Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2012
06/28/2012DE102011088322A1 Verbindungssystem zum elektrischen Anschließen elektrischer Geräte und Verfahren zum Verbinden eines elektrisch leitenden ersten Anschlusses und eines elektrisch leitenden zweiten Anschlusses A connection system for electrically connecting electrical devices and methods for connecting an electrically conductive first terminal and a second terminal electrically conducting
06/28/2012DE102011084602A1 Halbleiterbauelement und Herstellungsverfahren desselben Of the same semiconductor device and manufacturing method
06/28/2012DE102011078243A1 Herstellungsverfahren für ein elektronisches Bauteil mit einem Schritt zur Einbettung einer Metallschicht Manufacturing method for an electronic component comprising a step of embedding a metal layer
06/28/2012DE102011057024A1 Verfahren und System zum Bereitstellen eines Fusing nach der Kapselung von Halbleiterbauelementen A method and system for providing a fusing after the encapsulation of semiconductor devices
06/28/2012DE102011056913A1 Dampfabscheidungsverfahren zur kontinuierlichen Abscheidung und Behandlung einer Dünnfilmschicht auf einem Substrat Vapor deposition method for continuous separation and treatment of a thin film layer on a substrate
06/28/2012DE102011056639A1 Verfahren zum Herstellen einer transparenten leitenden Oxidschicht und einer photovoltaischen Vorrichtung A method for producing a transparent conductive oxide layer and a photovoltaic device
06/28/2012DE102011012298A1 Verbundsubstrat, Halbleiterchip mit Verbundsubstrat und Verfahren zur Herstellung von Verbundsubstraten und Halbleiterchips Composite substrate, the semiconductor chip having the composite substrate and method for producing composite substrates and semiconductor chips
06/28/2012DE102010064291A1 Transistoren mit Metallgateelektrodenstrukturen mit großem ε mit einem polykristallinen Halbleitermaterial und eingebetteten verformungsinduzierenden Halbleiterlegierungen Transistors with metal gate electrode structures with large ε with a polycrystalline semiconductor material and embedded strain-inducing semiconductor alloys
06/28/2012DE102010064289A1 Größenreduzierung von Kontaktelementen und Kontaktdurchführungen in einem Halbleiterbauelement durch Einbau eines zusätzlichen Abschrägungsmaterials Size reduction of contact elements and vias in a semiconductor device by installing an additional Abschrägungsmaterials
06/28/2012DE102010064288A1 Halbleiterbauelement mit Kontaktelementen mit silizidierten Seitenwandgebieten Semiconductor component with contact elements with silicided sidewall areas
06/28/2012DE102010064287A1 Zuverlässige Einbettung von Metallsilizidkontaktgebieten in stark dotierten Drain- und Sourcegebieten durch eine Stoppimplantation Reliable embedding Metallsilizidkontaktgebieten in heavily doped drain and source regions by a stop implant
06/28/2012DE102010064284A1 Transistor mit einer eingebetteten Sigma-förmigen Halbleiterlegierung mit erhöhter Gleichmäßigkeit Transistor with an embedded sigma-shaped semiconductor alloy with increased uniformity
06/28/2012DE102010064283A1 Selbstjustierter Steg-Transistor, der auf einem Vollsubstrat durch eine späte Stegätzung hergestellt ist Self-aligned ridge-transistor which is fabricated on a bulk substrate by a late Stegätzung
06/28/2012DE102010064282A1 Transistor mit eingebetteten sigma-förmigen sequenziell hergestellten Halbleiterlegierungen Transistor with embedded sigma-shaped sequentially produced semiconductor alloys
06/28/2012DE102010064281A1 Herstellung einer Kanalhalbleiterlegierung durch Erzeugen eines Hartmaskenschichtstapels und Anwenden eines plasmaunterstützten Maskenstrukturierungsprozesses Preparing a semiconductor alloy channel by producing a stack of hard mask layer and applying a plasma assisted mask patterning process
06/28/2012DE102010064280A1 Verfahren zur Verringerung der Defektraten in PFET-Transistoren, die ein Si/GE Halbleitermaterial aufweisen, durch Vorsehen einer graduellen Ge-Konzentration, und entsprechende PFET-Transistoren A method of reducing the defect rate in PFET transistors having a Si / Ge semiconductor material, by providing a gradual Ge concentration, and corresponding PFET transistors
06/28/2012DE102010064247A1 Verfahren zur Herstellung einer Einpressdiode und Einpressdiode A method for producing a press-fit diode and press-fit diode
