Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2012
06/14/2012WO2012077738A1 Fine-structure laminate, method for preparing fine-structure laminate, and production method for fine-structure laminate
06/14/2012WO2012077682A1 Semiconductor device and display apparatus
06/14/2012WO2012077680A1 Method for producing substrate, method for producing semiconductor device, and substrate treatment device
06/14/2012WO2012077652A1 Etching monitoring apparatus
06/14/2012WO2012077602A1 Thin film transistor array substrate
06/14/2012WO2012077599A1 Ceramic composite for photoconversion, and method for manufacture thereof
06/14/2012WO2012077592A1 Chemical mechanical polishing pad and chemical mechanical polishing method using same
06/14/2012WO2012077581A1 Semiconductor device
06/14/2012WO2012077573A1 Electrode structure, organic thin-film transistor provided with said electrode structure, method for manufacturing same, organic electroluminescent picture element provided with said organic thin-film transistor, organic electroluminescent element, device provided with said organic electroluminescent element, and organic solar cell
06/14/2012WO2012077547A1 Load lock device
06/14/2012WO2012077518A1 Perovskite manganese oxide thin film and production method for same
06/14/2012WO2012077517A1 Perovskite manganese oxide thin film
06/14/2012WO2012077513A1 Group iii nitride semiconductor device and method for producing same
06/14/2012WO2012077512A1 Zinc oxide sintered compact, sputtering target, and zinc oxide thin film
06/14/2012WO2012077495A1 Laser annealing device and laser annealing method
06/14/2012WO2012077471A1 Auxiliary sheet for laser dicing
06/14/2012WO2012077447A1 Method for mounting semiconductor elements, and mounted body
06/14/2012WO2012077443A1 Method for manufacturing semiconductor device
06/14/2012WO2012077330A1 Semiconductor device, method for manufacturing same, solid-state imaging device, method for manufacturing same, and electronic information device
06/14/2012WO2012077298A1 Thin-film forming apparatus and thin-film forming method
06/14/2012WO2012077296A1 Power supply device
06/14/2012WO2012077280A1 Design support device and design support method for three-dimensional integrated circuit
06/14/2012WO2012077271A1 Charged particle beam apparatus
06/14/2012WO2012077256A1 Semiconductor device and method for manufacturing same
06/14/2012WO2012077228A1 Lead-free solder alloy, semiconductor device, and method for manufacturing semiconductor device
06/14/2012WO2012077178A1 Semiconductor device
06/14/2012WO2012077174A1 Nonvolatile storage device and method for manufacturing same
06/14/2012WO2012077163A1 Silicon oxynitride film and method for forming same, and semiconductor device
06/14/2012WO2012077079A1 Process for annealing semiconductor wafers with flat dopant depth profiles
06/14/2012WO2012077071A1 Apparatus and method for depositing a layer onto a substrate
06/14/2012WO2012077063A1 Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon films
06/14/2012WO2012077060A1 Substrate for integrated circuit package with selective exposure of bonding compound and method of making thereof
06/14/2012WO2012077032A1 Methods and apparatus for integrating and controlling a plasma processing system
06/14/2012WO2012076745A1 A voltage-tunable phase shifter and associated methods
06/14/2012WO2012076618A1 Process for treating a structure of semiconductor on insulator type
06/14/2012WO2012076262A1 Adhesive compound and method for encapsulating an electronic arrangement
06/14/2012WO2012076259A1 Semiconductor component having increased stability relative to thermomechanical influences, and method for contacting a semiconductor
06/14/2012WO2012076216A1 Methods and apparatus for inspection of articles, euv lithography reticles, lithography apparatus and method of manufacturing devices
06/14/2012WO2012076207A1 Electrostatic clamp, lithographic apparatus and method of manufacturing an electrostatic clamp
06/14/2012WO2012075735A1 Method for manufacturing semiconductor wafer
06/14/2012WO2012075722A1 Mos device with memory function and method for making the same
06/14/2012WO2012075670A1 Semiconductor device and manufacturing method thereof
06/14/2012WO2012075661A1 Device with channel stress adjustable and manufacturing method thereof
06/14/2012WO2012075647A1 Fluid supplying system and method thereof
06/14/2012WO2012058011A3 Interconnect structure with enhanced reliability
06/14/2012WO2012057963A3 High purity aluminum coating hard anodization
06/14/2012WO2012054711A3 Power/ground layout for chips
06/14/2012WO2012054238A3 Chamber lid heater ring assembly
