Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2012
06/07/2012US20120142192 Oxide-rich liner layer for flowable cvd gapfill
06/07/2012US20120142191 Chemical Mechanical Planarization Composition And Method With Low Corrosiveness
06/07/2012US20120142190 Method for manufacturing through-silicon via
06/07/2012US20120142189 Method for fabricating semiconductor device
06/07/2012US20120142188 Anchored damascene structures
06/07/2012US20120142187 Semiconductor device with through substrate via
06/07/2012US20120142186 Method for manufacturing interposer
06/07/2012US20120142185 Methods of manufacturing a semiconductor device
06/07/2012US20120142184 Manufacturing method of semiconductor structure
06/07/2012US20120142183 Aluminum enhanced palladium cmp process
06/07/2012US20120142182 Microelectronic structure by selective deposition
06/07/2012US20120142181 Cmos structure and method for fabrication thereof using multiple crystallographic orientations and gate materials
06/07/2012US20120142180 Method of manufacturing semiconductor device
06/07/2012US20120142179 Method of manufacturing semiconductor device
06/07/2012US20120142178 Semiconductor device and method of manufacturing the same
06/07/2012US20120142177 Methods of manufacturing a wiring structure and methods of manufacturing a semiconductor device
06/07/2012US20120142176 Methods of Forming Semiconductor Devices
06/07/2012US20120142175 Dual spacer formation in flash memory
06/07/2012US20120142174 Method and apparatus for enhanced lifetime and performance of ion source in an ion implantation system
06/07/2012US20120142173 Manufacturing method of silicon carbide single crystal
06/07/2012US20120142172 Pecvd deposition of smooth polysilicon films
06/07/2012US20120142171 Method of forming a high capacitance diode
06/07/2012US20120142170 Method of forming photonic crystals
06/07/2012US20120142169 Programmable metallization memory cell with planarized silver electrode
06/07/2012US20120142168 III-V Compound Crystal and Semiconductor Electronic Circuit Element
06/07/2012US20120142167 Method of manufacturing semiconductor device and semiconductor device
06/07/2012US20120142166 Stacking fault and twin blocking barrier for integrating iii-v on si
06/07/2012US20120142165 Method of Avoiding Resin Outflow from the Wafer Scribe line in WLCSP
06/07/2012US20120142164 Integrated high voltage capacitor having capacitance uniformity structures and a method of manufacture therefor
06/07/2012US20120142163 P+ polysilicon material on aluminum for non-volatile memory device and method
06/07/2012US20120142162 Semiconductor device and method for fabricating the same
06/07/2012US20120142161 Methods for manufacturing a phase-change memory device
06/07/2012US20120142160 Method of fabricating semiconductor device using deuterium annealing
06/07/2012US20120142159 Method for fabricating semiconductor device
06/07/2012US20120142158 Self-Aligned Nanotube Field Effect Transistor and Method of Fabricating Same
06/07/2012US20120142157 Method of fabricating a semiconductor structure
06/07/2012US20120142156 Insulated gate type semiconductor device and method for fabricating the same
06/07/2012US20120142155 High aspect ratio trench structures with void-free fill material
06/07/2012US20120142154 Production method for semiconductor device
06/07/2012US20120142153 Non-volatile memory device and method for fabricating the same
06/07/2012US20120142152 Methods Of Forming Memory Cells
06/07/2012US20120142151 Semiconductor device having insulated gate field effect transistors and method of manufacturing the same
06/07/2012US20120142150 Method for forming metal gate and mos transistor
06/07/2012US20120142149 Cascoded high voltage junction field effect transistor
06/07/2012US20120142148 Method of manufacturing high frequency device structure
06/07/2012US20120142147 Wiring board with built-in electronic component and method for manufacturing the same
06/07/2012US20120142146 Method of manufacturing layered chip package
06/07/2012US20120142145 Semiconductor device manufacturing method
06/07/2012US20120142144 Wafer Level Structures and Methods for Fabricating and Packaging MEMS
06/07/2012US20120142142 Method of manufacturing a semiconductor structure
06/07/2012US20120142141 Method of forming resistance variable memory device
06/07/2012US20120142135 Method of fabricating sensors having functionalized resonating beams
06/07/2012US20120142129 Method of manufacturing semiconductor laser having diffraction grating
06/07/2012US20120142128 Array substrate for in-plane switching mode liquid crystal display device having double-layered metal patterns and method of fabricating the same
