Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2012
06/14/2012DE112010003143T5 Halbleitervorrichtung, Verfahren zum Herstellen einer Halbleitervorrichtung, und Anzeigevorrichtung A semiconductor device, method for manufacturing a semiconductor device, and display device
06/14/2012DE112010001377T5 Glaszusammensetzung, Zusammensetzung für eine elektrische Leitpaste, welche dieseenthält, Elektrodenverdrahtungselement und elektronisches Bauteil Glass composition, composition for an electrical conductive paste, which contains this, electrode wiring element and electronic component
06/14/2012DE112010000882T5 Siliziumkarbid-Halbleitervorrichtung Silicon carbide semiconductor device
06/14/2012DE112009003514T5 Grabenbasierte leistungshalbleitervorrichtungen mit eigenschaften einer erhöhten durchbruchspannung Grave-based power semiconductor devices with properties increased by breakdown voltage
06/14/2012DE112009003199T5 Lateraler MOSFET mit einer Substrat-Drainverbindung A lateral MOSFET with a substrate-drain connection
06/14/2012DE112005002353B4 Verfahren zur Herstellung von Sammelleitungen aus Kupfer Process for the preparation of collecting lines of copper
06/14/2012DE112004001583B4 Verfahren zur Bildung eines Metallfilms A method of forming a metal film
06/14/2012DE102011088010A1 Metallgatestruktur mit großem ε Metal gate structure with large ε
06/14/2012DE102011085592A1 Device for protecting electric circuit e.g. integrated circuit, has activation unit that is set for activating protective measure, when supporting substrate is damaged
06/14/2012DE102011085203A1 Halbleiterbauelemente mit Durchgangskontakten und zugehörige Herstellungsverfahren Semiconductor components with through contacts and associated manufacturing processes
06/14/2012DE102011056403A1 Die-Anordnung und Verfahren zum Bilden einer Die-Anordnung The arrangement and method for forming a die assembly
06/14/2012DE102011056315A1 Halbleiterbauelement und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation
06/14/2012DE102011056213A1 Halbleitervorrichtung mit integriertem Schaltkreis A semiconductor device with an integrated circuit
06/14/2012DE102011056189A1 Method for manufacturing curved conductor for magnetic-current sensor, involves forming columnar portions with constant height and extending at right angles to contact portions and base portion
06/14/2012DE102011056157A1 Verfahren zur Herstellung eines Halbleiterbauteils mit isolierten Halbleitermesas A process for producing a semiconductor device with isolated Halbleitermesas
06/14/2012DE102011054182A1 Non-volatile memory device for e.g. memory card for storing data, has oxidization-resistant distance holder covering side walls of metal gate and positioned between control gate mask pattern and base gate
06/14/2012DE102010062914A1 Semiconductor i.e. power semiconductor, for use in direct current power semiconductor of electronic commutated electromotor of motor car, has ceramic layer comprises pores that are filled with thermal conductive medium e.g. adhesive
06/14/2012DE102010062570A1 Wafer system processing method, involves extending electrical plated through-hole from one semiconductor layer into another semiconductor layer through insulation layer, where latter semiconductor layer is partially removed to expose hole
06/14/2012DE102010062547A1 Verfahren zur Herstellung einer Schaltungsanordnung A process for producing a circuit arrangement
06/14/2012DE102010054483A1 Mobile, transportable elektrostatische Substrathalteanordnung Mobile, transportable electrostatic substrate holder assembly
06/14/2012DE102010054114A1 Drying device for drying electronic silk-screen printing paste on surface of solar cell for manufacturing electrical strip conductor, has transport unit defining transport plane that lies between openings of supplying and exhausting units
