Patents for H05K 1 - Printed circuits (98,583)
11/2014
11/18/2014US8890761 Structure, printed circuit board, antenna, transmission line to waveguide converter, array antenna, and electronic device
11/18/2014US8890638 Stub-tuned wirebond package
11/18/2014US8890519 Printed circuit board comprising two coils
11/18/2014US8890408 Method and apparatus for coupling an active display portion and substrate
11/18/2014US8890306 Light-emitting diode
11/18/2014US8890002 Resin multilayer substrate and method for manufacturing the resin multilayer substrate
11/18/2014US8890001 Wiring board and mounting structure using the same
11/18/2014US8890000 Printed wiring board having through-hole and a method of production thereof
11/18/2014US8889999 Multiple layer printed circuit board with unplated vias
11/18/2014US8889998 Conductor structure, transparent device, and electronic device
11/18/2014US8889997 Methods for improving corrosion resistance and applications in electrical connectors
11/18/2014US8889996 Cable connection structure and cable connection method
11/18/2014US8889995 Wire bond pad system and method
11/18/2014US8889994 Single-layered printed circuit board and manufacturing method thereof
11/18/2014US8889816 Method for preparing phosphorus-containing polyphenylene oxide resin with low molecular weight
11/18/2014US8889250 Plating target material, polyamic solution and polyimide resin solution which are used to form the plating target material, and printed-wiring board using them
11/18/2014US8888531 Electrical connector and circuit board assembly including the same
11/18/2014US8888504 Multilevel interconnection system
11/18/2014US8887384 Method for producing a circuit board having LEDs and printed reflector surfaces, and circuit board produced according to the method
11/13/2014US20140337994 Information processing device
11/13/2014US20140336930 Electronic device
11/13/2014US20140335341 Cyanate esters-based adhesive resin composition for fabrication of circuit board and flexible metal clad laminate comprising the same
11/13/2014US20140334164 Wiring board and light emitting device using same
11/13/2014US20140334121 Multilayer printed circuit board
11/13/2014US20140334120 Electronic module allowing fine tuning after assembly
11/13/2014US20140334113 Electronic textile with means for facilitating waste sorting
11/13/2014US20140334112 Motherboard with connector compatible with different interface standards
11/13/2014US20140334109 Electronic Component Module and Method of Manufacturing the Same
11/13/2014US20140334108 Semiconductor package module having self-assembled insulation thin film and method of manufacturing the semiconductor package module
11/13/2014US20140333850 Touch Panel and Method for Manufacturing the Same
11/13/2014US20140333505 Semiconductor package having integrated antenna pad
11/13/2014US20140333339 Board, integrated circuit testing arrangement, and method for operating an integrated circuit
11/13/2014US20140333329 Method and apparatus for measuring thickness of layer in printed circuit board
11/13/2014US20140332262 Optically transparent electrode
11/13/2014US20140332261 Capacitor element mounting structure and capacitor element mounting method
11/13/2014US20140332260 Method of manufacturing ceramic electronic component, ceramic electronic component, and wiring board
11/13/2014US20140332259 Wiring substrate and method of manufacturing wiring substrate
11/13/2014US20140332258 Double-sided printed wiring board and method for producing the same
11/13/2014US20140332257 Method of bonding flexible printed circuit board (fpcb), panel-fpcb assembly, and display device including the same
11/13/2014US20140332256 Micro-wire electrode structure having non-linear gaps
11/13/2014US20140332255 Printed circuit board and method of manufacturing the same
11/13/2014US20140332254 Laser patterning of silver nanowire - based transparent electrically conducting coatings
11/13/2014US20140332253 Carrier substrate and manufacturing method thereof
11/13/2014US20140332252 Carrier substrate and manufacturing method thereof
11/13/2014US20140332159 Method for producing prepreg and laminate
11/13/2014US20140331482 Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures
11/11/2014US8886350 Displacement calculation method, drawing data correction method, substrate manufacturing method, and drawing apparatus
