| Patents for H05K 1 - Printed circuits (98,583) |
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| 07/30/2014 | CN203748102U 电动车控制器 Electric vehicle controller |
| 07/30/2014 | CN203748101U 一种香槟色金属补强片 One kind of metal reinforcing piece champagne |
| 07/30/2014 | CN203748100U 台阶状线路板 Stepped board |
| 07/30/2014 | CN203748099U 兼容至少两种看门狗电路的pcb板 Compatible with at least two watchdog circuit pcb board |
| 07/30/2014 | CN203748098U 一种加强摄像头闪光灯散热的柔性电路板结构 A way of strengthening camera flash cooling of the flexible circuit board structure |
| 07/30/2014 | CN203746907U 陶瓷电路板及具有该陶瓷电路板的led封装模块 A ceramic circuit board and the package module has led to the ceramic circuit board |
| 07/30/2014 | CN203743903U 一种led灯具模块 One kind of led lighting module |
| 07/30/2014 | CN1949952B 多层配线板、使用多层配线板的半导体器件及其制造方法 Multi-layer wiring board, a semiconductor device and a manufacturing method of the multilayer wiring board |
| 07/30/2014 | CN103959922A 电子元件模块和该电子元件模块的制造方法 The method of manufacturing an electronic component module and the electronic components of the module |
| 07/30/2014 | CN103959448A 金属配线形成用的转印基板及基于所述转印用基板的金属配线的形成方法 The method of forming a metal wiring formed on the substrate and the transfer substrate for transferring a metal wiring |
| 07/30/2014 | CN103959396A 柔性导电构件以及使用其的转换器 Flexible conductive member and the use of its converter |
| 07/30/2014 | CN103958743A 印刷电路用铜箔 Copper foil for printed circuits |
| 07/30/2014 | CN103958188A 含有氟化聚合物的挠性金属层压板 Fluorinated polymers containing flexible metal laminate |
| 07/30/2014 | CN103957663A 一种组装板间中空焊柱垂直互联结构及制作方法 An assembly plate welding between hollow vertical column interconnect structure and method of making |
| 07/30/2014 | CN103957662A 布线电路基板及其制造方法 Wired circuit board and manufacturing method thereof |
| 07/30/2014 | CN103957661A 一种局部消除厚度方向热失配的印制电路板结构 A topical eliminate thermal mismatch of the thickness direction of the printed circuit board structure |
| 07/30/2014 | CN103957660A 含有填充铜柱的高导热陶瓷基板及其制备工艺 High thermal conductivity of the ceramic substrate and preparation process contains copper cylinder filled |
| 07/30/2014 | CN103957659A 一种微型控制电路板基板 A miniature control circuit board substrate |
| 07/30/2014 | CN103957658A 一种野生动物微型追踪器的sim卡无座安装方法 A wild animal micro sim card tracker no seat installation method |
| 07/30/2014 | CN103957657A 柔性线路板及具有所述柔性线路板的光模块 Flexible circuit boards and optical module having the flexible circuit board |
| 07/30/2014 | CN103956250A 表贴型平面磁性元件及模块 Surface mount components and planar magnetic module |
| 07/30/2014 | CN103347938B 半固化片、层压板、印刷电路板及半导体装置 Prepregs, laminates, printed circuit boards and semiconductor device |
| 07/30/2014 | CN102884135B 印刷电路板用树脂组合物 A printed circuit board with a resin composition |
| 07/30/2014 | CN102414288B 胶粘性树脂组合物、以及使用其的层压体和柔性印刷线路板 The adhesive resin composition and the use thereof and a flexible printed wiring board laminate |
| 07/30/2014 | CN102414287B 胶粘性树脂组合物及使用其的层压体和柔性印刷线路板 The adhesive resin composition and the use thereof and a flexible printed wiring board laminate |
| 07/30/2014 | CN102307825B 低温烧结陶瓷烧结体及多层陶瓷基板 Low-temperature co-fired ceramic sintered body, and multilayer ceramic substrate |
| 07/30/2014 | CN102300901B 树脂组合物 Resin composition |
| 07/30/2014 | CN102276654B Uv屏蔽性能优异的磷改性阻燃固化剂的制造方法 Uv mask manufacturing method of high performance flame retardant phosphorus-modified curing agent |
| 07/30/2014 | CN102265720B 密封构造体 Sealing structure |
| 07/30/2014 | CN102196709B 散热模块及其所适用的电子装置 Cooling modules and electronic devices applicable |
| 07/30/2014 | CN102164451B 多层布线基板及其制造方法 The multilayer wiring board and its manufacturing method |
| 07/30/2014 | CN102149251B 刚挠性电路板及其制造方法 The flex-rigid wiring board and its manufacturing method |
| 07/30/2014 | CN101652032B 一种带固定装置的pcb复合板 A tape fixtures composite board pcb |
| 07/29/2014 | US8792250 Apparatus for flexible mounting and electrical connection |
| 07/29/2014 | US8792248 Method for providing improved power distribution or power dissipation to an electrical component attached to main circuit board |
| 07/29/2014 | US8791862 Semiconductor package having integrated antenna pad |
| 07/29/2014 | US8791768 Capacitive coupler packaging structure |
| 07/29/2014 | US8791566 Aluminum nitride substrate, aluminum nitride circuit board, semiconductor apparatus, and method for manufacturing aluminum nitride substrate |
| 07/29/2014 | US8791477 Light emitting device array |
| 07/29/2014 | US8791372 Reducing impedance discontinuity in packages |
| 07/29/2014 | US8791371 Mesh planes with alternating spaces for multi-layered ceramic packages |
| 07/29/2014 | US8791370 Carrier tape for tab-package and manufacturing method thereof |
| 07/29/2014 | US8791369 Electronic component |
| 07/29/2014 | US8791368 Conductive structure body and method for manufacturing the same |
