| Patents for H05K 1 - Printed circuits (98,583) |
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| 02/23/2010 | US7665206 Printed circuit board and manufacturing method thereof |
| 02/18/2010 | WO2010019820A1 Additional functionality single lammination stacked via with plated through holes for multilayer printed circuit boards |
| 02/18/2010 | WO2010018759A1 Flexible substrate and electric circuit structure |
| 02/18/2010 | WO2010018756A1 Electric circuit structure |
| 02/18/2010 | WO2010017911A1 Unit for illuminating a light-guide plate for the backlighting of a digital display panel |
| 02/18/2010 | WO2010017746A1 Printed circuit board, method for making the same and equipment with rf power amplifier |
| 02/18/2010 | WO2009127409A3 Protective arrangement for the protection of safety-relevant electronic circuits from malfunction |
| 02/18/2010 | WO2008114858A8 Resin composition for forming insulating layer of printed wiring board |
| 02/18/2010 | US20100039784 Printed circuit board |
| 02/18/2010 | US20100039779 Wireless Telemetry Electronic Circuit Board for High Temperature Environments |
| 02/18/2010 | US20100038127 Power-Ground Plane Partitioning and Via Connection to Utilize Channel/Trenches for Power Delivery |
| 02/18/2010 | US20100038126 Interposer structures and methods of manufacturing the same |
| 02/18/2010 | US20100038125 Additional functionality single lamination stacked via with plated through holes for multilayer printed circuit boards |
| 02/18/2010 | US20100038124 Embedded structure and method for making the same |
| 02/18/2010 | US20100038122 Electronic component module and method for manufacturing the same |
| 02/18/2010 | US20100038121 Metal Deposition |
| 02/18/2010 | US20100038120 Layered ceramic electronic component and manufacturing method therefor |
| 02/18/2010 | US20100038119 Metal Deposition |
| 02/18/2010 | US20100038118 Substrate panel |
| 02/18/2010 | US20100038117 Tape wiring substrates and packages including the same |
| 02/18/2010 | US20100038116 Printed circuit board and method for manufacturing same |
| 02/18/2010 | US20100038115 Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil |
| 02/18/2010 | DE112008000932T5 Schaltkreismaterialien, Mehrschichtschaltkreise und Verfahren zu ihrer Herstellung Circuit materials, circuits and multi-layer process for their preparation |
| 02/18/2010 | DE102008036837A1 Sensorvorrichtung und Verfahren zur Herstellung Sensor device and methods for making |
| 02/18/2010 | DE102008036736A1 Elektrisches Installationsschaltgerät mit einer elektronischen Baugruppe Electrical service switching device with an electronic module, |
| 02/18/2010 | DE102008001000B4 Schichtsystem für Elektroden Layer system for electrodes |
| 02/17/2010 | EP2154938A2 Sustainable endothermic heat stripping method and apparatus |
| 02/17/2010 | EP2154747A1 Multilayer-structure device with vertical transition between a microstrip and a stripline |
| 02/17/2010 | EP2154636A1 Memory card |
| 02/17/2010 | EP2154557A2 Arc-shaped flexible printed circuit film type endoscope using imgaing device |
| 02/17/2010 | EP2154421A1 Lighting equipment and display device using the same |
| 02/17/2010 | EP2154212A1 A method for the production of conductive and transparent nano-coatings |
| 02/17/2010 | EP2153707A2 Method for producing an electronic assembly |
| 02/17/2010 | EP2153706A1 Electronic circuit device |
| 02/17/2010 | EP1961282B1 Arrangement comprising at least one electronic component |
| 02/17/2010 | EP1806037B1 Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method |
| 02/17/2010 | EP1757175B1 Method and apparatus for accurately applying structures to a substrate |
| 02/17/2010 | EP1520446B1 Method for forming acoustically active element in a multi-layer circuit-board structure and a multi-layer circuit-board structure |
| 02/17/2010 | EP1321978B1 Contact structure |
| 02/17/2010 | CN201409276Y Electromagnetic shielding cover and printed circuit board (PCB) device |
| 02/17/2010 | CN201409257Y Waterproof sealed circuit board |
| 02/17/2010 | CN201409256Y Component switching device |
| 02/17/2010 | CN201409255Y Solder resisting structure of thick copper circuit board |
| 02/17/2010 | CN201409254Y Thick copper circuit board |
| 02/17/2010 | CN201408763Y Low-inductance gated thyristor and power semiconductor component thereof |
| 02/17/2010 | CN201408423Y 信息安全保护装置 Information security devices |
| 02/17/2010 | CN101653050A Enhanced localized distributive capacitance for circuit boards |
| 02/17/2010 | CN101653049A A printed board assembly and a method |
| 02/17/2010 | CN101652023A Assembly structure, component and communication equipment for printed circuit board |