06/07/2012US20120142125 Photoluminescence imaging systems for silicon photovoltaic cell manufacturing
06/07/2012US20120142123 Algainn-based lasers produced using etched facet technology
06/07/2012US20120142122 Method of inspecting and processing semiconductor wafers
06/07/2012US20120142121 Hydrochloric acid etch and low temperature epitaxy in a single chamber for raised source-drain fabrication
06/07/2012US20120141731 Fabrication of microstructures and nanostructures using etching resist
06/07/2012US20120141246 Substrate holding apparatus, substrate holding method, and substrate processing apparatus
06/07/2012US20120141235 Dual arm robot
06/07/2012US20120140929 Integrated circuits secure from invasion and methods of manufacturing the same
06/07/2012US20120140570 EEPROM with Increased Reading Speed
06/07/2012US20120140543 One Time Programming Memory and Method of Storage and Manufacture of the Same
06/07/2012US20120140523 Dc-dc converter and manufacturing method thereof
06/07/2012US20120140200 Immersion photolithography system and method using microchannel nozzles
06/07/2012US20120139872 Semiconductor device
06/07/2012US20120139630 Compound semiconductor device and method of manufacturing the same
06/07/2012US20120139192 Chucking device and chucking method
06/07/2012US20120139133 Sealing glass for semiconductor device, sealing material, sealing material paste, and semiconductor device and its production process
06/07/2012US20120139131 Wafer mold material and method for manufacturing semiconductor apparatus
06/07/2012US20120139130 Semiconductor Device
06/07/2012US20120139128 semiconductor package and a method for selecting a chip in the semiconductor package
06/07/2012US20120139127 Method for forming isolation trenches
06/07/2012US20120139126 Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package
06/07/2012US20120139125 Multi-chip package and method of manufacturing thereof
06/07/2012US20120139124 Stacked microelectronic assembly with tsvs formed in stages with plural active chips
06/07/2012US20120139123 Offset solder vias, methods of manufacturing and design structures
06/07/2012US20120139122 Semiconductor device and manufacturing method thereof
06/07/2012US20120139121 Integrated circuit packaging system with pad connection and method of manufacture thereof
06/07/2012US20120139120 Semiconductor Device and Method of Forming Openings Through Encapsulant to Reduce Warpage and Stress on Semiconductor Package
06/07/2012US20120139118 Semiconductor chip, semiconductor package, and method for manufacturing semiconductor chip for reducing open failures
06/07/2012US20120139116 Bumpless build-up layer and laminated core hybrid structures and methods of assembling same
06/07/2012US20120139114 Copper interconnect structure having a graphene cap
06/07/2012US20120139113 Undercut-repair of barrier layer metallurgy for solder bumps and methods thereof
06/07/2012US20120139112 Selective Seed Layer Treatment for Feature Plating
06/07/2012US20120139109 Printed circuit board for semiconductor package configured to improve solder joint reliability and semiconductor package having the same
06/07/2012US20120139105 Semiconductor structure and manufacturing method thereof
06/07/2012US20120139104 Integrated circuit packaging system with pad connection and method of manufacture thereof
06/07/2012US20120139103 Semiconductor device with stacked power converter
06/07/2012US20120139102 Disposing underfill in an integrated circuit structure
06/07/2012US20120139100 Laminated transferable interconnect for microelectronic package
06/07/2012US20120139095 Low-profile microelectronic package, method of manufacturing same, and electronic assembly containing same
06/07/2012US20120139094 Stacked microelectronic assembly having interposer connecting active chips
06/07/2012US20120139093 In-situ foam material as integrated heat spreader (ihs) sealant
06/07/2012US20120139089 Module ic package structure and method for making the same
06/07/2012US20120139088 Silicon wafer and method for heat-treating silicon wafer
06/07/2012US20120139086 Method for reducing intermixing between films of a patterning process, patterning process, and device manufactured by the patterning process
06/07/2012US20120139085 Structure and Method for Topography Free SOI Integration
06/07/2012US20120139084 Ohmic contact structure for group iii nitride semiconductor device having improved surface morphology and well-defined edge features
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