Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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07/03/2012 | US8211764 Semiconductor device of common source structure and manufacturing method of semiconductor device of common source structure |
07/03/2012 | US8211763 Methods of forming vertical field effect transistors, vertical field effect transistors, and DRAM cells |
07/03/2012 | US8211762 Non-volatile memory |
07/03/2012 | US8211761 Semiconductor system using germanium condensation |
07/03/2012 | US8211760 Method for producing a transistor gate with sub-photolithographic dimensions |
07/03/2012 | US8211759 Semiconductor structure and methods of manufacture |
07/03/2012 | US8211758 Semiconductor device and method of producing the same |
07/03/2012 | US8211757 Organic thin film transistor substrate and fabrication method therefor |
07/03/2012 | US8211756 3D chip-stack with fuse-type through silicon via |
07/03/2012 | US8211755 Method for multi-level interconnection memory device |
07/03/2012 | US8211754 Semiconductor device and manufacturing method thereof |
07/03/2012 | US8211753 Leadframe-based mold array package heat spreader and fabrication method therefor |
07/03/2012 | US8211752 Device and method including a soldering process |
07/03/2012 | US8211751 Semiconductor device and method of manufacturing the same |
07/03/2012 | US8211750 Semiconductor device comprising light-emitting element and light-receiving element, and manufacturing method therefor |
07/03/2012 | US8211749 Integrated circuit package system with waferscale spacer |
07/03/2012 | US8211748 Systems and methods for low profile die package |
07/03/2012 | US8211747 Wafer level stack die package |
07/03/2012 | US8211746 Integrated circuit packaging system with lead frame and method of manufacture thereof |
07/03/2012 | US8211745 Method and structure for bonding flip chip |
07/03/2012 | US8211744 Methods of forming nano structure and methods of forming solar cell using the same |
07/03/2012 | US8211743 Methods of forming non-volatile memory cells having multi-resistive state material between conductive electrodes |
07/03/2012 | US8211742 Lateral phase change memory |
07/03/2012 | US8211740 Solid state imaging device having wirings with diffusion prevention film |
07/03/2012 | US8211739 Polycrystalline silicon solar cell having high efficiency and method for fabricating the same |
07/03/2012 | US8211738 Polycrystalline silicon solar cell having high efficiency and method for fabricating the same |
07/03/2012 | US8211737 Method of producing nanopatterned articles, and articles produced thereby |
07/03/2012 | US8211736 Bulk copper species treatment of thin film photovoltaic cell and manufacturing method |
07/03/2012 | US8211735 Nano/microwire solar cell fabricated by nano/microsphere lithography |
07/03/2012 | US8211734 Method for producing a photovoltaic module |
07/03/2012 | US8211733 Solid-state imaging device and electronic device |
07/03/2012 | US8211732 Image sensor with raised photosensitive elements |
07/03/2012 | US8211731 Ablation of film stacks in solar cell fabrication processes |
07/03/2012 | US8211730 Nanophotonic transceiver |
07/03/2012 | US8211729 Method for releasing the suspended structure of a NEMS and/or NEMS component |
07/03/2012 | US8211728 Horizontal micro-electro-mechanical-system switch |
07/03/2012 | US8211727 Group III nitride semiconductor multilayer structure and production method thereof |
07/03/2012 | US8211726 Method of manufacturing nitride semiconductor light emitting device |
07/03/2012 | US8211725 Method of manufacturing flexible display device |
07/03/2012 | US8211724 Light emitting device having a plurality of non-polar light emitting cells and a method of fabricating the same |
07/03/2012 | US8211723 Al(x)Ga(1-x)N-cladding-free nonpolar III-nitride based laser diodes and light emitting diodes |
07/03/2012 | US8211721 Methods for making quasi-vertical light emitting diodes |
07/03/2012 | US8211719 Method of processing substrate and method of manufacturing substrate for use in liquid ejection head |
07/03/2012 | US8211718 Semiconductor device and method of visual inspection and apparatus for visual inspection |
07/03/2012 | US8211717 SEM repair for sub-optimal features |
07/03/2012 | US8211716 Manufacturing method of a semiconductor device, a semiconductor wafer, and a test method |
07/03/2012 | US8211540 Adhesive film composition, associated dicing die bonding film, die package, and associated methods |
07/03/2012 | US8211500 Copper film deposition method |
07/03/2012 | US8211323 Method for the removal of doped surface layers on the back faces of crystalline silicon solar wafers |
