Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2012
07/04/2012CN102543970A Semiconductor packaging component and manufacturing method thereof
07/04/2012CN102543969A Wafer level molding structure and manufacturing method thereof
07/04/2012CN102543967A Package and method for manufacturing same
07/04/2012CN102543964A Capacitor and forming method thereof, and semiconductor memory device and manufacture method thereof
07/04/2012CN102543961A Package for preventing electrostatic damage and electromagnetic wave interference and preparation method for package
07/04/2012CN102543953A Composition for filling through silicon via (TSV), TSV filling method and substrate including TSV plug formed of the composition
07/04/2012CN102543952A Method and system for providing fusing after packaging of semiconductor devices
07/04/2012CN102543951A Stacked and tunable power fuse
07/04/2012CN102543948A Semiconductor structure and manufacturing method thereof
07/04/2012CN102543944A Semiconductor device and method for fabricating the same
07/04/2012CN102543943A Transformer with bypass capacitor and manufacturing method thereof
07/04/2012CN102543939A Laminated inverted chip packaging structure for superfine-pitch welding pads and manufacturing method thereof
07/04/2012CN102543937A Flip chip on-chip package and manufacturing method thereof
07/04/2012CN102543935A Printed circuit board for semiconductor package and semiconductor package having same
07/04/2012CN102543931A Center-wiring double-circle-arrangement single-IC (integrated circuit) chip packaging piece and preparation method thereof
07/04/2012CN102543927A Packaging substrate having through-holed interposer embedded therein and fabrication method thereof
07/04/2012CN102543926A Semiconductor element, manufacturing method thereof and semiconductor packaging structure
07/04/2012CN102543923A Semiconductor device and method of manufacture thereof
07/04/2012CN102543922A Chip package and method for forming the same
07/04/2012CN102543921A Welding pad structure and manufacturing method thereof
07/04/2012CN102543920A Chip size packaging method and packaging structure
07/04/2012CN102543919A Clip interconnect with encapsulation material locking feature
07/04/2012CN102543913A Wiring substrate, electronic device, and method of manufacturing wiring substrate
07/04/2012CN102543912A Radiator and manufacturing method thereof
07/04/2012CN102543910A Chip packaging component and manufacturing method thereof
07/04/2012CN102543909A Sealing structure with irregular shape and manufacturing method therefor
07/04/2012CN102543908A Flip chip encapsulating piece and manufacturing method thereof
07/04/2012CN102543907A Package and manufacture method for thermal enhanced quad flat no-lead flip chip
07/04/2012CN102543905A Semiconductor package and fabrication method thereof
07/04/2012CN102543904A Modular integrated circuit packaging structure and manufacturing method thereof
07/04/2012CN102543902A Semiconductor device and method of manufacturing semiconductor device
07/04/2012CN102543901A Sealing member, sealing method, and method for producing optical semiconductor device
07/04/2012CN102543900A Fiber-containing resin substrate, semiconductor device mounting substrate, semiconductor device forming chip, semiconductor apparatus, and method for manufacturing semiconductor apparatus
07/04/2012CN102543895A Bump structure and manufacturing method thereof
07/04/2012CN102543893A Preparation method of semiconductor device
07/04/2012CN102543892A Thin film transistor substrate and manufacturing method thereof and liquid crystal display device
07/04/2012CN102543891A Preparation method of grid-controlled diode semiconductor memory device
07/04/2012CN102543890A Method for improving erasing speed of SONOS (Silicon Oxide Nitride Oxide Silicon) by utilizing strained silicon technology
07/04/2012CN102543889A Method for improving erasing speed of SONOS memory
07/04/2012CN102543888A Method for improving erasing speed of SONOS memory
07/04/2012CN102543887A Method for improving operating speed of SONOS (Silicon Oxide Nitride Oxide Silicon) device by changing channel stress
07/04/2012CN102543886A Manufacturing method of gated diode semiconductor memory device
07/04/2012CN102543885A Split-gate memory device and forming method thereof
07/04/2012CN102543884A Method for manufacturing one time programmable (OTP) device
07/04/2012CN102543883A Method for reducing leakage current of SRAM (Static Random Access Memory)
07/04/2012CN102543882A Method for forming silicon on insulator-SiGe heterojunction 1T-DRAM (1T-Dynamic Random Access Memory) structure on insulator and formed structure
07/04/2012CN102543881A Method for increasing writing speed of floating body cell
