Vorrichtung zum Herstellen eines Multilagenelektrodensystems Method and apparatus for manufacturing a multilayer electrode system
07/16/2014EP2755458A2 Circuit board and flat panel display including the same
07/16/2014EP2755457A1 Printed circuit board and manufacturing method of printed circuit board
07/16/2014EP2755456A1 Assembly having a flexible circuit board and a heat sink
07/16/2014EP2754340A2 Conductor track unit for a motor vehicle
07/16/2014EP2754339A1 Printed circuit board and magnetic field or current sensor
07/16/2014EP2754338A1 Current sensor and printed circuit board for this sensor
07/16/2014EP2754337A1 Terminal unit with security features
07/16/2014EP2753867A2 An led lighting apparatus, a method for manufacturing the same and an led advertisement module having the led lighting apparatus
07/16/2014EP2753589A1 Low dielectric glass and fiber glass
07/16/2014CN203722930U 电路板导电组件 Circuit board conductive components
07/16/2014CN203722929U 结构化高压电子脉冲探测器 Structured high-voltage electronic pulse detector
07/16/2014CN203722928U 印制电路板的集成电路芯片封装结构 An integrated circuit chip packaging structure of the printed circuit board
07/16/2014CN203722927U 一种邮票孔连接避免断板及分板困难的线路板系统 One kind of stamp-hole connector off the board and to avoid the difficulties of the circuit board sub-board system
07/16/2014CN203722926U 一种ptfe材质的pcb板 One kind of material ptfe pcb board
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