Patents
Patents for H02N 13 - Clutches or holding devices using electrostatic attraction, e.g. using johnson-rahbek effect (1,323)
10/2001
10/04/2001EP1138111A1 Electrostatic maintaining device
09/2001
09/27/2001US20010024349 Method of fabricating a semiconductor wafer support chuck apparatus having small diameter gas distribution ports for distributing a heat transfer gas
09/25/2001US6295194 Bead or particle manipulating chucks
09/25/2001US6294024 Electrostatic chucks and a particle deposition apparatus therefor
09/19/2001CN1071275C Device for conveying sheets in a printing machine
09/18/2001US6292346 Equipment for holding a semiconductor wafer, a method for manufacturing the same, and a method for using the same
09/12/2001EP1132948A2 Substrate holding device, semiconductor manufacturing apparatus and device manufacturing device
09/12/2001CN1312970A Chuck apparatus for clamping a planar substrate in an electrostatic coating method
09/12/2001CN1312734A AC waveform biasing for bead manipulating chucks
09/05/2001EP1129481A1 Method and device for compensating wafer bias in a plasma processing chamber
09/04/2001US6284093 Shield or ring surrounding semiconductor workpiece in plasma chamber
08/2001
08/30/2001US20010018098 Method of depositing particles with an electrostatic chuck
08/28/2001US6280584 Compliant bond structure for joining ceramic to metal
08/21/2001US6278600 Electrostatic chuck with improved temperature control and puncture resistance
08/16/2001EP1124256A1 Ceramic substrate
08/14/2001US6273023 Plasma processing apparatus capable of reliably, electrostatically attracting and holding and thus fixing semiconductor wafer
08/08/2001EP1121752A1 Electrostatic sensing chuck using area matched electrodes
08/07/2001US6272002 Electrostatic holding apparatus and method of producing the same
07/2001
07/31/2001US6268994 Electrostatic chuck and method of manufacture
07/31/2001US6267225 Sheet-conveying device for machines used in the printing technology field
07/25/2001EP1118425A2 Method and apparatus for dechucking a workpiece from an electrostatic chuck
07/25/2001EP1118113A1 Methods and apparatus for determining an etch endpoint in a plasma processing system
07/24/2001US6265758 Semiconductor active electrostatic device
07/10/2001US6259592 Apparatus for retaining a workpiece upon a workpiece support and method of manufacturing same
07/03/2001US6256187 Electrostatic chuck device
07/03/2001US6255223 Substrate handling method and apparatus, and attractive force inspection method and apparatus used therewith
06/2001
06/28/2001US20010004921 Methods and apparatus for determining an etch endpoint in a plasma processing system
06/26/2001US6252758 Method for reducing particles from an electrostatic chuck and an equipment for manufacturing a semiconductor
06/14/2001WO2001043184A2 Electrostatic chucks with flat film electrode
06/13/2001CN1067177C 静电式夹盘 Electrostatic chuck
06/07/2001US20010002871 Method for reducing particles from an electrostatic chuck and an equipment for manufacturing a semiconductor
05/2001
05/31/2001WO2001038600A1 Articles coated with aluminum nitride by chemical vapor deposition
05/31/2001US20010002283 Apparatus for clamping a planar substrate
05/17/2001WO2001035459A1 Ceramic substrate
05/10/2001WO2001032121A2 Skin-gripper
05/10/2001WO2001032114A1 Skin-gripper
05/08/2001US6228278 Methods and apparatus for determining an etch endpoint in a plasma processing system
04/2001
04/25/2001EP1093399A1 Ac waveforms biasing for bead manipulating chucks
04/10/2001US6215643 Electrostatic chuck and production method therefor
04/10/2001US6215642 Vacuum compatible, deformable electrostatic chuck with high thermal conductivity
04/10/2001US6215640 Apparatus and method for actively controlling surface potential of an electrostatic chuck
03/2001
03/28/2001EP1086524A1 Chuck apparatus for clamping a planar substrate in an electrostatic coating method
03/28/2001CN1288800A Method and apparatus for reducing moving of conuctive materials on component
03/15/2001WO2001018949A1 Bead or particle manipulating chucks
03/15/2001CA2383893A1 Bead or particle manipulating chucks
03/06/2001US6198616 Method and apparatus for supplying a chucking voltage to an electrostatic chuck within a semiconductor wafer processing system
02/2001
02/28/2001EP1079419A2 Method and apparatus for reducing migration of conductive material on a component
02/27/2001US6195246 Electrostatic chuck having replaceable dielectric cover
02/13/2001US6187149 Electrostatic chuck for attracting charged grains to a bead collection zone on a bead contact surface
