Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
---|
06/06/2012 | CN101606227B Placing bed structure, treating apparatus using the structure, and method for using the apparatus |
06/06/2012 | CN101582322B Inductance coupling coil and plasma processing device adopting same |
06/06/2012 | CN101578230B Process for forming and controlling rough interfaces |
06/06/2012 | CN101562183B Single gate nonvolatile memory cell with transistor and capacitor and making method thereof |
06/06/2012 | CN101546694B Method for forming pattern of a semiconductor device |
06/06/2012 | CN101533785B Methods of forming a thin TIM coreless high density bump-less package and structures formed thereby |
06/06/2012 | CN101527286B Semiconductor module and method of producing the same |
06/06/2012 | CN101521158B Plasma etching method and plasma etching apparatus |
06/06/2012 | CN101517703B Coating/developing apparatus, coating/developing apparatus control method |
06/06/2012 | CN101499471B Anti-electrostatic discharge input resistance and its production method |
06/06/2012 | CN101488478B Integrated method for protecting polycrystalline and substrate surface |
06/06/2012 | CN101488477B Integrated method for protecting polycrystalline and substrate surface |
06/06/2012 | CN101482746B Communication method between clustering equipment control system and process control system |
06/06/2012 | CN101479833B Film formation composition |
06/06/2012 | CN101467100B Positive photosensitive resin composition containing polymer having ring structure |
06/06/2012 | CN101451234B Ti film forming method and film forming device |
06/06/2012 | CN101410950B Growth method using nanostructure compliant layers and HVPE for producing high quality compound semiconductor materials |
06/06/2012 | CN101409217B Method of forming an electrical circuit with overlaying integration layer |
06/06/2012 | CN101356637B Producing a covered through substrate via using a temporary cap layer |
06/06/2012 | CN101356629B Composition and method for recycling semiconductor wafers having low-K dielectric materials thereon |
06/06/2012 | CN101335320B Method for manufacturing light emitting device |
06/06/2012 | CN101312152B Bit line contact forming method |
06/06/2012 | CN101295712B Trench metal oxide semiconductor |
06/06/2012 | CN101261995B Nonvolatile memory devices and methods of forming the same |
06/06/2012 | CN101257004B Wiring structure, forming method of the same and printed wiring board |
06/06/2012 | CN101248221B Process for producing semiconductor substrate |
06/06/2012 | CN101246910B Metal-insulator-metal type capacitor and production method thereof |
06/06/2012 | CN101202232B Method for forming semiconductor device and semiconductor device |
06/06/2012 | CN101197256B Method for forming interlaminar capacitor |
06/06/2012 | CN101191967B Liquid crystal display device array substrate and its manufacture method |
06/06/2012 | CN101183659B Groove isolation technology employed on the surface of silicon chip |
06/06/2012 | CN101170063B Etching liquid management device |
06/06/2012 | CN101050348B Etchant composition, composition for polishing, method for producing polishing composition and polishing method |
06/06/2012 | CN101043007B Preparing technique for metallic oxide silicon field-effect transistor |
06/06/2012 | CA2761204A1 Microcircuit device manufacturing process |
06/05/2012 | USRE43450 Method for fabricating semiconductor thin film |
06/05/2012 | USRE43444 Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes |
06/05/2012 | USRE43443 Leadframe semiconductor integrated circuit device using the same, and method of and process for fabricating the two |
06/05/2012 | US8196084 Voltage fluctuation estimating method and apparatus, semiconductor device operation verification apparatus, semiconductor device designing method, printed circuit board designing method, and program |
06/05/2012 | US8196071 Creating mask data of integrated circuit patterns using calculated etching conversion difference |
06/05/2012 | US8196070 Mask fabrication supporting method, mask blank providing method, and mask blank dealing system |
06/05/2012 | US8195020 Resonator for thermo optic device |
06/05/2012 | US8194969 Method and apparatus for visual inspection |
06/05/2012 | US8194896 Packaging structure and method of a MEMS microphone |
06/05/2012 | US8194714 Light emitting and receiving device |
06/05/2012 | US8194445 Semiconductor storage device comprising dot-type charge accumulation portion and control gate, and method of manufacturing the same |
06/05/2012 | US8194384 High temperature electrostatic chuck and method of using |
06/05/2012 | US8194219 High quality and ultra large screen liquid crystal display device and production method thereof |
06/05/2012 | US8194181 Camera module capable of calibration |
06/05/2012 | US8193879 Semiconductor integrated circuit device |
06/05/2012 | US8193827 Measuring method, inspection method, inspection device, semiconductor device, method of manufacturing a semiconductor device, and method of manufacturing an element substrate |
