Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2012
06/06/2012EP2460178A1 Surface treatment of silicon
06/06/2012EP2460177A2 Post ion implant stripper for advanced semiconductor application
06/06/2012EP2460176A1 Method for removing substrate layers
06/06/2012EP2460173A1 A mask health monitor using a faraday probe
06/06/2012EP2459779A1 Composition for metal plating comprising suppressing agent for void free submicron feature filling
06/06/2012EP2459778A2 Composition for metal plating comprising suppressing agent for void free submicron feature filling
06/06/2012EP2459769A2 Method for fabricating copper-containing ternary and quaternary chalcogenide thin films
06/06/2012EP2196565B1 Method for producing sic epitaxial substrate
06/06/2012EP1962326B1 Reflection-type mask blank for euv lithography, and substrate with electrically conductive film for the mask blank
06/06/2012EP1957600B1 Adjuvant for controlling polishing selectivity and chemical mechanical polishing slurry comprising the same
06/06/2012EP1951929B1 Composition for chemical vapor deposition film-formation and method for production of low dielectric constant film
06/06/2012EP1891492B1 Process change detection through the use of evolutionary algorithms
06/06/2012EP1814144B1 Substrate processing method and device production system
06/06/2012EP1685598B1 Automated material handling system
06/06/2012EP1678744B1 Positioning device and method for transferring electronic components
06/06/2012EP1670038B1 Optical element and exposure apparatus
06/06/2012EP1554757B1 Semiconductor apparatus and fabrication method of the same
06/06/2012EP1535324B1 Method of manufacturing cmos devices by the implantation of n- and p-type cluster ions and negative ions
06/06/2012DE19936560B4 Berührungssignalfühler Touch signal probe
06/06/2012DE112010003326T5 Nahinfrarot-Absorbierende Dünnschichtzusammensetzungen Near-infrared absorbent thin film compositions
06/06/2012DE112009003808T5 Verfahren zur Herstellung einer Halteplatte zur Verwendung in einer elektrostatischen Haltevorrichtung A process for producing a support plate for use in an electrostatic chuck
06/06/2012DE10321509B4 Verfahren zum Füllen blinder Durchkontaktierungen und zum Bilden einer Elektrode Method for filling blind vias and for forming an electrode
06/06/2012DE102011087279A1 Verfahren zur Herstellung eines Halbleiterbauelements A process for producing a semiconductor device
06/06/2012DE102011087272A1 Halbleiterherstellungs- und -prüfverfahren, Prüfvorrichtung und Prüfsystem Semiconductor manufacturing inspection and test procedures, test fixture and test system
06/06/2012DE102011055884A1 Gedruckte Schaltplatine für ein Halbleitergehäuse zum Verbessern der Lötverbindungszuverlässigkeit und Halbleitergehäuse dieselbe enthaltend Printed circuit board for a semiconductor package for improving the Lötverbindungszuverlässigkeit and semiconductor package containing the same
06/06/2012DE102010062453A1 Halbleiterbauelement mit erhöhter Stabilität gegenüber thermomechanischen Einflüssen sowie Verfahren zur Kontaktierung eines Halbleiters A semiconductor device having increased stability against thermo-mechanical influences as well as method for contacting a semiconductor
06/06/2012DE102010062448A1 Method for manufacturing silicon carbide (SiC) semiconductor structure for FET device, involves depositing silicon dioxide-high temperature oxide layer on polysilicon layer after thermal oxidation of substrate at specific temperature
06/06/2012DE102010062386A1 Verfahren zum Konvertieren von Halbleiterschichten A method for converting semiconductor layer
06/06/2012DE102010062383A1 Verfahren zum Konvertieren von Halbleiterschichten A method for converting semiconductor layer
06/06/2012DE102010062346A1 Method for manufacturing molded electronic assembly for brake and engine control device of vehicle, involves pre-treating surface of electronic component such that no encapsulation material is attached at treated surface of component
06/06/2012DE102010053392A1 Tub-shaped power semiconductor module for circuit device utilized in electrical system of e.g. electric vehicle, has multiple power terminals and control and auxiliary terminal arranged on tub walls
06/06/2012DE102010053214A1 Verfahren zur Wasserstoffpassivierung von Halbleiterschichten A method of hydrogen passivation of semiconductor layers
06/06/2012DE102010052863A1 Verfahren zur Herstellung eines Solarmoduls und ein Solarmodul A process for producing a solar module and a solar module
06/06/2012DE102010052861A1 Verfahren zur Herstellung eines Solarmoduls A process for producing a solar module
06/06/2012DE102009061089A1 Testing device for testing electrical properties of photovoltaic module panel, has testing unit designed as retaining device that enables spatial manipulation of panel, where testing unit comprises holding units for fixing panel
06/06/2012DE102009004392B4 Datenerzeugungsverfahren für Halbleitervorrichtung und Elektronenstrahlbelichtungssystem Data forming method for the semiconductor device and electron beam exposure system
06/06/2012DE102008047865B4 Schaltungsanordnung und Verfahren zum Herstellen einer Schaltungsanordnung Circuit arrangement and method for manufacturing a circuit arrangement
06/06/2012DE102007035898B4 Verfahren zur Herstellung eines Halbleiterbauelements A process for producing a semiconductor device
06/06/2012DE102004017284B4 Integrierte Halbleiterschaltung und Verfahren zur Prüfung der integrierten Halbleiterschaltung A semiconductor integrated circuit and method for testing the semiconductor integrated circuit
06/06/2012DE10042881B4 CVD-Einrichtung zum Bilden eines Halbleiterfilms auf einem Wafer und Verfahren zum Beurteilen von Wartungszeiten einer CVD- Einrichtung CVD apparatus for forming a semiconductor film on a wafer and method of judging a maintenance time CVD device
