Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2012
06/27/2012CN102522391A e/LQFP (low-profile quad flat package) stacked package with grounded ring and production method of e/LQFP stacked package with grounded ring
06/27/2012CN102522388A Inductor and method for forming same
06/27/2012CN102522384A Graphene nanoribbon resistor and production method thereof
06/27/2012CN102522383A IC chip stacked packaging piece with two-ring-arrangement center routing and production method thereof
06/27/2012CN102522381A Radiator and manufacturing method thereof
06/27/2012CN102522379A High-current transistor packaging structure and manufacturing method thereof
06/27/2012CN102522374A Method for manufacturing a phase change memory device with pillar bottom electrode
06/27/2012CN102522373A Semiconductor device
06/27/2012CN102522372A Method of manufacturing semiconductor device
06/27/2012CN102522371A Contact hole making method
06/27/2012CN102522370A Formation method of contact hole
06/27/2012CN102522369A Methods of forming through substrate interconnects
06/27/2012CN102522368A Surface modification of interlayer dielectric for minimizing contamination and surface degradation
06/27/2012CN102522367A Manufacturing method of integrated circuit with ultra-thick top-layer metal and integrated circuit
06/27/2012CN102522366A Imprinting method for rewiring of integrated circuit chip
06/27/2012CN102522365A Application of tellurium-based composite film as SOI (Semiconductor On Insulator) material and SOI power device
06/27/2012CN102522364A Shallow-groove partition structure and forming method thereof
06/27/2012CN102522363A Production method of deep groove isolation structure
06/27/2012CN102522362A Method for improving anti-irradiation performance of SOI (Silicon On Insulator) structure
06/27/2012CN102522361A System integration method for inorganic flexible electronic devices
06/27/2012CN102522360A Lithography alignment precision detection method
06/27/2012CN102522359A Mounting method
06/27/2012CN102522358A Photoresist stripping technical cavity and photoresist stripping method for semiconductor silicon wafer
06/27/2012CN102522357A Brushing device for wafer
06/27/2012CN102522356A Linear platform of double-shaft floating stator
06/27/2012CN102522355A Substrate assembling device
06/27/2012CN102522354A Method and device for extracting square resistances of interconnection lines
06/27/2012CN102522353A Partial discharge test device and method for ceramic liner
06/27/2012CN102522352A Detection apparatus for stability of ion beam and detection method thereof
06/27/2012CN102522351A Method of merging vertical signal path of stacked devices configured with semiconductors
06/27/2012CN102522350A Method and device for detecting failed production machine platforms
06/27/2012CN102522349A Riving knife used for lead bonding
06/27/2012CN102522348A Eutectic welding machine for die bonding of LED (Light Emitting Diode) chip
06/27/2012CN102522347A Method for manufacturing solder bump
06/27/2012CN102522346A Direct welding processing method of electronic label
06/27/2012CN102522345A Ball mounting device and ball mounting method utilizing same
06/27/2012CN102522344A Epoxy glue curing process for automobile rectifier
06/27/2012CN102522343A Microcomponent vacuum packaging exhaust device and method
06/27/2012CN102522342A Semiconductor structure and method for manufacturing same
06/27/2012CN102522341A Microelectronic packages and associated methods of manufacturing
06/27/2012CN102522340A Method for installing cooling fin of high-power module
06/27/2012CN102522339A Method for designing general packaging substrate
06/27/2012CN102522338A Forming method of high-voltage super-junction metal oxide semiconductor field effect transistor (MOSFET) structure and P-shaped drift region
06/27/2012CN102522337A Preparation method of top gate zinc oxide film transistor
06/27/2012CN102522336A Technological method for planarization of radio frequency LDMOS polysilicon channel
06/27/2012CN102522335A Power device terminal ring production method and structure of terminal ring
06/27/2012CN102522334A Technology for preparing monocrystalline silicon wafer back sealing material used in IGBT by using high temperature oxidation process
06/27/2012CN102522333A Manufacturing method for planar bidirectional trigger diode chip
06/27/2012CN102522332A ONO (oxide-nitride-oxide) structure and manufacturing method thereof, memory and manufacturing method thereof
06/27/2012CN102522331A Method for increasing shunt resistance of crystalline-silicon solar cell
