Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
10/2014
10/28/2014US8872300 Light emitting device module
10/28/2014US8872198 Luminaire and light-emitting apparatus with light-emitting device
10/28/2014US8872041 Multilayer laminate package and method of manufacturing the same
10/28/2014US8872040 Wiring structure and manufacturing method thereof, and electronic apparatus and manufacturing method thereof
10/28/2014US8872039 Conductive element and method for producing the same, wiring element, information input device, display device, electronic apparatus, and master
10/28/2014US8872038 Anisotropic conductor, method of producing the same, and anisotropic conductor-arranged sheet
10/28/2014US8872037 Circuit board assembly with flexible circuit board and reinforcing plate
10/28/2014US8872032 Bundled flexible flat circuit cable
10/28/2014US8871660 Laminated body, circuit board including laminated body, semiconductor package and process for manufacturing laminated body
10/28/2014US8871641 Low resistance through-wafer via
10/28/2014US8870592 Socket and device having the socket
10/28/2014US8870472 Computer program product for electro-optical assembly
10/28/2014US8869624 In-situ monitoring device and method to determine accumulated printed wiring board vibration stress fatigue
10/28/2014US8869391 Producing method of wired circuit board
10/28/2014US8869390 System and method for manufacturing a swallowable sensor device
10/23/2014US20140316103 Insulating material using epoxy resin composition
10/23/2014US20140315043 Sputtering target for forming protective film, and laminated wiring film
10/23/2014US20140313743 Method for Assembling a Microelectronic Chip Device in a Fabric, Chip Device, and Fabric Incorporating a Crimped Chip Device
10/23/2014US20140313684 Non-Planar Printed Circuit Board with Embedded Electronic Components
10/23/2014US20140313683 Tape carrier package and method of manufacturing the same
10/23/2014US20140313682 Composite electronic component
10/23/2014US20140313681 Chip embedded substrate and method of producing the same
10/23/2014US20140313679 Heavy-current transformer having a multi-point contacting, transformer element, contact plate and secondary winding, and method for producing such a heavy-current transformer
10/23/2014US20140313676 Electronic component package
10/23/2014US20140313402 Wiring substrate and camera module
10/23/2014US20140312501 Non-random array anisotropic conductive film (acf) and manufacturing processes
10/23/2014US20140312248 Articles containing non-visible identifying marks formed from nanomaterials and methods utilizing the same
10/23/2014US20140311794 Power in lead
10/23/2014US20140311791 Electrical circuit board trace pattern to minimize capacitor cracking and improve reliability
10/23/2014US20140311790 Memristive element based on hetero-junction oxide
10/23/2014US20140311789 Multilayer ceramic electronic component and board for mounting the same
10/23/2014US20140311788 Multilayered ceramic capacitor and board for mounting the same
10/23/2014US20140311787 Multilayer ceramic capacitor and board for mounting the same
10/23/2014US20140311786 Multilayer ceramic capacitor and mounting board therefor
10/23/2014US20140311785 Multilayered ceramic capacitor and mounting board therefor
10/23/2014US20140311784 Multilayered ceramic capacitor and mounting board therefor
10/23/2014US20140311783 Multilayer ceramic electronic component and board for mounting the same
10/23/2014US20140311782 Multilayer ceramic electronic component, manufacturing method thereof, and board for mounting the same
10/23/2014US20140311781 Metal-clad laminate and printed wiring board
10/23/2014US20140311780 Electronic component, method for manufacturing the same and method for manufacturing multilayer printed wiring board
10/23/2014US20140311779 Photocurable electroconductive ink composition
10/23/2014US20140311777 Bent printed circuit board for backlight unit
10/23/2014US20140311776 Plating apparatus, plating method, method of manufacturing printed circuit board and printed circuit board
10/23/2014US20140311775 Circuit board structure
10/23/2014US20140311774 Board, mounting structure of surface mounting component, and electronic device
10/23/2014US20140311773 Multi-layer wiring board and method of manufacturing the same