06/14/2012DE102010054068A1 Verfahren zur Herstellung eines optoelektronischen Bauelements und Bauelement A process for producing an optoelectronic component and the component
06/14/2012DE102009055394B4 Verfahren und Halbleiterbauelement mit Erhöhung der Abscheidegleichmäßigkeit für eine Kanalhalbleiterlegierung durch Bilden einer Vertiefung vor der Wannenimplantation The method and semiconductor device having a channel for increasing the Abscheidegleichmäßigkeit semiconductor alloy by forming a depression in front of the well implantation
06/14/2012DE102009055393B4 Verfahren zur Herstellung und Halbleiterbauelement mit besserem Einschluss von empfindlichen Materialien einer Metallgateelektrodenstruktur mit großem ε A process for producing semiconductor device and with better encapsulation of sensitive materials, a metal gate electrode structure with large ε
06/14/2012DE102006062872B4 Simultaneous double-side grinding providing method for semiconductor wafer, involves machining semiconductor wafers in material-removing fashion between rotating upper working disk and lower working disk
06/14/2012DE102006000615B4 Verfahren zum Bilden eines Halbleiterbauelements mit einer Dielektrikumschicht A method of forming a semiconductor device with a dielectric layer
06/14/2012DE102004018153B4 Hochvolt-Sperrschicht-Feldeffekttransistor mit retrograder Gatewanne und Verfahren zu dessen Herstellung High voltage JFET with retrograde gate well and method for its manufacture
06/14/2012DE10118976B4 Photoresist-Zusammensetzung für ein Resist-Fließverfahren und Verfahren zur Bildung eines Kontaktlochs unter Verwendung desselben Of the same photoresist composition for a resist-flow process and method for forming a contact hole using
06/14/2012CA2792550A1 Method for manufacturing semiconductor device
06/13/2012EP2463913A1 Bipolar reverse-blocking non-punch-through power semiconductor device
06/13/2012EP2463910A2 Manufacturing method of a solid state imaging device
06/13/2012EP2463907A2 Semiconductor device
06/13/2012EP2463901A2 Semiconductor device package and method of manufacturing thereof
06/13/2012EP2463900A2 Method for manufacturing a circuit assembly
06/13/2012EP2463898A1 Method for fabricating a memory cell array in a nonvolatile memory
06/13/2012EP2463897A1 Integrating n-type and p-type metal gate transistors field
06/13/2012EP2463896A1 Method for forming through-substrate vias surrounded by isolation trenches
06/13/2012EP2463895A1 Isolation for semiconductor devices
06/13/2012EP2463894A1 Silicon carbide power devices with self-aligned source and well regions and methods of fabricating same
06/13/2012EP2463893A2 Graphene structure and method of fabricating the same
06/13/2012EP2463892A1 Device, assembly and method for detecting alignment errors
06/13/2012EP2463673A1 Phase interpolator, semiconductor device, and method for testing the same
06/13/2012EP2463404A1 Aminovinylsilane for cvd and ald sio2 films
06/13/2012EP2463073A1 Resin mold for imprinting and method for producing same
06/13/2012EP2463046A1 Cu-Al ALLOY POWDER, ALLOY PASTE UTILIZING SAME, AND ELECTRONIC COMPONENT
06/13/2012EP2462626A2 Barrier-coated thin-film photovoltaic cells
06/13/2012EP2462624A2 Electronic device including graphene-based layer(s),and/or method of making the same
06/13/2012EP2462621A1 Semiconductor arrangement comprising a schottky diode
06/13/2012EP2462620A1 Semiconductor arrangement and method for producing it
06/13/2012EP2462615A1 Ohmic connection using widened connection zones in a portable electronic object
06/13/2012EP2462612A2 Formation of silicon oxide using non-carbon flowable cvd processes
06/13/2012EP2462611A2 Amorphous multicomponent dielectric based on the mixture of high band gap and high k materials, respective devices and manufacture
06/13/2012EP2462610A1 High breakdown voltage embedded mim capacitor structure