06/27/2012CN102522330A Substrate processing method
06/27/2012CN102522329A Machining method of semiconductor chip
06/27/2012CN102522328A Manufacturing method of MOS (Metal Oxide Semiconductor)-device grid-electrode hole
06/27/2012CN102522327A Method for manufacturing self-aligned low-resistance gate RF LDMOS (radio-frequency laterally diffused metal oxide semiconductor)
06/27/2012CN102522326A Production method of semiconductor discrete device back side metal suitable for screen printing
06/27/2012CN102522325A Production method for submicron multilayer metallic electrode
06/27/2012CN102522324A Plasma immersed ion implantation process
06/27/2012CN102522323A ITO (Indium Tin Oxide) patterning method
06/27/2012CN102522322A Semiconductor chip cleaning device
06/27/2012CN102522321A Cleaning method for cleaning system in chemical and mechanical grinding
06/27/2012CN102522320A Method for arranging nanowires on biological template
06/27/2012CN102522319A Embedding unpackaging method for plastic packaged device packaged by flip chip bonding process
06/27/2012CN102522318A Self-splitting and transfer method for GaN-based epitaxial film
06/27/2012CN102520594A Marker structure used for Alignment or superposition, mask pattern for defining, photolithography projection apparatus using mask pattern
06/27/2012CN102520587A Two-workpiece-platform rotary exchange method and device based on cable-box anti-rotation mechanisms
06/27/2012CN102520586A Method of creating photolithographic structures with developer-trimmed hard mask
06/27/2012CN102520583A Photoresist compositions comprising acetals and ketals as solvents
06/27/2012CN102520578A Testing photomask and application thereof
06/27/2012CN102520556A Pixel structure and manufacture method thereof
06/27/2012CN102519364A Optical detection method and computer-aided system for plasma etching structure
06/27/2012CN102513701A Laser annealing method and apparatus
06/27/2012CN102513695A 激光加工方法 The laser processing method
06/27/2012CN102513687A Welding wire machine and anti-oxidation structure thereof
06/27/2012CN102513305A Device and method for cleaning semiconductor silicon wafer
06/27/2012CN102513302A Spray rinsing tank
06/27/2012CN102157363B Ion implantation method of substrate back of power device
06/27/2012CN102130159B High electron mobility transistor
06/27/2012CN102130026B Wafer-level low-temperature packaging method based on gold-tin alloy bonding
06/27/2012CN102130012B LDD, LDS and buffer layer integrated manufacturing method for SOI super-junction LDMOS device
06/27/2012CN102110712B Lateral power metal oxide semiconductor field effect transistor structure and manufacturing method
06/27/2012CN102097349B Chip unloading device for semiconductor package process
06/27/2012CN102087960B Method for forming active area
06/27/2012CN102074491B Chemical-liquid classified recovering device with rotatable chassis
06/27/2012CN102061474B Super-thickness chemical thinning method for semiconductor wafer
06/27/2012CN102054682B Method of super flat chemical-mechanical polishing and semiconductor assembly manufactured by using same
06/27/2012CN102024785B Semiconductor device
06/27/2012CN102024729B Bidirectional transmission wafer box mechanism
06/27/2012CN102024711B Method for improving qualification rate of PLCC encapsulated integrated circuit
06/27/2012CN102021524B Device for separating ions of different masses during plasma immersion ion implantation
06/27/2012CN102017110B Method for producing a hermetically sealed, electrical feedthrough using exothermic nanofilm
06/27/2012CN102005399B Rotary bonding tool which provides a large bond force
06/27/2012CN101976650B Thin film transistor and manufacture method thereof
06/27/2012CN101964344B Panel display driving chip based on silicon on insulator (SOI) and preparation method thereof
06/27/2012CN101961852B Chemical mechanical grinding method for interlayer dielectric layer
06/27/2012CN101960383B Method for processing work having photoresist layer
06/27/2012CN101950733B Manufacturing method of pixel structure and manufacturing method of organic light-emitting component
06/27/2012CN101946329B Semiconductor device and method for manufacturing the same
06/27/2012CN101944520B Semiconductor packaging structure and semiconductor packaging process
06/27/2012CN101944505B Preparation method of SOI high-voltage power device chip having groove structure
06/27/2012CN101937886B Thin chip package structure and method
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