Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2012
07/04/2012CN102543827A Method for fabricating trench isolation structure
07/04/2012CN102543826A Manufacturing method of quasi silicon-on-insulator (SOI) structure
07/04/2012CN102543825A Manufacturing method of semiconductor channel and double channels and structure for isolating elements
07/04/2012CN102543824A Manufacturing method of STI (shallow trench insulation)
07/04/2012CN102543823A Production method of shallow trench isolation
07/04/2012CN102543822A Method for manufacturing shallow trench isolation structure
07/04/2012CN102543821A Method for forming shallow trench isolating structure
07/04/2012CN102543820A 浅沟槽隔离结构及其形成方法 Shallow trench isolation structure and method of forming
07/04/2012CN102543819A Method for preventing STI (Shallow Trench Isolation)-CMP (Chemical-Mechanical Polishing) scratching
07/04/2012CN102543818A Balance wafer clamping device
07/04/2012CN102543817A Novel IC (integrated circuit) feeding pressing head unit
07/04/2012CN102543816A Static sucker
07/04/2012CN102543815A Sucking disc device used for transferring semi-conductor crystal grains on graphite boat
07/04/2012CN102543814A Chucking device and chucking method
07/04/2012CN102543813A High efficiency electrostatic chuck assembly for semiconductor wafer processing
07/04/2012CN102543812A Mounted wafer manufacturing method
07/04/2012CN102543811A Adhesive sheet for semiconductor device and manufacturing method thereof
07/04/2012CN102543810A Wafer bearing base
07/04/2012CN102543809A Semiconductor chip mounting method
07/04/2012CN102543808A Wafer pre-alignment method
07/04/2012CN102543807A Transport facility
07/04/2012CN102543806A Top frame device of wafer
07/04/2012CN102543805A Quartz boat carrier
07/04/2012CN102543804A Loading disc
07/04/2012CN102543803A Novel film magazine with opening front end
07/04/2012CN102543802A Methods and apparatus for transferring a substrate carrier within an electronic device manufacturing facility
07/04/2012CN102543801A Die bonder
07/04/2012CN102543800A Substrate processing apparatus, substrate processing method and manufacture method for semiconductor device
07/04/2012CN102543799A Etching control method and control method for semiconductor manufacturing process
07/04/2012CN102543798A Apparatus and method for centering a substrate in a process chamber
07/04/2012CN102543797A Substrate engaging device and substrate engaging method using the same
07/04/2012CN102543796A Retaining cleaning device and method for batch cleaning sawn wafers
07/04/2012CN102543795A Film formation apparatus
07/04/2012CN102543794A Crystal boat converter
07/04/2012CN102543793A Wafer focusing image quality feedback system and method therefor
07/04/2012CN102543792A Method and apparatus for ultrasonic bonding
07/04/2012CN102543791A Film adhesive force quantitative test method with HgCdTe serving as substrate
07/04/2012CN102543790A Method for measuring thickness of silicon nitride film on silicon wafer surface subjected to texturization by means of RIE (Reactive Ion Etching)
07/04/2012CN102543789A Method and apparatus for evaluating substrate quality
07/04/2012CN102543788A Device for plasma detection
07/04/2012CN102543787A Method for monitoring the growing of the semiconductor layer
07/04/2012CN102543786A Defect detection method for chemical mechanical polishing (CMP) process and method for manufacturing shallow trench isolation (STI)
07/04/2012CN102543785A Alignment specification verification method
07/04/2012CN102543784A Solid-state hot-compression low-temperature bonding method using nickel micro needle cones
07/04/2012CN102543783A Hot compression chip low-temperature interconnection method using indium and micro needle cone structures
07/04/2012CN102543782A Switching and encapsulating structure and forming method thereof
07/04/2012CN102543781A Optimizing process of wafer-level packaging
07/04/2012CN102543780A Manufacturing method of package substrate
07/04/2012CN102543779A Semiconductor device and method of forming an inductor within interconnect layer vertically separated from semiconductor die
07/04/2012CN102543778A Methods for directly bonding together semiconductor structures, and bonded semiconductor structures formed using such methods
07/04/2012CN102543777A Integrated circuit packaging system with pad connection and method of manufacture thereof
07/04/2012CN102543776A Method for forming redistribution of welding pad
07/04/2012CN102543775A Method of manufacturing semiconductor device, and manufacturing apparatus