06/28/2012DE102010063907A1 Metallgateelektrodenstrukturen mit großem ε, die durch eine Deckschichtentfernung mit Opferabstandshalter hergestellt sind Metal gate electrode structures with large ε, which are prepared by removing a cover layer with sacrificial spacers
06/28/2012DE102010063823A1 Verfahren zur Herstellung von Hydridosilanen A process for preparing hydridosilanes
06/28/2012DE102010056409A1 Gruppe-III-Nitrid basierte Schichtenfolge, Halbleiterbauelement, umfassend eine Gruppe-III-Nitrid basierte Schichtenfolge und Verfahren zur Herstellung Group III-nitride based layer sequence semiconductor device comprising a Group III-nitride based layer sequence and methods for making
06/28/2012DE102010056056A1 Verfahren zur Herstellung eines elektrischen Anschlussträgers A method for manufacturing an electrical connection carrier
06/28/2012DE102010056046A1 Method for manufacturing wafer to manufacture e.g. photovoltaic cell that is utilized in solar industry for generation of electric current, involves neutralizing wafer surface with acid, where neutralization takes place by solution
06/28/2012DE102010055935A1 Verfahren zum Verbinden mehrerer ungehäuster Substrate A method for connecting a plurality of bare substrates
06/28/2012DE102010055623A1 Optoelectronic component, has bonding wire electrically connecting upper pad of semiconductor chip to contact region of support substrate, where bonding wire is secured at upper pad by two ball bumps
06/28/2012DE102007008989B4 Herstellungsverfahren für eine integrierte Halbleiterspeichervorrichtung und entsprechende Halbleiterspeichervorrichtung Manufacturing method for a semiconductor integrated memory device and corresponding semiconductor memory device
06/28/2012CA2818905A1 Systems and methods for generating a cross-product matrix in a single pass through data using single pass levelization
06/28/2012CA2816043A1 Improving toughness of polycrystalline diamond by incorporation of bulk metal foils
06/27/2012EP2469612A2 Method of manufacturing light emitting diode
06/27/2012EP2469606A2 Trench line for the disconnection of a solar cell
06/27/2012EP2469600A1 Semiconductor device
06/27/2012EP2469590A2 Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus
06/27/2012EP2469589A1 Device for connecting nano-objects to external electrical systems, and method for manufacturing the device
06/27/2012EP2469588A2 Susceptor for CVD Apparatus, CVD Apparatus and Substrate Heating Method using the Same
06/27/2012EP2469587A2 Groove processing tool and groove processing device for thin-film solar cell
06/27/2012EP2469586A1 Patterning device
06/27/2012EP2469585A2 Electronic parts mounting apparatus and electronic parts mounting method
06/27/2012EP2469584A1 Method of implanting ions
06/27/2012EP2469583A2 Stress modulated group iii-v semiconductor device and related method
06/27/2012EP2469582A2 Substrate processing method
06/27/2012EP2469581A1 Semiconductor element and production method thereof
06/27/2012EP2469580A1 Improved interface between a I-III-VI2 material layer and a molybdenum substrate
06/27/2012EP2469337A1 Positive photosensitive resin composition, method for forming pattern, and electronic component
06/27/2012EP2469331A1 Liquid crystal display device and method for manufacturing liquid crystal display device
06/27/2012EP2469271A1 Single-position Hall effect measurements
06/27/2012EP2468931A1 Method for cleaving a substrate
06/27/2012EP2468906A1 Method of manufacturing a Ni-Pt alloy
06/27/2012EP2468780A1 Copolymer and top coating composition
06/27/2012EP2468692A1 Tio2-containing silicia glass, and optical member for euv lithography
06/27/2012EP2468448A1 Laser machining method and chip
06/27/2012EP2467877A1 Anisotropic strain control in semipolar nitride quantum wells by partially or fully relaxed aluminum indium gallium nitride layers with misfit dislocations
06/27/2012EP2467874A2 Vias and conductive routing layers in semiconductor substrates
06/27/2012EP2467873A1 Method for etching of silicon surfaces
06/27/2012EP2467872A1 Semipolar nitride-based devices on partially or fully relaxed alloys with misfit dislocations at the heterointerface
06/27/2012EP2467871A1 Method for manufacturing a light-emitting diode device for emitting light
06/27/2012EP2467870A1 Method and device for determining a deformation of a disk-shaped workpiece, particularly a mold wafer
