Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2012
06/14/2012US20120149187 Non-volatile semiconductor memory device and method of manufacturing the same
06/14/2012US20120149186 Formation of gate dielectrics with uniform nitrogen distribution
06/14/2012US20120149185 Methods Of Manufacturing Semiconductor Devices
06/14/2012US20120149184 Methods of manufacturing self aligned buried contact electrodes for vertical channel transistors
06/14/2012US20120149183 Schottky diode switch and memory units containing the same
06/14/2012US20120149182 Dopant Applicator System and Method of Applying Vaporized Doping Compositions to PV Solar Wafers
06/14/2012US20120149181 Method for manufacturing semiconductor wafer
06/14/2012US20120149180 Combinatorial process system
06/14/2012US20120149179 Method of manufacturing semiconductor device
06/14/2012US20120149178 Process for Making a Slot-Type Optical Waveguide on Silicon
06/14/2012US20120149177 Method of producing epitaxial silicon wafer
06/14/2012US20120149176 Method and apparatus for forming a iii-v family layer
06/14/2012US20120149175 Method of cleaning silicon carbide semiconductor
06/14/2012US20120149174 Method for thinning and dicing electronic circuit wafers
06/14/2012US20120149173 3d integrated circuit device fabrication with precisely controllable substrate removal
06/14/2012US20120149172 Method for fabricating trench isolation structure
06/14/2012US20120149171 Shallow Trench Isolation with Improved Structure and Method of Forming
06/14/2012US20120149170 Method for manufacturing semiconductor device
06/14/2012US20120149169 Method for manufacturing mask
06/14/2012US20120149168 Process for Producing a Multifunctional Dielectric Layer on a Substrate
06/14/2012US20120149167 Phase change memory device having buried conduction lines directly underneath phase change memory cells and fabrication method thereof
06/14/2012US20120149166 METHOD OF FORMING TITANIUM NITRADE (TiN) FILM, NONVOLATILE MEMORY DEVICE USING THE TiN FILM, AND METHOD OF MANUFACTURING THE NONVOLATILE MEMORY DEVICE
06/14/2012US20120149165 Method of manufacturing variable resistance memory device
06/14/2012US20120149164 Methods for forming resistive-switching metal oxides for nonvolatile memory elements
06/14/2012US20120149163 Phase change memory device with alternating adjacent conduction contacts and fabrication method thereof
06/14/2012US20120149162 Method for manufacturing suspended fin and gate-all-around field effect transistor
06/14/2012US20120149161 Method for fabricating semiconductor device
06/14/2012US20120149160 Layout method of semiconductor device with junction diode for preventing damage due to plasma charge
06/14/2012US20120149159 Structure and method for mobility enhanced mosfets with unalloyed silicide
06/14/2012US20120149158 Flattening method of a substrate
06/14/2012US20120149157 Semiconductor device and method for manufacturing semiconductor device
06/14/2012US20120149156 Methods of manufacturing semiconductor devices
06/14/2012US20120149155 Electronic Assemblies Including Mechanically Secured Protruding Bonding Conductor Joints
06/14/2012US20120149154 Pre-bonded substrate for integrated circuit package and method of making the same
06/14/2012US20120149153 Thin Semiconductor Device Having Embedded Die Support and Methods of Making the Same
06/14/2012US20120149152 Method to prevent metal pad damage in wafer level package
06/14/2012US20120149151 Method of manufacturing semiconductor device, manufacturing program, and manufacturing apparatus
06/14/2012US20120149150 Vented die and package
06/14/2012US20120149149 Four mosfet full bridge module
06/14/2012US20120149148 Method and system for template assisted wafer bonding
06/14/2012US20120149147 Semiconductor device and manufacturing method thereof
06/14/2012US20120149146 Confined resistance variable memory cell structures and methods
06/14/2012US20120149142 Betavoltaic battery with a shallow junction and a method for making same
06/14/2012US20120149137 Methods of Combinatorial Processing For Screening Multiple Samples on a Semiconductor Substrate
06/14/2012US20120149136 Fabrication method of semiconductor integrated circuit device
06/14/2012US20120149135 Semiconductor device manufacturing method that allows rework rate in manufacturing step to decrease
06/14/2012US20120149134 Methods and apparatus for thinning, testing and singulating a semiconductor wafer
06/14/2012US20120149133 Mems process method for high aspect ratio structures
06/14/2012US20120148949 Resin composition for printing plate
06/14/2012US20120148852 Silane coating compositions, coating systems, and methods