01/2001
01/24/2001EP1070381A1 Electrostatic wafer clamp having low particulate contamination of wafers
01/23/2001US6177023 Method and apparatus for electrostatically maintaining substrate flatness
01/16/2001US6175485 Electrostatic chuck and method for fabricating the same
01/02/2001US6169652 Electrostatically screened, voltage-controlled electrostatic chuck
12/2000
12/26/2000US6166897 Static chuck apparatus and its manufacture
12/26/2000US6166432 Substrate for use in wafer attracting apparatus and manufacturing method thereof
12/20/2000EP1061639A2 Chucking system amd method
12/19/2000US6163448 Apparatus and method for ex-situ testing of performance parameters on an electrostatic chuck
12/12/2000US6160244 Susceptors
11/2000
11/30/2000WO2000072376A1 Electrostatic chuck and treating device
11/21/2000US6151203 Connectors for an electrostatic chuck and combination thereof
11/21/2000US6149774 AC waveforms biasing for bead manipulating chucks
10/2000
10/31/2000US6141203 Electrostatic chuck
10/19/2000WO2000062411A1 Electrostatic devices for mechanical blocking
10/18/2000EP1044494A1 Method and apparatus for clamping a substrate
10/17/2000US6134096 Substrate, insulating dielectric layer and electrode between the two; object is attracted onto electrode via insulating dielectric layer, which utilizes a gas-introducing hole to form a gas-diffusing depression for uniform heat conduction
09/2000
09/20/2000EP0857154B1 Device for conveying sheets in a printing machine
09/19/2000US6122159 Electrostatic holding apparatus
09/19/2000US6120278 Device for laying a film emerging from a slot die onto a rotating take-off roll
09/05/2000US6115232 Method for forming an ion implanted electrostatic chuck
08/2000
08/01/2000US6097408 Ink jet recording apparatus
07/2000
07/04/2000US6084763 Method of holding wafer, method of removing wafer and electrostatic chucking device
06/2000
06/15/2000WO2000035003A1 Apparatus and method for actively controlling surface potential of an electrostatic chuck
06/13/2000US6075375 Apparatus for wafer detection
05/2000
05/30/2000US6069785 Method for restoring an electrostatic chuck force
05/18/2000WO2000028654A1 Electrostatic maintaining device
05/02/2000US6056861 Process and device for generating resonance phenomena in particle suspensions
04/2000
04/20/2000WO2000022722A1 Electrostatic sensing chuck using area matched electrodes
04/20/2000CA2346240A1 Electrostatic sensing chuck using area matched electrodes
04/18/2000US6051303 Semiconductor supporting device
04/13/2000WO2000021127A1 Method and device for compensating wafer bias in a plasma processing chamber
04/12/2000EP0993024A2 Electrostatic chuck
04/12/2000EP0992106A1 A method and an apparatus for offsetting plasma bias voltage in bipolar electrostatic chucks
04/06/2000WO2000019592A1 Dechucking method and apparatus for workpieces in vacuum processors
04/06/2000WO2000019520A1 Methods and apparatus for determining an etch endpoint in a plasma processing system
03/2000
03/02/2000DE19936405A1 Electrostatic clamping device, used e.g. for clamping wafers for further processing, has a ceramic layer attached to a metal substrate by an elastic insulating layer containing rubber and phenolic antioxidant
02/2000
02/24/2000WO1999052144A9 Electrostatic chuck power supply
02/22/2000US6028762 Electrostatic chuck
02/08/2000US6023405 Electrostatic chuck with improved erosion resistance
02/02/2000EP0900475A4 Electrostatic chuck
01/2000
01/20/2000WO1999060613A3 Method and apparatus for minimizing plasma destabilization within a semiconductor wafer processing system
01/12/2000EP0971391A2 A method for reducing particles from an electrostatic chuck and an equipment for manufacturing a semiconductor
01/12/2000EP0970517A1 Unbalanced bipolar electrostatic chuck power supplies and methods therefor
12/1999
12/16/1999WO1999065136A1 Chuck apparatus for clamping a planar substrate in an electrostatic coating method
12/16/1999WO1999064148A1 Ac waveforms biasing for bead manipulating chucks
12/16/1999CA2333130A1 Ac waveforms biasing for bead manipulating chucks
12/16/1999CA2333116A1 Chuck apparatus for clamping a planar substrate in an electrostatic coating method
12/08/1999EP0962961A2 Susceptors
12/07/1999US5996218 Method of forming an electrostatic chuck suitable for magnetic flux processing
11/1999
11/30/1999US5995357 Ceramic member-electric power supply connector coupling structure
11/25/1999WO1999060613A2 Method and apparatus for minimizing plasma destabilization within a semiconductor wafer processing system
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