| 02/17/2010 | CN101652022A Positioning structure of photosensitive element |
| 02/17/2010 | CN101652021A Buildup printed circuit board |
| 02/17/2010 | CN101652020A High heat radiating circuit substrate and manufacturing method thereof |
| 02/17/2010 | CN101652019A Circuit board prefabricated product and circuit board assembling method |
| 02/17/2010 | CN101652018A PCB, mould and LED display device |
| 02/17/2010 | CN100591195C Electronic assembly body and production method thereof |
| 02/17/2010 | CN100591194C Differential compatible circuit board |
| 02/17/2010 | CN100591193C Wiring substrate, wiring material, copper-clad laminate, and method of manufacturing the wiring substrate |
| 02/17/2010 | CN100591192C Radiant heat printed circuit board and method of fabricating the same |
| 02/17/2010 | CN100590855C Flexible substrate, manufacturing method thereof and semiconductor package |
| 02/17/2010 | CN100590142C Nanoporous laminates |
| 02/17/2010 | CN100589915C Method for separating flat ceramic workpieces with a calculated radiation spot length |
| 02/16/2010 | US7663894 Multilayer printed wiring board |
| 02/16/2010 | US7663893 Sensor node and circuit board arrangement |
| 02/16/2010 | US7663892 Printed circuit board having embedded RF module power stage circuit |
| 02/16/2010 | US7663890 Printed circuit boards for use in optical transceivers |
| 02/16/2010 | US7663888 Printed circuit board thickness adaptors |
| 02/16/2010 | US7663223 Coupling substrate for semiconductor components and method for producing the same |
| 02/16/2010 | US7663215 Electronic module with a conductive-pattern layer and a method of manufacturing same |
| 02/16/2010 | US7663113 Semiconductor device and radiation detector employing it |
| 02/16/2010 | US7663064 High-speed flex printed circuit and method of manufacturing |
| 02/16/2010 | US7663063 Circuit board with improved ground plane |
| 02/16/2010 | US7663062 Flexible circuit board |
| 02/16/2010 | US7662429 Multilayer |
| 02/16/2010 | US7661893 Lens barrel |
| 02/16/2010 | US7661191 Multilayer substrate manufacturing method |
| 02/11/2010 | WO2010016598A1 Anodic bondable porcelain and composition for the porcelain |
| 02/11/2010 | WO2010015825A1 Thermally optimised led chip-on-board module |
| 02/11/2010 | WO2010015420A1 Polymer molded bodies and printed circuit board arrangement and method for the production thereof |
| 02/11/2010 | US20100035375 Maskless nanofabrication of electronic components |
| 02/11/2010 | US20100033940 Inter-board coupling connector and circuit board device using inter-board coupling connector |
| 02/11/2010 | US20100033938 Method and apparatus for reducing capacitor generated noise on a printed circuit board |
| 02/11/2010 | US20100033937 Memory card connector |
| 02/11/2010 | US20100033936 Method and apparatus for rapid and dynamic RF and microwave circuit prototyping and integration |
| 02/11/2010 | US20100033670 Metal material and its manufacturing method, thin-film device and its manufacturing method, element-side substrate and its manufacturing method, and liquid crystal display and its manufacturing method |
| 02/11/2010 | US20100033287 Integrated passive device and ipd transformer |
| 02/11/2010 | US20100033281 Precise multi-pole magnetic component |
| 02/11/2010 | US20100032202 Wiring substrate, wiring material, copper-clad laminate, and method of manufacturing the wiring substrate |
| 02/11/2010 | US20100032201 Suspension board with circuit, producing method thereof, and positioning method of suspension board with circuit |
| 02/11/2010 | US20100032200 Conductive connecting pin and package substrate |
| 02/11/2010 | US20100032199 Electrical Connection of Components |
| 02/11/2010 | US20100032198 Circuit module |
| 02/11/2010 | US20100032197 Circuit board including aligned nanostructures |
| 02/11/2010 | US20100032196 Multilayer wiring board, semiconductor package and method of manufacturing the same |
| 02/11/2010 | US20100032195 Printed wiring board |
| 02/11/2010 | US20100032194 Printed wiring board, manufacturing method for printed wiring board and electronic device |
| 02/11/2010 | US20100032193 Electrode pad for mounting electronic component and structure for mounting electronic component |
| 02/11/2010 | US20100032192 Interlayer dielectric film with carrier material and multilayer printed circuit board therewith |
| 02/11/2010 | US20100032191 Flexible printed circuitboard structure |
| 02/11/2010 | US20100032189 Led package and attachment structure of molded circuit component |
| 02/11/2010 | US20100032186 Transparent electrode for display device and manufacturing method thereof |