| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/21/2012 | DE102010063296A1 Herstellungsverfahren mit reduzierter STI-Topograpie für Halbleiterbauelemente mit einer Kanalhalbleiterlegierung Production process with reduced STI Topograpie for semiconductor devices with a channel semiconductor alloy |
| 06/21/2012 | DE102010063294A1 Metallisierungssysteme von Halbleiterbauelementen, die eine Kupfer/Silizium-Verbindung als ein Barrierenmaterial aufweisen Metallization of semiconductor devices which have a copper / silicon compound as a barrier material |
| 06/21/2012 | DE102010063292A1 Gering diffundierte Drain- und Sourcegebiete in CMOS-Transistoren für Anwendungen mit hoher Leistungsfähigkeit und geringer Leistung Low diffused drain and source regions in CMOS transistors for applications with high performance and low power |
| 06/21/2012 | DE102010063179A1 Verfahren zur gleichzeitigen Material abtragenden Bearbeitung beider Seiten mindestens dreier Halbleiterscheiben Process for the simultaneous material removing machining of both sides of at least three semiconductor wafers |
| 06/21/2012 | DE102010063178A1 Verfahren zur Reinigung einer Halbleiterscheibe aus Silizium unmittelbar nach einer Politur der Halbleiterscheibe A method for cleaning a semiconductor wafer of silicon immediately after polishing of the semiconductor wafer |
| 06/21/2012 | DE102010063048A1 Verfahren zur Herstellung einer elektronischen Baugruppe mit Formkörper A process for producing an electronic assembly with molded articles |
| 06/21/2012 | DE102010062823A1 Klebmasse und Verfahren zur Kapselung einer elektronischen Anordnung Adhesive and method for encapsulating an electronic arrangement |
| 06/21/2012 | DE102010055266A1 Electrical component i.e. microelectronic component, for creating operation voltage in LCD backlight unit in e.g. laptop, has chip for connecting arms to terminal, where surface of chip is arranged at retention device in non-contact manner |
| 06/21/2012 | DE102010053712A1 Verfahren zum Zerteilen und/oder Zerkleinern von Siliziumblöcken, Siliziumplatten oder Siliziumstäben Method for cutting and / or grinding of silicon ingots, silicon wafers or silicon rods |
| 06/21/2012 | DE102010003556B4 Verfahren zur Herstellung von Kontaktelementen eines Halbleiterbauelements durch stromloses Plattieren und Entfernung von überschüssigem Material mit geringeren Scherkräften Process for the preparation of contact elements of a semiconductor device by electroless plating and removal of excess material with lower shear forces |
| 06/21/2012 | DE102009046877B4 Erhöhung der Selektivität während der Herstellung einer Kanalhalbleiterlegierung durch einen nassen Oxidationsprozess Increasing the selectivity during the production of a semiconductor alloy channel by a wet oxidation process |
| 06/21/2012 | DE102009020540B4 Verfahren und Vorrichtung zum Herstellen einer elektronischen Baugruppe und mit dem Verfahren oder in der Vorrichtung hergestellte elektronische Baugruppe Method and apparatus for manufacturing an electronic assembly prepared by the method and in the device or electronic assembly |
| 06/21/2012 | DE102007063793A1 Halbleiterleistungsmodul The semiconductor power module |
| 06/21/2012 | DE102007057688B4 Verfahren zur Herstellung eines Halbleiterbauelements mit verspanntem Zwischenschichtdielektrikum unter Anwendung einer Ätzsteuerzwischenschicht mit erhöhter Dicke A process for producing a semiconductor device with strained interlayer using a thickness-increased Ätzsteuerzwischenschicht |
| 06/21/2012 | DE102006062871B4 Simultaneous double-side grinding providing method for semiconductor wafer, involves machining semiconductor wafers in material-removing fashion between rotating upper working disk and lower working disk |
| 06/21/2012 | DE102006044691B4 Verfahren zum Herstellen einer Anschlussleitstruktur eines Bauelements A method of manufacturing a component of a Anschlussleitstruktur |
| 06/21/2012 | DE102006012755B4 Verfahren zur Herstellung von Halbleiterbauelementen Process for the preparation of semiconductor devices |