07/03/2012 | US8211269 Wafer spin chuck and an etcher using the same |
07/03/2012 | US8211238 System, method and apparatus for self-cleaning dry etch |
07/03/2012 | US8211231 Delivery device for deposition |
07/03/2012 | US8211230 Reaction system for growing a thin film |
07/03/2012 | US8210789 Method of assembling substrate transfer device and transfer system unit for the same |
07/03/2012 | US8210742 Method and apparatus for detecting foreign matter attached to peripheral edge of substrate, and storage medium |
07/03/2012 | US8210120 Systems and methods for building tamper resistant coatings |
07/03/2012 | CA2471041C Compositions and methods for enhancing corticosteriod delivery |
07/03/2012 | CA2399282C Method for low temperature bonding and bonded structure |
06/28/2012 | WO2012088371A1 Workpiece handling module |
06/28/2012 | WO2012088338A2 Photodetecting imager devices having correlated double sampling and associated methods |
06/28/2012 | WO2012088172A2 Front opening large substrate container |
06/28/2012 | WO2012088097A2 Column iv transistors for pmos integration |
06/28/2012 | WO2012088012A2 Improving toughness of polycrystalline diamond by incorporation of bulk metal foils |
06/28/2012 | WO2012087987A2 Multi-gate transistors |
06/28/2012 | WO2012087986A2 Magnetic phase change logic |
06/28/2012 | WO2012087978A2 Edge rounded field effect transistors and methods of manufacturing |
06/28/2012 | WO2012087974A2 Process margin engineering in charge trapping field effect transistors |
06/28/2012 | WO2012087921A1 Methods for etching a substrate |
06/28/2012 | WO2012087820A2 Stacked metal fin cell |
06/28/2012 | WO2012087780A2 Photocurable dicing die bonding tape |
06/28/2012 | WO2012087750A1 Cyclic carbosilane dielectric films |
06/28/2012 | WO2012087748A2 Uniaxially strained quantum well device and method of making same |
06/28/2012 | WO2012087737A2 Variable-density plasma processing of semiconductor substrates |
06/28/2012 | WO2012087714A2 Cobalt metal barrier layers |
06/28/2012 | WO2012087697A1 System and method for detecting isolation barrier breakdown |
06/28/2012 | WO2012087666A1 Infrared direct illumination machine vision for semiconductor processing |
06/28/2012 | WO2012087660A2 Semiconductor device contacts |
06/28/2012 | WO2012087637A2 Improving transistor channel mobility using alternate gate dielectric materials |
06/28/2012 | WO2012087629A2 Systems and methods for generating a cross-product matrix in a single pass through data using single pass levelization |
06/28/2012 | WO2012087622A2 Multilayer dielectric memory device |
06/28/2012 | WO2012087613A2 Fabrication of through-silicon vias on silicon wafers |
06/28/2012 | WO2012087581A2 Transistors with high concentration of boron doped germanium |
06/28/2012 | WO2012087580A2 Trap rich layer for semiconductor devices |
06/28/2012 | WO2012087578A2 Liner layers for metal interconnects |
06/28/2012 | WO2012087556A2 Device packaging with substrates having embedded lines and metal defined pads |
06/28/2012 | WO2012087547A1 Barrierless single-phase interconnect |
06/28/2012 | WO2012087493A2 In-situ low-k capping to improve integration damage resistance |
06/28/2012 | WO2012087477A2 Use of patterned uv source for photolithography |
06/28/2012 | WO2012087476A1 Capacitor with recessed plate portion for dynamic random access memory (dram) and method to form the same |
06/28/2012 | WO2012087404A1 Selective germanium p-contact metalization through trench |
06/28/2012 | WO2012087403A1 Contact resistance reduction employing germanium overlayer pre-contact metalization |
06/28/2012 | WO2012087369A1 Techniques for bonding substrates using an intermediate layer |
06/28/2012 | WO2012087364A1 Simultaneous wafer bonding and interconnect joining |
06/28/2012 | WO2012087002A2 Chemical vapor deposition apparatus and method for manufacturing light-emitting devices using same |
06/28/2012 | WO2012086997A2 Plasma particle photographing apparatus |
06/28/2012 | WO2012086974A2 Processing method of tray for transporting substrate of chemical vapor deposition apparatus for solar cell |
06/28/2012 | WO2012086879A1 Vacuum processing device |
06/28/2012 | WO2012086850A1 Actinic-ray- or radiation-sensitive resin composition, actinic-ray- or radiation-sensitive film therefrom and method of forming pattern using the composition |
06/28/2012 | WO2012086849A1 Actinic-ray- or radiation-sensitive resin composition, actinic-ray- or radiation-sensitive film therefrom and method of forming pattern using the composition |
06/28/2012 | WO2012086805A1 Insulation structure and method for manufacturing same |