06/05/2012 | US8193700 Organic light emitting device and manufacturing method thereof |
06/05/2012 | US8193649 Substrate for a display panel, and a display panel having the same |
06/05/2012 | US8193648 Method for detecting errors of exposed positions of a pre-layer and a current layer by an integrated alignment and overlay mark |
06/05/2012 | US8193647 Semiconductor device package with an alignment mark |
06/05/2012 | US8193642 Interlayer insulating film, interconnection structure, and methods of manufacturing the same |
06/05/2012 | US8193634 Mounted semiconductor device and a method for making the same |
06/05/2012 | US8193628 Printed wiring board, a method of manufacturing printed wiring board, a sensor module, and a sensing device |
06/05/2012 | US8193627 IC chip mounting package provided with IC chip located in device hole formed within a package base member |
06/05/2012 | US8193623 Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices |
06/05/2012 | US8193618 Semiconductor die package with clip interconnection |
06/05/2012 | US8193612 Complimentary nitride transistors vertical and common drain |
06/05/2012 | US8193607 Memory cell having GeN-containing material and variable resistance material embedded within insulating material |
06/05/2012 | US8193605 Bipolar junction transistor integrated with PIP capacitor and method for making the same |
06/05/2012 | US8193600 Shared-pixel-type image sensor and method of fabricating the same |
06/05/2012 | US8193594 Two-terminal switching devices and their methods of fabrication |
06/05/2012 | US8193593 Multi-layer gate dielectric |
06/05/2012 | US8193591 Transistor and method with dual layer passivation |
06/05/2012 | US8193587 Manufacturing method of semiconductor device, manufacturing method of display device, semiconductor device, display device, and electronic device |
06/05/2012 | US8193586 Sealing structure for high-K metal gate |
06/05/2012 | US8193583 Monolithic output stage with vertical high-side PMOS and vertical low-side NMOS interconnected using buried metal, structure and method |
06/05/2012 | US8193582 Semiconductor device and method of manufacturing the same |
06/05/2012 | US8193578 Power supply circuit having a semiconductor device including a MOSFET and a Schottky junction |
06/05/2012 | US8193577 Nonvolatile semiconductor memory device |
06/05/2012 | US8193576 Semiconductor memory device and method of fabricating the same |
06/05/2012 | US8193573 Repairing defects in a nonvolatile semiconductor memory device utilizing a heating element |
06/05/2012 | US8193571 Stacked type nonvolatile semiconductor memory device and method of manufacturing same |
06/05/2012 | US8193554 Optical member having photocurable resin and method for manufacturing the optical member |
06/05/2012 | US8193549 Surface-textured encapsulations for use with light emitting diodes |
06/05/2012 | US8193546 Light-emitting-diode array with polymer between light emitting devices |
06/05/2012 | US8193534 Array substrate of thin film transistor liquid crystal display and method of manufacturing the same |
06/05/2012 | US8193533 Display device having thin film transistors |
06/05/2012 | US8193532 Thin film integrated circuit device, IC label, container comprising the thin film integrated circuit, manufacturing method of the thin film integrated circuit device, manufacturing method of the container, and management method of product having the container |
06/05/2012 | US8193531 Semiconductor device and manufacturing method thereof |
06/05/2012 | US8193524 Nanoelectronic device |
06/05/2012 | US8193468 Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure |
06/05/2012 | US8193388 Compounds for depositing tellurium-containing films |
06/05/2012 | US8193103 CCD sensors with multiple contact patterns |
06/05/2012 | US8193102 Process for directing assemblies of particulate dispersions using surface roughness |
06/05/2012 | US8193101 Substrate processing apparatus and semiconductor device manufacturing method for forming film |
06/05/2012 | US8193100 Exposure mask manufacturing method, drawing apparatus, semiconductor device manufacturing method, and mask blanks product |
06/05/2012 | US8193099 Protecting exposed metal gate structures from etching processes in integrated circuit manufacturing |
06/05/2012 | US8193098 Method for manufacturing semiconductor device |
06/05/2012 | US8193097 Plasma processing apparatus and impedance adjustment method |
06/05/2012 | US8193096 High dose implantation strip (HDIS) in H2 base chemistry |
06/05/2012 | US8193095 Method for forming silicon trench |
06/05/2012 | US8193094 Post CMP planarization by cluster ION beam etch |
06/05/2012 | US8193093 Thru silicon enabled die stacking scheme |
06/05/2012 | US8193092 Semiconductor devices including a through-substrate conductive member with an exposed end and methods of manufacturing such semiconductor devices |
06/05/2012 | US8193091 Resin encapsulated semiconductor device and method for manufacturing the same |