Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2012
06/28/2012US20120164833 Polishing Agent, Compound Semiconductor Manufacturing Method, and Semiconductor Device Manufacturing Method
06/28/2012US20120164832 Method for depositing tungsten film having low resistivity, low roughness and high reflectivity
06/28/2012US20120164831 Methods Of Forming Semiconductor Devices
06/28/2012US20120164830 Methods of fabricating semiconductor devices
06/28/2012US20120164829 Fabrication of through-silicon vias on silicon wafers
06/28/2012US20120164828 Hidden plating traces
06/28/2012US20120164827 Fabrication of through-silicon vias on silicon wafers
06/28/2012US20120164826 Methods of Forming Metal Patterns in Openings in Semiconductor Devices
06/28/2012US20120164825 Semiconductor package with a metal post and manufacturing method thereof
06/28/2012US20120164824 Method for fabricating a high-k metal gate mos
06/28/2012US20120164823 Split gate type non-volatile semiconductor memory device and method of manufacturing the same
06/28/2012US20120164822 Methods of fabricating high-k metal gate devices
06/28/2012US20120164821 Method of manufacturing semiconductor device
06/28/2012US20120164820 Semiconductor device fabricated using a metal microstructure control process
06/28/2012US20120164819 Apparatus and method for manufacturing poly-si thin film
06/28/2012US20120164818 Process for Cleaning Wafers
06/28/2012US20120164817 Method for manufacturing soi substrate
06/28/2012US20120164816 Method of manufacturing a semiconductor device
06/28/2012US20120164815 Method of forming element isolation layer
06/28/2012US20120164814 High voltage diode with reduced substrate injection
06/28/2012US20120164813 Resistor with improved switchable resistance and non-volatile memory device
06/28/2012US20120164812 Methods of Manufacturing Semiconductor Devices
06/28/2012US20120164811 Semiconductor device manufacturing method, wiring and semiconductor device
06/28/2012US20120164810 Method of manufacturing silicon carbide semiconductor device
06/28/2012US20120164809 Semiconductor devices including strained semiconductor regions, methods of fabricating the same, and electronic systems including the devices
06/28/2012US20120164808 Method for manufacturing semiconductor device
06/28/2012US20120164807 Method of fabricating a semiconductor device
06/28/2012US20120164806 Semiconductor device
06/28/2012US20120164805 Formation of a channel semiconductor alloy by forming a hard mask layer stack and applying a plasma-based mask patterning process
06/28/2012US20120164804 Methods of forming reverse mode non-volatile memory cell structures
06/28/2012US20120164803 Strained-induced mobility enhancement nano-device structure and integrated process architecture for cmos technologies
06/28/2012US20120164802 Advanced cmos using super steep retrograde wells
06/28/2012US20120164801 Semiconductor device and method of manufacturing the same
06/28/2012US20120164800 Method of manufacturing semiconductor device
06/28/2012US20120164799 Method of Forming a Semiconductor Device Comprising eFuses of Increased Programming Window
06/28/2012US20120164798 Methods of forming a nonvolatile memory cell and methods of forming an array of nonvolatile memory cells
06/28/2012US20120164797 Method of Manufacturing a Light Emitting, Power Generating or Other Electronic Apparatus
06/28/2012US20120164796 Method of Manufacturing a Printable Composition of a Liquid or Gel Suspension of Diodes
06/28/2012US20120164795 Ultrasonic Wire Bonding Method for a Semiconductor Device
06/28/2012US20120164794 Method of making a copper wire bond package
06/28/2012US20120164793 Power Semiconductor Device Package Method
06/28/2012US20120164792 Modular low stress package technology
06/28/2012US20120164791 Substrate for semiconductor package and method for manufacturing the same
06/28/2012US20120164790 Double-faced electrode package, and its manufacturing method
06/28/2012US20120164789 Three-Dimensional Semiconductor Device
06/28/2012US20120164788 Method of manufacturing semiconductor device including plural semiconductor chips stacked together
06/28/2012US20120164787 Vacuum wafer level packaging method for micro electro mechanical system device
06/28/2012US20120164786 Gallium nitride light emitting devices on diamond
06/28/2012US20120164778 Method of bonding by molecular bonding
06/28/2012US20120164776 Non-Wear Shutter Apparatus for a Vapor Deposition Apparatus
06/28/2012US20120164775 Electronic device, system, and method comprising differential sensor mems devices and drilled substrates