| 06/21/2012 | DE102005031702B4 Transistorstruktur eines Speicherbauelements und Verfahren zur Herstellung desselben Of the same transistor structure of a memory device and methods for preparing |
| 06/21/2012 | DE102005008600B9 Chipträger, System aus einem Chipträger und Halbleiterchips und Verfahren zum Herstellen eines Chipträgers und eines Systems Chip carrier system comprising a chip carrier and a semiconductor chip and method of manufacturing a chip carrier and a system |
| 06/21/2012 | DE102004020270B4 Laserstrahl-Bearbeitungsmaschine Laser beam processing machine |
| 06/21/2012 | DE10165046B4 Verfahren zum Herstellen einer Schaltungsplatte unter Anwendung einer Zusammensetzung zum Mikroätzen A method of manufacturing a circuit board by applying a composition for microetching |
| 06/21/2012 | CA2820904A1 Nanowire epitaxy on a graphitic substrate |
| 06/20/2012 | EP2466634A1 Integration of shallow trench isolation and through-substrate vias into integrated circuit designs |
| 06/20/2012 | EP2466633A1 High efficiency electrostatic chuck assembly for semiconductor wafer processing |
| 06/20/2012 | EP2466632A2 Methods for directly bonding together semiconductor structures, and bonded semiconductor structures formed using such methods |
| 06/20/2012 | EP2466631A1 Substrate module and manufacturing method thereof |
| 06/20/2012 | EP2466630A1 Method for applying liquid material, application device and programme |
| 06/20/2012 | EP2466629A2 A method and a structure for enhancing electrical insulation and dynamic performance of mis structures comprising vertical field plates |
| 06/20/2012 | EP2466628A1 Bipolar transistor manufacturing method and bipolar transistor |
| 06/20/2012 | EP2466627A1 Etching method |
| 06/20/2012 | EP2466626A2 Relaxation and transfer of strained material layers |
| 06/20/2012 | EP2466625A2 Exposure apparatus, exposure method, and method for producing device |
| 06/20/2012 | EP2466624A2 Exposure apparatus, exposure method, and method for producing device |
| 06/20/2012 | EP2466623A2 Exposure apparatus, exposure method, and method for producing device |
| 06/20/2012 | EP2466622A2 Exposure apparatus, exposure method, and method for producing device |
| 06/20/2012 | EP2466621A2 Exposure apparatus, exposure method, and method for producing device |
| 06/20/2012 | EP2466620A2 Exposure apparatus and method for producing device |
| 06/20/2012 | EP2466619A2 Exposure apparatus and method for producing device |
| 06/20/2012 | EP2466618A2 Exposure apparatus and method for producing device |
| 06/20/2012 | EP2466617A2 Exposure apparatus and method for producing device |
| 06/20/2012 | EP2466616A2 Exposure apparatus and method for producing device |
| 06/20/2012 | EP2466615A2 Exposure apparatus and method for producing device |
| 06/20/2012 | EP2465976A1 Method of electroplating uniform copper layer on the edge and walls of though holes of a substrate |
| 06/20/2012 | EP2465971A2 Apparatus for forming layer |
| 06/20/2012 | EP2465969A2 Copper alloy sputtering target and manufacturing method of said target |
| 06/20/2012 | EP2465888A1 Polymer compound and method for producing the same |
| 06/20/2012 | EP2465140A1 Heterojunction oxide non-volatile memory device |
| 06/20/2012 | EP2465137A1 Method for manufacturing a single crystal nano-wire. |
| 06/20/2012 | EP2465136A2 Pulsed deposition and recrystallization and tandem solar cell design utilizing crystallized/amorphous material |
| 06/20/2012 | EP2465135A1 System and method for picking and placement of chip dies |
| 06/20/2012 | EP2242870B1 Method using new metal precursors containing beta-diketiminato ligands |
| 06/20/2012 | EP2219225B1 Oxide semiconductor material, method for manufacturing oxide semiconductor material, electronic device and field effect transistor |
| 06/20/2012 | EP2187717B1 Circuit board manufacturing method |
| 06/20/2012 | EP2161292B1 Epoxy resin composition |
| 06/20/2012 | EP1924962B1 Device for encapsulating a plurality of electronic identification tags |