07/04/2012CN102543880A Semiconductor device and metod for forming the same
07/04/2012CN102543879A Method for manufacturing gate-last one-transistor dynamic random access memory
07/04/2012CN102543878A Manufacturing method of storage
07/04/2012CN102543877A Method for manufacturing three-dimensional semiconductor storage device
07/04/2012CN102543876A Methods of fabricating a semiconductor device including metal gate electrodes
07/04/2012CN102543875A Method for using stress memorization technology in semiconductor device
07/04/2012CN102543874A Manufacturing method for semi-conductor device with stress memorization function
07/04/2012CN102543873A Autocollimation P<+> shallow junction doping technological method
07/04/2012CN102543872A Method for manufacturing semiconductor device
07/04/2012CN102543871A Process for manufacturing gallium nitride-base GaN power integrated circuit
07/04/2012CN102543870A Method for producing a semiconductor component with insulated semiconductor mesas
07/04/2012CN102543869A Material structure in scribe line and method of separating chips
07/04/2012CN102543868A Method of dicing semiconductor structure
07/04/2012CN102543867A Method for manufacturing metal oxide thin film transistor array substrate
07/04/2012CN102543866A Manufacturing method of array substrate of penetration type liquid crystal display(LCD)
07/04/2012CN102543865A Semiconductor device
07/04/2012CN102543864A Thin film transistor array substrate and manufacturing method thereof
07/04/2012CN102543863A Thin film transistor array substrate and manufacturing method thereof
07/04/2012CN102543862A Reticle set modification to produce multi-core dies
07/04/2012CN102543861A Array substrate forming method
07/04/2012CN102543860A Manufacturing method of low-temperature polysilicon TFT (thin-film transistor) array substrate
07/04/2012CN102543859A Method for improving multi-hole medium thin film sealing performance of metal interconnect process
07/04/2012CN102543858A Manufacture method for improving W-CMP rear-surface flatness
07/04/2012CN102543857A Method for manufacturing SRAM (Static Random Access Memory) shared contact hole
07/04/2012CN102543856A Method for repairing aluminum etching graph defects
07/04/2012CN102543855A Manufacture method of three-dimensional integrated circuit structure and material
07/04/2012CN102543854A Method for overcoming defect of copper bumps in copper interconnecting structure
07/04/2012CN102543853A Dummy metal filling method and integrated circuit layout structure
07/04/2012CN102543852A Metal interconnection structure and manufacturing method thereof
07/04/2012CN102543851A Method of forming patterns of semiconductor device
07/04/2012CN102543850A Method of processing low K dielectric films
07/04/2012CN102543849A Method for etching first metal layer
07/04/2012CN102543848A Semiconductor devices having through-contacts and related fabrication methods
07/04/2012CN102543847A Vertical transistor STRAM array
07/04/2012CN102543846A Surface treatment method for strengthening aluminum process metal layer and light resistance adhesive force
07/04/2012CN102543845A Semiconductor device and manufacturing method thereof
07/04/2012CN102543844A Method for manufacturing semiconductor device structure and semiconductor device structure
07/04/2012CN102543843A Manufacturing method of interconnection structure
07/04/2012CN102543842A Method for removing impurity pollution of integrated circuit device with metal interconnection structure
07/04/2012CN102543841A Semiconductor device and method for forming plugs
07/04/2012CN102543840A Self-aligned contact etch method
07/04/2012CN102543839A Planarization method for interlayer dielectric (ILD) layer
07/04/2012CN102543838A Method for manufacturing semiconductor device
07/04/2012CN102543837A Structure and manufacturing method of top metal interconnection layer
07/04/2012CN102543836A Method for etching through hole
07/04/2012CN102543835A Opening filling method
07/04/2012CN102543834A Semiconductor structure on insulating layer and manufacturing method thereof
07/04/2012CN102543833A Method of manufacturing SOI substrate
07/04/2012CN102543832A Method for manufacturing transparent silicon-based substrate with integrated circuit (IC) device
07/04/2012CN102543831A System and apparatus for flowable deposition in semiconductor fabrication
07/04/2012CN102543830A Trench embedding method and film-forming apparatus
07/04/2012CN102543829A Integration of shallow trench isolation and through-substrate vias into integrated circuit designs
07/04/2012CN102543828A Preparation method of silicon on insulator (SOI) silicon sheet
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