06/28/2012US20120164774 Methods of Manufacture MEMS Devices
06/28/2012US20120164766 Method of fabricating an active device array and fabricating an organic light emitting diode array
06/28/2012US20120164765 Localized annealing of metal-silicon carbide ohmic contacts and devices so formed
06/28/2012US20120164763 Surface inspection apparatus, method for inspecting surface, exposure system, and method for producing semiconductor device
06/28/2012US20120164761 Method for manufacturing lighting device
06/28/2012US20120164760 Complete recrystallization of semiconductor wafers
06/28/2012US20120164758 Ic having viabar interconnection and related method
06/28/2012US20120164757 Method for Junction Isolation to Reduce Junction Damage for a TMR Sensor
06/28/2012US20120163943 Vacuum processing apparatus
06/28/2012US20120163755 Method and System For Coupling Optical Signals Into Silicon Optoelectronic Chips
06/28/2012US20120163749 Integrated circuit with optical data communication
06/28/2012US20120163063 Complementary read-only memory (rom) cell and method for manufacturing the same
06/28/2012US20120162745 Display
06/28/2012US20120162744 Parallax barrier device and fabricating method thereof
06/28/2012US20120162648 Integrated photodiode wavelength monitor
06/28/2012US20120162585 Array substrate, manufacturing method thereof and lcd
06/28/2012US20120161856 Die power structure
06/28/2012US20120161361 Method for pouring resin in a stator of an electric machine, in particular an axial flux electric machine
06/28/2012US20120161339 Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus
06/28/2012US20120161338 Printable Composition of a Liquid or Gel Suspension of Two-Terminal Integrated Circuits and Apparatus
06/28/2012US20120161337 Wiring method for semiconductor integrated circuit, semiconductor-circuit wiring apparatus and semiconductor integrated circuit
06/28/2012US20120161336 Semiconductor device and assembling method thereof
06/28/2012US20120161334 Redundancy design with electro-migration immunity and method of manufacture
06/28/2012US20120161333 Device for connecting nano-objects to external electrical systems, and method for producing said device
06/28/2012US20120161332 Method for producing vias in fan-out wafers using dry film and conductive paste, and a corresponding semiconductor package
06/28/2012US20120161331 Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same
06/28/2012US20120161330 Device packaging with substrates having embedded lines and metal defined pads
06/28/2012US20120161329 Multi-level integrated circuit, device and method for modeling multi-level integrated circuits
06/28/2012US20120161328 Reticle set modification to produce multi-core dies
06/28/2012US20120161327 Shrinkage of Contact Elements and Vias in a Semiconductor Device by Incorporating Additional Tapering Material
06/28/2012US20120161326 Composition for filling through silicon via (tsv), tsv filling method and substrate including tsv plug formed of the composition
06/28/2012US20120161324 Semiconductor Device Comprising Contact Elements with Silicided Sidewall Regions
06/28/2012US20120161323 Substrate for package and method for manufacturing the same
06/28/2012US20120161322 Electronic component manufacturing method including step of embedding metal film
06/28/2012US20120161321 Semiconductor device contacts
06/28/2012US20120161320 Cobalt metal barrier layers
06/28/2012US20120161319 Ball grid array method and structure
06/28/2012US20120161317 Area array semiconductor device package interconnect structure with optional package-to-package or flexible circuit to package connection
06/28/2012US20120161316 Substrate with embedded stacked through-silicon via die
06/28/2012US20120161314 Template wafer and process for small pitch flip-chip interconnect hybridization
06/28/2012US20120161312 Non-solder metal bumps to reduce package height
06/28/2012US20120161310 Trap Rich Layer for Semiconductor Devices
06/28/2012US20120161308 Protecting T-Contacts of Chip Scale Packages from Moisture
06/28/2012US20120161305 Techniques for bonding substrates using an intermediate layer
06/28/2012US20120161304 Dual-leadframe Multi-chip Package and Method of Manufacture
06/28/2012US20120161302 Semiconductor device and method for manufacturing the same
06/28/2012US20120161301 Semiconductor package and fabrication method thereof
06/28/2012US20120161297 Semiconductor device and method for manufacturing the same
06/28/2012US20120161295 Cyclic carbosilane dielectric films
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