06/14/2012WO2012054200A3 Dual delivery chamber design
06/14/2012WO2012054149A3 Apparatus and method for compensation of variability in chemical mechanical polishing consumables
06/14/2012WO2012053784A3 Apparatus for eliminating particles using air blowing
06/14/2012WO2012053774A3 Method for performing an antistatic treatment on a surface of a work stage, and work stage to the surface of which an antistatic treatment is applied according to the method
06/14/2012WO2012051451A3 Highly efficient plasmonic devices, molecule detection systems, and methods of making the same
06/14/2012WO2012051120A3 Two silicon-containing precursors for gapfill enhancing dielectric liner
06/14/2012WO2012051081A3 Method for integrated circuit manufacturing and mask data preparation using curvilinear patterns
06/14/2012WO2012050812A3 Semiconductor die having fine pitch electrical interconnects
06/14/2012WO2012050376A3 Ultrathin wafer micro-machining method and apparatus by laser rail-roading technique
06/14/2012WO2012047816A3 Apparatus and methods for evaporation including test wafer holder and apparatus and methods for detecting evaporation conditions
06/14/2012WO2012047811A3 Apparatus and methods for uniform metal plating
06/14/2012WO2012047780A3 Fabrication of replacement metal gate devices
06/14/2012WO2012044980A3 Gallium arsenide based materials used in thin film transistor applications
06/14/2012WO2012044733A3 Non-contact determination of joint integrity between a tsv die and a package substrate
06/14/2012WO2012044704A3 Integration of cluster mocvd and hvpe reactors with other process chambers
06/14/2012WO2012044702A3 Method and system for providing tool induced shift using a sub-sampling scheme
06/14/2012WO2012040732A3 Methods and architectures for bottomless interconnect vias
06/14/2012WO2012040505A3 Processing systems and apparatuses having a shaft cover
06/14/2012WO2012039982A3 Air gap formation
06/14/2012WO2012037536A3 Packaging to reduce stress on microelectromechanical systems
06/14/2012WO2012033338A3 Probe card and method for manufacturing same
06/14/2012WO2012033299A3 Production method for a semiconductor element
06/14/2012WO2012012691A3 Nonvolatile flash memory structures including fullerene molecules and methods for manufacturing the same
06/14/2012WO2012005983A3 Precise temperature control for teos application by heat transfer fluid
06/14/2012WO2011159691A3 Chemical vapor deposition of ruthenium films containing oxygen or carbon
06/14/2012US20120150478 Method of testing an object and apparatus for performing the same
06/14/2012US20120149213 Bottom up fill in high aspect ratio trenches
06/14/2012US20120149212 Cvd method and cvd reactor
06/14/2012US20120149211 Method of forming pattern, method of manufacturing semiconductor device, and method of manufacturing template
06/14/2012US20120149210 Systems, apparatuses, and methods for chemically processing substrates using the coanda effect
06/14/2012US20120149209 Process sequencing for hpc ald system
06/14/2012US20120149208 Substrate processing apparatus and method of manufacturing semiconductor device
06/14/2012US20120149207 Method for etching organic hardmasks
06/14/2012US20120149206 Plasma etching method and computer-readable storage medium
06/14/2012US20120149205 Method for fabricating side contact in semiconductor device
06/14/2012US20120149204 Method of forming via holes
06/14/2012US20120149203 Method for forming stair-step structures
06/14/2012US20120149202 Method for fabricating semiconductor device
06/14/2012US20120149201 Method for forming stair-step structures
06/14/2012US20120149200 Nitride etch for improved spacer uniformity
06/14/2012US20120149199 Sample contamination method
06/14/2012US20120149198 Method for producing a semiconductor wafer
06/14/2012US20120149197 Manufacturing method of device and planarization process
06/14/2012US20120149196 Method for etching a material in the presence of solid particles
06/14/2012US20120149195 Method for manufacturing integrated circuit device
06/14/2012US20120149194 Substrate Support with Gas Introduction Openings
06/14/2012US20120149193 Method for manufacturing a semiconductor memory device
06/14/2012US20120149192 Methods for depositing metal in high aspect ratio features
06/14/2012US20120149191 METAL CAP WITH ULTRA-LOW k DIELECTRIC MATERIAL FOR CIRCUIT INTERCONNECT APPLICATIONS
06/14/2012US20120149190 Semiconductor device
06/14/2012US20120149189 Hydrogen passivation of integrated circuits
06/14/2012US20120149188 Semiconductor device and method of manufacturing semiconductor device
1 ... 978 979 980 981 982 983 984 985 986 987 988 989 990 991 992 993 994 995 996 997 998 ... 6590