| 07/29/2014 | US8790742 Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections |
| 07/29/2014 | US8790549 Electronic component provided with Cu—Al—Co-based alloy electrode or wiring |
| 07/29/2014 | CA2638973C Biosensor and method of making |
| 07/24/2014 | WO2014113205A1 Multi-functional fpc assembly |
| 07/24/2014 | WO2014111324A1 Transmission device |
| 07/24/2014 | US20140206207 Stack connector component in which high-speed signal pins are routed to different side than low-speed signal pins, and circuit board therefor |
| 07/24/2014 | US20140205854 Circuit board material |
| 07/24/2014 | US20140204554 Electronic device with electromagnetic interference protection |
| 07/24/2014 | US20140204553 Printed circuit board having a molded part and method for the production thereof |
| 07/24/2014 | US20140204552 Sensor and method for manufacturing sensor |
| 07/24/2014 | US20140204551 Circuit board assembly |
| 07/24/2014 | US20140204550 Module board |
| 07/24/2014 | US20140204549 Circuit substrate |
| 07/24/2014 | US20140204548 Substrate with built-in passive element |
| 07/24/2014 | US20140204546 PCB stackup having high- and low-frequency conductive layers and having insulating layers of different material types |
| 07/24/2014 | US20140204544 Flat wiring member and manufacturing method thereof |
| 07/24/2014 | US20140204543 Tamper protection device and data transaction apparatus |
| 07/24/2014 | US20140204542 Display panel integrating a driving circuit |
| 07/24/2014 | US20140204541 Electronic device and method for manufacturing electronic device |
| 07/24/2014 | US20140203703 Method and apparatus for coupling an active display portion and substrate |
| 07/24/2014 | US20140203069 Metallized film-over-foam contacts |
| 07/24/2014 | US20140202754 Micro electronic component structure |
| 07/24/2014 | US20140202753 Z-Directed Delay Line Components for Printed Circuit Boards |
| 07/24/2014 | US20140202752 Wiring board and design method for wiring board |
| 07/24/2014 | US20140202751 Paddle Card With Improved Performance |
| 07/24/2014 | US20140202750 Multilayer substrate module |
| 07/24/2014 | US20140202749 Resin composition for forming ink-receiving layer and ink-receiving base, printed matter and conductive pattern produced by using the resin composition |
| 07/24/2014 | US20140202748 Printed circuit board having metal bumps |
| 07/24/2014 | US20140202747 Circuit board and manufacturing method thereof |
| 07/24/2014 | US20140202746 Composite copper wire interconnect structures and methods of forming |
| 07/24/2014 | US20140202745 Conductive composition and conductive film |
| 07/24/2014 | US20140202744 Conductive composition and conductive film |
| 07/24/2014 | US20140202743 Printed circuit board and method for manufacturing the same |
| 07/24/2014 | US20140202742 Two-sided laser patterning on thin film substrates |
| 07/24/2014 | US20140202741 Component built-in board and method of manufacturing the same |
| 07/24/2014 | US20140202740 Method of Manufacturing Multilayer Wiring Substrate, and Multilayer Wiring Substrate |
| 07/24/2014 | US20140202739 Printed wiring board having metal layers producing eutectic reaction |
| 07/24/2014 | US20140202738 Nanostructure transparent conductors having high thermal stability for esd protection |
| 07/24/2014 | US20140202737 Adhesive varnish, adhesive film and wiring film |
| 07/24/2014 | US20140202736 Lead frame and a method of fabrication thereof |
| 07/24/2014 | US20140202735 Method of manufacturing non-firing type electrode |
| 07/24/2014 | DE102013211693B3 Sensor mit einem mikroelektromechanischem Chip (MEMS-Chip) Sensor with a micro-electro-mechanical chip (MEMS chip) |
| 07/24/2014 | DE102013200652B4 Vorrichtung zum Schalten hoher Ströme Apparatus for switching high currents |
| 07/24/2014 | DE102013100622A1 Leiterplatte im Lagenaufbau Circuit board stackup |
| 07/24/2014 | DE102013001006A1 Leiterplattenanordnung Printed circuit board assembly |
| 07/24/2014 | DE102011053390B4 Verfahren zum Prozessieren eines Substrats A method for processing a substrate |
| 07/23/2014 | EP2757864A2 Connecting system of circuit boards |
| 07/23/2014 | EP2757863A2 Printed circuit board stack |
| 07/23/2014 | EP2757862A2 Circuit board assembly |
| 07/23/2014 | EP2757674A2 DC - DC converter and vehicular lamp |
| 07/23/2014 | EP2757637A1 Electronic circuit comprising electrical connections resistant to a severe environment |
| 07/23/2014 | EP2757630A1 Transmission device |
| 07/23/2014 | EP2757613A1 Rechargeable battery pack |
| 07/23/2014 | EP2756996A1 Electrical junction box |
| 07/23/2014 | EP2756742A1 Circuit arrangement body, in particular component board |
| 07/23/2014 | EP2756741A1 Circuitry arrangement for reducing a tendency towards oscillations |