06/06/2012CN202268378U 一种晶体硅太阳能电池扩散用石英舟 A crystalline silicon solar cell proliferation quartz boat
06/06/2012CN202268338U 一种用于装片装置中辅助定位半导体基片的定位盖板 A method for loading the auxiliary positioning means positioning the semiconductor substrate plate
06/06/2012CN202268337U Loading device and plasma processing equipment with loading device
06/06/2012CN202268336U 一种清洗硅片用清洗筐 A cleaning wafer cleaning basket
06/06/2012CN202268335U 能够装配不同尺寸晶圆盒的承载机构 Different sizes can be fitted cassette-loading mechanism
06/06/2012CN202268334U 一种用于辅助固定干法刻蚀工艺中装片装置的防护盖板 A protective cover fixed dry process assisted etching devices are installed sheet
06/06/2012CN202268333U 一种轴向二极管切脚机 An axially diode Cutting Machine
06/06/2012CN202268332U 一种湿刻机水洗槽喷杆 One kind of wet etching machine wash tank lance
06/06/2012CN202265198U Feed box transmission system
06/06/2012CN202264139U 研磨工具 Grinding tools
06/06/2012CN1970412B Substrate transporting device capable of steer conveying substrate in perpendicular angle
06/06/2012CN1943037B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
06/06/2012CN1873836B Method of manufacture of semiconductor device and conductive compositions used therein
06/06/2012CN1866540B 半导体设备及其制造方法 Semiconductor device and manufacturing method thereof
06/06/2012CN1755957B Method for fabricating a nitride semiconductor light-emitting device
06/06/2012CN1636640B Cleaning solution production method, cleaning method using the cleaning solution
06/06/2012CN1612043B Lithographic apparatus and device manufacturing method
06/06/2012CN102487128A Light-scattering substrate, method of manufacturing the same, organic light-emitting display device, and method of manufacturing organic light-emitting display device
06/06/2012CN102487111A Manufacture method for semiconductor light-emitting chip
06/06/2012CN102487109A Horizontal graphite boat
06/06/2012CN102487101A Pretreatment apparatus and pretreatment method
06/06/2012CN102487087A Thin-film transistor applied to three-dimensional on-chip integration system and manufacturing method of thin film transistor
06/06/2012CN102487086A Device capable of adjusting channel strain and method thereof
06/06/2012CN102487085A Semiconductor device and manufacture method thereof
06/06/2012CN102487084A MOSFET (metal-oxide-semiconductor field effect transistor) and manufacturing method thereof
06/06/2012CN102487083A MOSFET (metal-oxide-semiconductor field effect transistor) and manufacturing method thereof
06/06/2012CN102487081A Compound semiconductor device and method of manufacturing same
06/06/2012CN102487080A Compound semiconductor device and manufacturing method thereof
06/06/2012CN102487079A Compound semiconductor device and method of manufacturing same
06/06/2012CN102487078A Insulated gate bipolar power tube and manufacture method thereof
06/06/2012CN102487077A Vertical parasitic PNP device in BiCMOS (Bipolar Complementary Metal-Oxide-Semiconductor) process and preparation method thereof
06/06/2012CN102487074A Compound semiconductor device and manufacturing method thereof
06/06/2012CN102487073A Source/drain stressor having enhanced carrier mobility and method for manufacturing same
06/06/2012CN102487071A Organic light-emitting display apparatus and method of manufacturing same
06/06/2012CN102487066A Cascaded high pressure junction field effect transistor
06/06/2012CN102487065A System on chip (SOC) architecture and manufacturing method thereof
06/06/2012CN102487064A Display apparatus and method of manufacturing display apparatus
06/06/2012CN102487059A Stacked package structure
06/06/2012CN102487058A Semiconductor chip, semiconductor package, and method for manufacturing semiconductor chip
06/06/2012CN102487057A Metal front dielectric layer and preparation method thereof
06/06/2012CN102487056A Dummy metal in integrated circuit and method for manufacturing integrated circuit plate
06/06/2012CN102487054A Semiconductor device and method of manufacturing same, and power supply apparatus
06/06/2012CN102487053A Semiconductor device and method of manufacturing same
06/06/2012CN102487052A Composite material packaging assembly with integration of chip substrate, heat sink and substrate and manufacture method thereof
06/06/2012CN102487051A 半导体装置及其制造方法 Semiconductor device and manufacturing method
06/06/2012CN102487050A Power semiconductor device and method for manufacturing the same
06/06/2012CN102487049A Semiconductor substrate and preparation method thereof
06/06/2012CN102487048A Method for forming semiconductor device
06/06/2012CN102487047A Method for forming semiconductor structure
06/06/2012CN102487046A Silicon-based photoelectric heterogeneous medium integration method applicable to optical interconnection system in chip
06/06/2012CN102487045A Production method of semiconductor device
06/06/2012CN102487044A Array substrate, preparation method thereof and electric paper display
06/06/2012CN102487043A Array substrate, manufacturing method thereof and electronic paper display device
06/06/2012CN102487042A Array substrate, manufacturing method and detection method thereof and liquid crystal panel
06/06/2012CN102487041A Array substrate, manufacturing method thereof and electronic paper display device
06/06/2012CN102487040A Method for forming through hole
06/06/2012CN102487039A Preparation method of semiconductor device
06/06/2012CN102487038A 铜互连结构及其形成方法 Copper interconnect structure and method of forming
06/06/2012CN102487037A Method for releasing local stress of film in buffering high-temperature technology
06/06/2012CN102487036A Manufacturing method of interconnection structure
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