06/27/2012EP2467855A1 In-situ memory annealing
06/27/2012EP2467703A1 Method of inspecting and processing semiconductor wafers
06/27/2012EP2165359B1 Selective threshold voltage adjustment for high-k gate dielectric cmos
06/27/2012EP2126969B1 Method of interconnecting electronic wafers
06/27/2012EP2020031B1 Method for forming high performance 3d fet structures using preferential crystallographic etching
06/27/2012EP1887613B1 Method for manufacturing bonded wafer and outer-peripheral grinding machine of bonded wafer
06/27/2012EP1719012B9 Mems scanning system with improved performance
06/27/2012EP1631990B1 Method of manufacturing a field effect transistor
06/27/2012EP1526948B1 Uniform thin films produced by magnetorheological finishing
06/27/2012EP1454194B1 Method and apparatus for patterning a workpiece
06/27/2012EP1369906B1 Polishing compound and method for polishing substrate
06/27/2012EP1323191B1 Method for manufacturing a trench dmos transistor with embedded trench schottky rectifier
06/27/2012EP1090425B1 Methods of forming independently programmable memory segments in isolated N-wells within a PMOS EEPROM device
06/27/2012DE202010017703U1 Organisches optisches Bauelement, sowie Halbzeug zu seiner Herstellung Organic optical component, as well as semi-finished products for the production thereof
06/27/2012CN202285234U Semi-conductor device
06/27/2012CN202285230U 太阳能电池组件分解设备及其旋转卡具 Solar modules decomposition equipment and rotating fixtures
06/27/2012CN1964093B Nitride semiconductor device
06/27/2012CN1943988B Retainer ring, polishing head, and chemical mechanical polishing apparatus
06/27/2012CN1928722B Testing mark for detecting projection object lens image errors, mask and detection method
06/27/2012CN1893000B Method for manufacturing semiconductor device
06/27/2012CN1892982B Semiconductor wafer processing tape winding body, semiconductor wafer processing tape sticking apparatus and semiconductor wafer processing apparatus that use the semiconductor wafer processing tape w
06/27/2012CN1871699B Method for manufacturing compound semiconductor substrate
06/27/2012CN1866482B Thin film transistor and making method thereof
06/27/2012CN1832140B Autoregistration salicide process method for image sensor
06/27/2012CN1825586B Led assembly and method of making the same
06/27/2012CN1799127B Plasma processing apparatus and plasma processing method
06/27/2012CN1735670B Composition and method used for chemical mechanical planarization of metals
06/27/2012CN102523677A Multilayer printed wiring board
06/27/2012CN102522498A Magnetic memory device and method of manufacturing the same
06/27/2012CN102522461A High-speed taking device for photovoltaic stacked silicon slices
06/27/2012CN102522449A Phosphorus diffusion method for preparing silicon solar battery
06/27/2012CN102522431A Schottky barrier diode rectifying device and manufacture method thereof
06/27/2012CN102522429A Thin film transistor on basis of metal oxide and preparation method and application thereof
06/27/2012CN102522425A Structure of ultrahigh pressure germanium-silicon heterojunction bipolar transistor (HBT) device and preparation method
06/27/2012CN102522424A CMOS device capable of reducing charge sharing effect and manufacturing method thereof
06/27/2012CN102522420A Display device with flexible substrate and manufacturing method thereof
06/27/2012CN102522412A Integration method of high-integration high-reliable controllable working-temperature thin-film hybrid integrated circuit
06/27/2012CN102522411A Thin film transistor, array substrate using thin film transistor and manufacturing method of array substrate
06/27/2012CN102522410A TFT array substrate and manufacturing method thereof
06/27/2012CN102522409A Non-volatile flash memory cell, array and method of manufacturing
06/27/2012CN102522408A One-time programmable memory and manufacturing method
06/27/2012CN102522407A Memory array structure with vertical transistor and forming method thereof
06/27/2012CN102522394A On-chip chip package and production method thereof
06/27/2012CN102522393A Packaging device and assembly for packaging a plurality of integrated circuits
06/27/2012CN102522392A e/LQFP (low-profile quad flat package) planar packaging part with grounded ring and production method of e/LQFP planar packaging part with grounded ring
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