06/13/2012EP2462256A1 Apparatus
06/13/2012EP2177278B1 Method of cleaning substrate
06/13/2012EP1959483B1 Double-disc grinding machine, static pressure pad, and double-disc grinding method using the same for semiconductor wafer
06/13/2012EP1906438B1 Method for cutting workpiece
06/13/2012EP1902462B1 Fluid deposition cluster tool
06/13/2012EP1875494B1 Method of fabricating a heterojunction bipolar transistor
06/13/2012EP1792346B1 High-mobility bulk silicon pfet fabrication method
06/13/2012EP1724815B1 Aligner, device manufacturing method, maintenance method and aligning method
06/13/2012EP1697983B1 Highly efficient gallium nitride based light emitting diodes having surface roughening
06/13/2012EP1692724B1 Semiconductor memory device with increased node capacitance
06/13/2012EP1630856B1 Mutilayer film reflector and x-ray exposure system
06/13/2012EP1516350B1 Plasma processor with electrode simultaneously responsive to plural frequencies
06/13/2012EP1485944B1 Radiation assisted direct imprint lithography
06/13/2012EP1460682B1 Method and apparatus for etching silicon wafer and method for analysis of impurities
06/13/2012EP1396017B1 An isotropic etch to form mim capacitor top plates
06/13/2012EP1116278B1 Bipolar transistor and method for producing same
06/13/2012EP1017266B1 System for delivering a substantially constant vapor flow to a chemical process reactor
06/13/2012CN202275864U 用于led产业设备蚀刻的承载治具 Carrying fixtures led industrial equipment for etching
06/13/2012CN202275812U 晶圆承载组合 Wafer carrier combination
06/13/2012CN202275811U 一种粘贴治具 One kind of paste Fixture
06/13/2012CN202275810U 一种oled光罩存储装置 One kind of storage device oled mask
06/13/2012CN202275809U 一种分离治具 An isolated Fixture
06/13/2012CN202275808U 一种大幅面张装rfid倒装贴片装置 One kind of large format sheets mounted flip-Chip device rfid
06/13/2012CN202275807U Tube core to tube core bonding system
06/13/2012CN202275806U 一种gsm移动电话通讯卡的封装设备 One kind of gsm mobile phone communication card packaging equipment
06/13/2012CN202275805U 一种热合半导体器件的压盘 A heat platen of the semiconductor device
06/13/2012CN202275804U 一种用于制造液晶及oled面板的湿刻机水洗槽喷嘴 A method of manufacturing a liquid crystal panel and oled wet etching machine nozzle for washing tank
06/13/2012CN202270861U 一种用于边环的整形工装结构 Plastic tooling structure for edge ring
06/13/2012CN1959529B Method of forming etching mask
06/13/2012CN1956222B Semiconductor device and method for fabricating the same
06/13/2012CN1906767B Semiconductor device and method for manufacturing same
06/13/2012CN1898056B Laser processing protection sheet and production method for laser processed article
06/13/2012CN1812123B Resonant tunneling device using metal oxide semiconductor processing
06/13/2012CN1783487B Circuit device and its producing method
06/13/2012CN102498586A Flexible capacitive micromachined ultrasonic transducer array with increased effective capacitance
06/13/2012CN102498581A Process for the manufacture of wafers for solar cells at ambient pressure
06/13/2012CN102498570A Light-emitting device and method for manufacturing the same
06/13/2012CN102498569A Dual dielectric tri-gate field effect transistor
06/13/2012CN102498566A Memory devices with enhanced isolation of memory cells, systems including same and methods of forming same
06/13/2012CN102498565A Method for manufacturing a semiconductor device
06/13/2012CN102498562A Flexible circuit module
06/13/2012CN102498561A Method for manufacturing semiconductor device
06/13/2012CN102498560A Conductive structure for narrow interconnect openings
06/13/2012CN102498559A Substrate holder system, substrate joining apparatus and method for manufacturing a device
06/13/2012CN102498558A Dual temperature heater
06/13/2012CN102498557A CVD apparatus
06/13/2012CN102498556A Substrate transfer mechanism with preheating features
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