10/23/2014US20140311772 Printed wiring board and method for manufacturing multilayer core substrate
10/23/2014US20140311771 Wiring board
10/23/2014US20140311713 Heat dissipation component
10/21/2014US8867871 Optical printed circuit board and method of fabricating the same
10/21/2014US8867870 Optical module fabricated on folded printed circuit board
10/21/2014US8867231 Electronic module packages and assemblies for electrical systems
10/21/2014US8867230 Storage system and printed circuit board
10/21/2014US8867226 Monolithic microwave integrated circuits (MMICs) having conductor-backed coplanar waveguides and method of designing such MMICs
10/21/2014US8867225 Wiring board
10/21/2014US8867223 System and method for a high retention module interface
10/21/2014US8867220 Packaging board with visual recognition windows
10/21/2014US8867219 Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices
10/21/2014US8867218 Electronic apparatus and method of manufacturing holding member
10/21/2014US8867217 Tear-proof circuit
10/21/2014US8867216 Slot design for flexible and expandable system architecture
10/21/2014US8867215 Memory cards and electronic machines
10/21/2014US8867212 Circuit board structure having measures against heat
10/21/2014US8866782 Display device
10/21/2014US8866304 Integrated circuit device with stitched interposer
10/21/2014US8866282 Semiconductor apparatus, signal transmission system and signal transmission method
10/21/2014US8866027 Printed wiring board and method for manufacturing the same
10/21/2014US8866026 Construction of reliable stacked via in electronic substrates—vertical stiffness control method
10/21/2014US8866025 Multilayer wiring board
10/21/2014US8866024 Transceiver power distribution network
10/21/2014US8866023 Method and system for reducing trace length and capacitance in a large memory footprint
10/21/2014US8866022 Printed wiring board, build-up multi-layer board, and production method therefor
10/21/2014US8866021 Circuit board and process for producing the same
10/21/2014US8866020 Method for manufacturing printed circuit board, method for manufacturing printed circuit board assembly sheet, printed circuit board, and printed circuit board assembly sheet
10/21/2014US8866018 Passive electrical devices and methods of fabricating passive electrical devices
10/21/2014US8865525 Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby
10/21/2014US8865311 Resin composition, prepreg, and laminate
10/21/2014US8865251 Metal nanobelt and method of manufacturing the same, and conductive ink composition and conductive film comprising the same
10/21/2014US8864501 Board mounted electrical connector
10/21/2014US8864338 Heat radiating printed circuit board and chassis assembly having the same
10/21/2014US8863378 Method for manufacturing a wiring board
10/21/2014US8863375 Method for connecting a plurality of elements of a circuit board
10/16/2014US20140309326 Curable composition
10/16/2014US20140308907 Apparatus and methods related to ground paths implemented with surface mount devices
10/16/2014US20140308489 Molybdenum compound powder, prepreg, and laminate
10/16/2014US20140308478 Flexible metal laminate
10/16/2014US20140307423 Flexible interconnect circuitry
10/16/2014US20140307410 Board assembly
10/16/2014US20140307406 Ceramic multilayer wiring substrate and module including the same
10/16/2014US20140307405 Dual Interface Module and Dual Interface Card Having a Dual Interface Module Manufactured Using Laser Welding
10/16/2014US20140307404 Embedded electronic Device and Method for Manufacturing an Embedded Electronic Device
10/16/2014US20140307403 Method for integrating an electronic component into a printed circuit board
10/16/2014US20140307402 Substrate with built-in electronic component
10/16/2014US20140307398 Image display device
10/16/2014US20140307397 Flexible display
10/16/2014US20140307396 Flexible display device and method of manufacturing the same
10/16/2014US20140307395 Display device and operating method thereof
10/16/2014US20140307391 Three dimensional packaging
10/16/2014US20140306876 Mobile device and method of changing a shape of a mobile device
10/16/2014US20140306355 Chip interposer, semiconductor device, and method for manufacturing a semiconductor device
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