11/11/2014US8885358 Plug-in module for controllers of mobile working machines
11/11/2014US8885357 Printed circuit board with reduced cross-talk
11/11/2014US8885356 Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution
11/11/2014US8885355 Device having snaps with soldered snap members
11/11/2014US8885353 Electrical assembly for a motor vehicle, suitable for contacting with a connector
11/11/2014US8885350 Display device and television receiver
11/11/2014US8885349 Daughter circuit board for interface signal conversion
11/11/2014US8885348 Circuit board sensor and method for producing the same
11/11/2014US8885343 Heat dissipation from a control unit
11/11/2014US8885333 Mobile terminal
11/11/2014US8884935 Flexible printed circuit board, backlight unit using the same, and liquid crystal display device comprising the same
11/11/2014US8884432 Substrate and assembly thereof with dielectric removal for increased post height
11/11/2014US8884427 Low CTE interposer without TSV structure
11/11/2014US8884167 Printed circuit board unit
11/11/2014US8884166 Method of manufacturing multi-layer circuit board, and multi-layer circuit board
11/11/2014US8884165 Packaging device and base member for packaging
11/11/2014US8884164 Circuit board assembly with flexible printed circuit board and reinforcing plate
11/11/2014US8883894 Insulating film and printed wiring board provided with insulating film
11/11/2014US8883606 Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same
11/11/2014US8883564 Substrate comprising aluminum/graphite composite, heat dissipation part comprising same, and LED luminescent member
11/11/2014US8883561 Semiconductor device and method of embedding TSV semiconductor die within encapsulant with TMV for vertical interconnect in POP
11/11/2014US8883316 Composite material and high frequency substrate made therefrom
11/11/2014US8883313 Modified polytetrafluoroethylene powder and method for producing tetrafluoroethylene polymer
11/11/2014US8883287 Structured material substrates for flexible, stretchable electronics
11/11/2014US8883046 Conductive metal ink composition and method for forming a conductive pattern
11/11/2014US8882983 Embedded thin films
11/11/2014US8882524 External contact plug connector
11/11/2014US8882312 Light emitting device with light emitting diodes fixed to printed circuit
11/11/2014US8882310 Laser die light source module with low inductance
11/11/2014US8882301 Method for low temperature bonding of electronic components
11/11/2014US8881389 Methods of flash dual inline memory modules with flash memory
11/11/2014US8881387 Methods and apparatus for shielding circuitry from interference
11/11/2014US8881382 Embedded printed circuit board and method of manufacturing the same
11/06/2014US20140329405 Thermal management structures for optoelectronic systems
11/06/2014US20140329066 Resin composition, prepreg, and laminate
11/06/2014US20140328523 Chip package and method for forming the same
11/06/2014US20140328039 Systems and methods for void reduction in a solder joint
11/06/2014US20140328038 Electronic component-embedded module
11/06/2014US20140328036 Electronic device
11/06/2014US20140328033 Flexible display device and fabrication method thereof
11/06/2014US20140328032 Chip arrangement, chip card arrangement and method for manufacturing a chip arrangement
11/06/2014US20140328031 Display apparatus
11/06/2014US20140328029 Control unit having a sacrificial structure
11/06/2014US20140327627 Touch device, touch panel, and method for controlling the same
11/06/2014US20140327510 Electronic device having asymmetrical through glass vias
11/06/2014US20140327463 Membrane Sheet with Bumps for Probe Card, Probe Card and Method for Manufacturing Membrane Sheet with Bumps for Probe Card
11/06/2014US20140327031 Current conducting element
11/06/2014US20140326715 Composite structure
11/06/2014US20140326495 High performance printed circuit board
11/06/2014US20140326494 Multilayer ceramic electronic component and mounting board therefor
11/06/2014US20140326493 Multilayer ceramic electronic component and board for mounting the same
11/06/2014US20140326491 Land grid array interconnect formed with discrete pads
11/06/2014US20140326489 Systems and methods for decreasing stub resonance of plating for circuit boards
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