07/04/2012CN102543774A Method for packaging chip based on epoxy resin type adhesive
07/04/2012CN102543773A Resin molding machine
07/04/2012CN102543772A Semiconductor device and method of bonding different size semiconductor die at the wafer level
07/04/2012CN102543771A 半导体器件 Semiconductor devices
07/04/2012CN102543770A Encapsulation method of special half-bridge drive integrated circuit of compact fluorescent lamp
07/04/2012CN102543769A Production method of dual interface card and device thereof
07/04/2012CN102543768A Device and method for forming protective films on chip package
07/04/2012CN102543767A Method for avoiding wafer damage in molding process of wafer level packaging
07/04/2012CN102543766A Columnar bump packaging process
07/04/2012CN102543765A Method for designing bonding pad of surface mounted component, bonding pad structure and printing circuit board
07/04/2012CN102543764A Lead frame processing device capable of adjusting height
07/04/2012CN102543763A Metallic thermal joint for high power density chips
07/04/2012CN102543762A Device and method for preparing dot matrix arrangement type heat dissipation structure
07/04/2012CN102543761A Method for reducing grid induced drain leakage of semiconductor device, and MOS device manufacturing method
07/04/2012CN102543760A Method for increasing shallow trench isolating compressive stress and improving NMOS electron mobility
07/04/2012CN102543759A Method for manufacturing floating body effect storage unit
07/04/2012CN102543758A Sidewall preparation method for reducing coupling interference of metal oxide semiconductor field effect transistor (MOSFET)
07/04/2012CN102543757A Low-temperature process for improving performance of channel field effect tube
07/04/2012CN102543756A High-density plasma deposition method with less plasma damage
07/04/2012CN102543755A Method for realizing Fermi level de-pinning on surface of germanium substrate in metal- germanium contact
07/04/2012CN102543754A Oxide thin film transistor and method of fabricating the same
07/04/2012CN102543753A Fin type transistor
07/04/2012CN102543752A Semiconductor devices and methods for fabricating the same
07/04/2012CN102543751A Preparation method of Ge-based Metal Oxide Semiconductor (MOS) device with sub-nanometer equivalent to oxide thickness
07/04/2012CN102543750A Method for improving gate induced drain leakage current of input/output (I/O) device
07/04/2012CN102543749A Method for making power semiconductor assembly having super interface
07/04/2012CN102543748A Manufacturing method of semi-conductor device
07/04/2012CN102543747A Manufacturing method of MOS (Metal Oxide Semiconductor) transistor
07/04/2012CN102543746A 半导体器件及其制作方法 Semiconductor device and manufacturing method thereof
07/04/2012CN102543745A Forming method of semiconductor device
07/04/2012CN102543744A 晶体管及其制作方法 Transistor and manufacturing method thereof
07/04/2012CN102543743A Manufacturing method of MOS (metal oxide semiconductor) device
07/04/2012CN102543742A Injection method for controlling volume of tidal (VT) of metal oxide semiconductor (MOS) device
07/04/2012CN102543741A Manufacturing method for P type metal oxide semiconductor (PMOS) tube
07/04/2012CN102543740A Method for improving alignment uniformity between polycrystalline silicon gate and contact hole
07/04/2012CN102543739A Method for manufacturing semiconductor device
07/04/2012CN102543738A High-voltage LDMOS (Laterally Diffused Metal Oxide Semiconductor) device and manufacture method for same
07/04/2012CN102543737A Preparation method for double-gate VDMOS (vertical double-diffused metal oxide semiconductor) with self-aligned metallic silicide technology
07/04/2012CN102543736A Semiconductor device structure and method for manufacturing same
07/04/2012CN102543735A Forming method for salicide block layer
07/04/2012CN102543734A MOS (metal oxide semiconductor) device with memory function and forming method of MOS device
07/04/2012CN102543733A Alignment marking method in DMOS (Double-diffusion Metal Oxide Semiconductor) process flow
07/04/2012CN102543732A Preparation method of semiconductor element
07/04/2012CN102543731A Manufacturing method of quantum point contact
07/04/2012CN102543730A Method for fabricating semiconductor device
07/04/2012CN102543729A Forming method of capacitor and capacitor structure thereof
07/04/2012CN102543728A Power transistor chip wafer manufacturing method
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