06/14/2012US20120148378 Substrate transfer apparatus, substrate process system, and substrate transfer method
06/14/2012US20120148374 Linear semiconductor processing facilities
06/14/2012US20120148187 Integrated circuit package connected to a data transmission medium
06/14/2012US20120148186 Process for fabricating semiconductor devices and semiconductor devices
06/14/2012US20120148184 Semiconductor optical modulator and method for manufacturing the same
06/14/2012US20120147906 Laser cooling of modified soi wafer
06/14/2012US20120147681 Methods, devices, and systems relating to a memory cell having a floating body
06/14/2012US20120147676 Non-volatile storage system with shared bit lines connected to single selection device
06/14/2012US20120147675 Nonvolatile Stacked Nand Memory
06/14/2012US20120147666 Phase change material cell with stress inducer liner
06/14/2012US20120147652 Three dimensional non-volatile storage with asymmetrical vertical select devices
06/14/2012US20120147650 Non-Volatile Memory Having 3D Array of Read/Write Elements with Vertical Bit Lines and Select Devices and Methods Thereof
06/14/2012US20120147649 Non-Volatile Memory Having 3d Array of Read/Write Elements with Low Current Structures and Methods Thereof
06/14/2012US20120147644 Continuous mesh three dimensional non-volatile storage with vertical select devices
06/14/2012US20120147350 Spectral purity filter, lithographic apparatus, and method for manufacturing a spectral purity filter
06/14/2012US20120146741 Transformer with bypass capacitor
06/14/2012US20120146736 Mems vibrator, oscillator, and method for manufacturing mems vibrator
06/14/2012US20120146728 Compound semiconductor device and method of manufacturing the same
06/14/2012US20120146713 Transistors And Electronic Devices Including The Same
06/14/2012US20120146711 Power Domain Controller With Gated Through Silicon Via Having FET With Horizontal Channel
06/14/2012US20120146710 Fuse Device
06/14/2012US20120146452 Microelectromechanical system device and semi-manufacture and manufacturing method thereof
06/14/2012US20120146273 Receiving device for receiving semiconductor substrates
06/14/2012US20120146246 Integrated circuit packaging system with dielectric support and method of manufacture thereof
06/14/2012US20120146241 Integrated circuit packaging system with bump conductors and method of manufacture thereof
06/14/2012US20120146238 Method for Packaging Semiconductor Dies Having Through-Silicon Vias
06/14/2012US20120146237 Semiconductor device and method for manufacturing the same
06/14/2012US20120146236 Semiconductor Device and Method of Forming Openings Through Insulating Layer Over Encapsulant for Enhanced Adhesion of Interconnect Structure
06/14/2012US20120146235 Integrated circuit packaging system with vertical interconnection and method of manufacture thereof
06/14/2012US20120146234 Semiconductor device package and method of manufacturing thereof
06/14/2012US20120146232 Electronic device and method of manufacturing electronic device
06/14/2012US20120146231 Semiconductor Device and Method of Manufacture Thereof
06/14/2012US20120146230 Integrated circuit packaging system with interconnects and method of manufacture thereof
06/14/2012US20120146229 Integrated circuit packaging system with vertical interconnection and method of manufacture thereof
06/14/2012US20120146228 Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device
06/14/2012US20120146226 Integrated circuit chip and fabrication method
06/14/2012US20120146223 Mos device with memory function and manufacturing method thereof
06/14/2012US20120146221 Method for fabricating semiconductor device with side contact
06/14/2012US20120146220 Semiconductor integrated-circuit device and method of producing the same
06/14/2012US20120146218 Semiconductor package device with cavity structure and the packaging method thereof
06/14/2012US20120146216 Semiconductor package and fabrication method thereof
06/14/2012US20120146214 Semiconductor device with vias and flip-chip
06/14/2012US20120146213 High performance low profile qfn/lga
06/14/2012US20120146212 Solder bump connections
06/14/2012US20120146210 Compliant interconnects in wafers
06/14/2012US20120146209 Packaging substrate having through-holed interposer embedded therein and fabrication method thereof
06/14/2012US20120146208 Semiconductor module and manufacturing method thereof
06/14/2012US20120146207 Stacked structure and stacked method for three-dimensional chip
06/14/2012US20120146206 Pin attachment
06/14/2012US20120146204 Semiconductor devices and electrical parts manufacturing using metal coated wires
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