Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2012
06/19/2012US8202806 Method to avoid threshold voltage shift in thicker dielectric films
06/19/2012US8202805 Substrate processing method
06/19/2012US8202803 Method to remove capping layer of insulation dielectric in interconnect structures
06/19/2012US8202802 Method of fabricating semiconductor device
06/19/2012US8202801 Method of fabricating a semiconductor device with through substrate via
06/19/2012US8202800 Method of forming through silicon via with dummy structure
06/19/2012US8202799 Methods of manufacturing metal-silicide features
06/19/2012US8202798 Improvements for reducing electromigration effect in an integrated circuit
06/19/2012US8202797 Integrated circuit system with recessed through silicon via pads and method of manufacture thereof
06/19/2012US8202796 Method of forming vias in silicon carbide and resulting devices and circuits
06/19/2012US8202795 Method of fabricating a semiconductor device having a plug
06/19/2012US8202794 Method of manufacturing field effect transistor having Ohmic electrode in a recess
06/19/2012US8202793 Inclusion-free uniform semi-insulating group III nitride substrates and methods for making same
06/19/2012US8202792 Method of processing a substrate having a non-planar surface
06/19/2012US8202791 Method for generating two dimensions for different implant energies
06/19/2012US8202790 Semiconductor device and method of manufacturing the same
06/19/2012US8202789 Implanting a solar cell substrate using a mask
06/19/2012US8202788 Method for fabricating GaNAsSb semiconductor
06/19/2012US8202787 Method for manufacturing SOI wafer
06/19/2012US8202786 Method for manufacturing semiconductor devices having a glass substrate
06/19/2012US8202785 Surface treatment for molecular bonding
06/19/2012US8202784 Semiconductor device having a high aspect ratio isolation trench and method for manufacturing the same
06/19/2012US8202783 Patternable low-k dielectric interconnect structure with a graded cap layer and method of fabrication
06/19/2012US8202782 Method of manufacturing transistor
06/19/2012US8202781 Semiconductor device having vertical pillar transistors and method for manufacturing the same
06/19/2012US8202780 Method for manufacturing a FinFET device comprising a mask to define a gate perimeter and another mask to define fin regions
06/19/2012US8202779 Methods for forming a memory cell having a top oxide spacer
06/19/2012US8202778 Patterning a gate stack of a non-volatile memory (NVM) with simultaneous etch in non-NVM area
06/19/2012US8202777 Transistor with an embedded strain-inducing material having a gradually shaped configuration
06/19/2012US8202776 Method for protecting a gate structure during contact formation
06/19/2012US8202774 Semiconductor memory device including multi-layer gate structure
06/19/2012US8202773 Engineered oxygen profile in metal gate electrode and nitrided high-k gate dielectrics structure for high performance PMOS devices
06/19/2012US8202772 Vertical junction field effect transistors having sloped sidewalls and methods of making
06/19/2012US8202771 Manufacturing method of organic semiconductor device
06/19/2012US8202770 Semiconductor structure of a display device and method for fabricating the same
06/19/2012US8202769 Semiconductor device and manufacturing method thereof
06/19/2012US8202768 Method of fabricating a semiconductor device
06/19/2012US8202767 Device and method of reducing junction leakage
06/19/2012US8202766 Method for fabricating through-silicon via structure
06/19/2012US8202765 Achieving mechanical and thermal stability in a multi-chip package
06/19/2012US8202763 Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
06/19/2012US8202762 Stack package having reduced electrical connection length suitable for high speed operations and method of manufacturing the same
06/19/2012US8202761 Manufacturing method of metal oxide nanostructure and electronic element having the same
06/19/2012US8202757 Image sensor and method for manufacturing the same
06/19/2012US8202756 Organic EL device
06/19/2012US8202754 Packaged microelectronic devices recessed in support member cavities, and associated methods
06/19/2012US8202753 LED having vertical structure and method for fabricating the same
06/19/2012US8202752 Method for fabricating light emitting semiconductor device for reducing defects of dislocation in the device
06/19/2012US8202751 Flip-chip light emitting diodes and method of manufacturing thereof
06/19/2012US8202750 Method of manufacturing semiconductor device, semiconductor laser, optical pickup, and optical disk device with nitride type group III-V compound semiconductor layer
06/19/2012US8202749 Array of aligned and dispersed carbon nanotubes and method of producing the array