| 06/20/2012 | EP1753016B1 Exposure apparatus and device producing method |
| 06/20/2012 | EP1746637B1 Drive method for mobile body, stage device, and exposure device |
| 06/20/2012 | EP1736572B1 Group iii nitride crystal substrate, method for producing same, and group iii nitride semiconductor device |
| 06/20/2012 | EP1382117B1 A field programmable gate array and microcontroller system-on-a-chip |
| 06/20/2012 | EP1269528B1 Method of forming a dielectric film |
| 06/20/2012 | CN202282375U 太阳能电池板激光刻线检测装置 Solar panels laser scribing detecting means |
| 06/20/2012 | CN202282373U 与组框机相配合的真空平台吸平装置 Cooperating with the group box machine flat vacuum suction device platform |
| 06/20/2012 | CN202282341U 能够防止芯片产生缺口裂纹的缓冲装置 Cushioning device can prevent the chip gap cracks |
| 06/20/2012 | CN202282340U 搬送机夹具硅片固定装置 Conveying machine fixture silicon fixtures |
| 06/20/2012 | CN202282339U 光罩盒的安装底座 Mask box mounting base |
| 06/20/2012 | CN202282338U Oled基片线性传输装置 Oled substrate linear transfer devices |
| 06/20/2012 | CN202282337U 太阳能电池板传送缓存装置 Solar panels transport buffer means |
| 06/20/2012 | CN202282336U 硅片存储装置释压缓冲器 Wafer press release buffer storage device |
| 06/20/2012 | CN202282335U 垂直炉管 Vertical tube |
| 06/20/2012 | CN202282334U 一种自吸式隔水装置 A self-priming watertight device |
| 06/20/2012 | CN202282333U 硅片背面缺陷正面打点的定位结构 The back of the silicon wafer defect RBI positive positioning structure |
| 06/20/2012 | CN202281863U 半导体芯片封装观察装置 A semiconductor chip package observation apparatus |
| 06/20/2012 | CN202281042U 外延设备的工艺管路系统 Epitaxy process piping systems equipment |
| 06/20/2012 | CN1992294B Semiconductor device and method for manufacturing the same |
| 06/20/2012 | CN1989601B Methods of fabricating nitride-based transistors with a cap layer and a recessed gate |
| 06/20/2012 | CN1913146B Thin film conductor and method of fabrication |
| 06/20/2012 | CN1901205B 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof |
| 06/20/2012 | CN1892216B Equipment and method for measuring silicon concentration in phosphoric acid solution |
| 06/20/2012 | CN1839306B Detection of macro-defects using micro-inspection inputs |
| 06/20/2012 | CN1837838B Measuring method, inspection method, inspection device for semiconductor device |
| 06/20/2012 | CN1723571B Microelectromechanical systems device and its manufacture method |
| 06/20/2012 | CN1670943B Operating method of the memory |
| 06/20/2012 | CN1664697B Manufacturing method for exposure mask, generating method for mask substrate information |
| 06/20/2012 | CN1652022B Manufacture method of exposure mask |
| 06/20/2012 | CN102511082A Semiconductor device and method for manufacturing the same |
| 06/20/2012 | CN102511081A Method and structure for forming high-performance FETs with embedded stressors |
| 06/20/2012 | CN102511080A Passivating glue layer to improve amorphous carbon to metal adhesion |
| 06/20/2012 | CN102511078A Semiconductor device having a copper plug |
| 06/20/2012 | CN102511077A Adhesive film and tape for semiconductor wafer processing |
| 06/20/2012 | CN102511076A Optimized halo or pocket cold implants |
| 06/20/2012 | CN102511075A Epitaxial substrate and method for producing same |
| 06/20/2012 | CN102511074A Process for producing silicon carbide substrate, process for producing semiconductor device, silicon carbide substrate, and semiconductor device |
| 06/20/2012 | CN102511073A Modular substrate processing system and method |
| 06/20/2012 | CN102511072A Seasoning plasma processing systems |
| 06/20/2012 | CN102510663A Printed board component and processing method thereof |
| 06/20/2012 | CN102509754A Dispensing arm structure for die bonder |
| 06/20/2012 | CN102509748A Diffusion technology for reducing dark current of metallurgical silicon solar battery |
| 06/20/2012 | CN102509746A Diffusion process for crystalline silicon solar cell |
| 06/20/2012 | CN102509745A Energy-saving and emission-reducing diffusion process for crystalline silicon solar cell |
| 06/20/2012 | CN102509744A Conveying mechanism |