06/19/2012US8202748 Liquid crystal display apparatus and manufacturing method therefor
06/19/2012US8202747 Method for arranging a powder layer on a substrate and layer structure with at least one powder layer on a substrate
06/19/2012US8202746 Method of manufacturing LED package for formation of molding member
06/19/2012US8202745 Submounts for semiconductor light emitting devices and methods of forming packaged light emitting devices including dispensed encapsulants
06/19/2012US8202744 Wafer through silicon via forming method and equipment therefor
06/19/2012US8202743 Light emitting device and manufacturing method thereof
06/19/2012US8202742 Color control by alteration of wavelength converting element
06/19/2012US8202741 Method of bonding a semiconductor device using a compliant bonding structure
06/19/2012US8202740 Method of manufacturing a semiconductor device and a testing method of the same
06/19/2012US8202739 Dopant marker for precise recess control
06/19/2012US8202738 Endpoint method using peak location of modified spectra
06/19/2012US8202728 Substrates useful for cell culture and methods for making and using same
06/19/2012US8202693 Method of isolation of nucleic acids
06/19/2012US8202684 Method for manufacturing probe sheet
06/19/2012US8202622 Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same
06/19/2012US8202621 Opaque low resistivity silicon carbide
06/19/2012US8202572 TMR device with improved MgO barrier
06/19/2012US8202445 Metal polishing composition and chemical mechanical polishing method
06/19/2012US8202442 Spin-on protective coatings for wet-etch processing of microelectronic substrates
06/19/2012US8202439 Diaphragm and device for measuring cellular potential using the same, manufacturing method of the diaphragm
06/19/2012US8202435 Method for selectively etching areas of a substrate using a gas cluster ion beam
06/19/2012US8202429 Method for recovering a used slurry
06/19/2012US8202394 Method of manufacturing semiconductor devices and semiconductor manufacturing apparatus
06/19/2012US8202393 Alternate gas delivery and evacuation system for plasma processing apparatuses
06/19/2012US8202238 Method for manufacturing thin film integrated circuit device, noncontact thin film integrated circuit device and method for manufacturing the same, and idtag and coin including the noncontact thin film integrated circuit device
06/19/2012US8202139 Method of operating substrate processing apparatus and substrate processing apparatus
06/19/2012US8201517 Method for low temperature growth of inorganic materials from solution using catalyzed growth and re-growth
06/19/2012US8201329 Apparatus and method for manufacturing semiconductor device
06/19/2012CA2465195C Electrode assembly for the removal of surface oxides by electron attachment
06/16/2012WO2012019335A1 Device for positioning and loading silicon wafer in chemical-mechanical polishing apparatus
06/16/2012CA2806152A1 Apparatus for positioning and loading silicon wafers used in the chemical mechanical polishing equipments
06/14/2012WO2012079013A1 High density three-dimensional integrated capacitors
06/14/2012WO2012078876A1 Interconnect structure
06/14/2012WO2012078709A2 Compliant interconnects in wafers
06/14/2012WO2012078580A1 Process for selectively removing nitride from substrates
06/14/2012WO2012078530A1 System for wafer-level phosphor deposition
06/14/2012WO2012078419A2 Method for applying film, method for grinding back surface, method for forming semiconductor chip, and apparatus for applying film
06/14/2012WO2012078361A1 Method and system for template assisted wafer bonding
06/14/2012WO2012078225A1 STRUCTURE AND METHOD FOR Vt TUNING AND SHORT CHANNEL CONTROL WITH HIGH K/METAL GATE MOSFETs
06/14/2012WO2012078213A1 High density three-dimensional integrated capacitors
06/14/2012WO2012078198A1 Methods and apparatus for the production of high purity silicon
06/14/2012WO2012078163A1 Hydrogen passivation of integrated circuits
06/14/2012WO2012078162A1 Ferroelectric capacitor encapsulated with hydrogen barrier
06/14/2012WO2012078112A2 System, apparatus and method for vacuum based regulation of component flow and singulation
06/14/2012WO2012078025A1 A method of fabricating a semiconductor device
06/14/2012WO2012078009A2 Method for manufacturing a roll for roll printing/roll imprinting
06/14/2012WO2012077951A2 Flash memory using fringing effects and electrostatic shielding
06/14/2012WO2012077884A1 Method of fabricating semiconductor device using gang bonding and semiconductor device fabricated by the same
06/14/2012WO2012077797A1 Semiconductor laminate, semiconductor device, method for producing semiconductor laminate, and method for manufacturing semiconductor device
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