Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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06/28/2012 | WO2012086800A1 Substrate treatment device and method for producing semiconductor device |
06/28/2012 | WO2012086781A1 Polishing liquid and method for polishing substrate using the polishing liquid |
06/28/2012 | WO2012086771A1 Thermocompression head, mounting device, mounting method, and assembly |
06/28/2012 | WO2012086767A1 Evacuation device, vacuum processing device, and evacuation method |
06/28/2012 | WO2012086728A1 Vaporizer |
06/28/2012 | WO2012086698A1 Method for producing polishing liquid composition |
06/28/2012 | WO2012086609A1 Field-effect transistor, method for producing same, and electronic device including same |
06/28/2012 | WO2012086540A1 Thin-film transistor and method for manufacturing thin-film transistor |
06/28/2012 | WO2012086513A1 Semiconductor device and display device |
06/28/2012 | WO2012086481A1 Semiconductor device and method for producing same |
06/28/2012 | WO2012086385A1 Method for manufacturing microscopic structural body |
06/28/2012 | WO2012086325A1 Process for manufacture of thin film solar cell, and thin film solar cell |
06/28/2012 | WO2012086279A1 Upward flow forming element and noncontact transfer device using the upward flow forming element |
06/28/2012 | WO2012086257A1 Process for manufacture of silicon carbide semiconductor device |
06/28/2012 | WO2012086242A1 Microcrystalline semiconductor thin film production process |
06/28/2012 | WO2012086169A1 Method of manufacturing dielectric device and ashing method |
06/28/2012 | WO2012086164A1 Transportation robot, substrate transportation method therefor, and substrate transportation relay apparatus |
06/28/2012 | WO2012086150A1 Semiconductor substrate, method for manufacturing semiconductor substrate, and vertical-cavity surface-emitting laser |
06/28/2012 | WO2012086142A1 Inspecting apparatus |
06/28/2012 | WO2012086138A1 Semiconductor memory device |
06/28/2012 | WO2012086132A1 Tape adhering device and tape adhering method |
06/28/2012 | WO2012086129A1 Polishing method, polishing apparatus, and polishing cloth |
06/28/2012 | WO2012086122A1 Method for manufacturing soi wafer |
06/28/2012 | WO2012086104A1 Semiconductor device and method for manufacturing same |
06/28/2012 | WO2012086102A1 Semiconductor device and method for manufacturing same |
06/28/2012 | WO2012086099A1 Silicon carbide semiconductor device and method for manufacturing same |
06/28/2012 | WO2012086012A1 Substrate heat treatment apparatus |
06/28/2012 | WO2012085987A1 Method for producing semiconductor transistor, drive circuit using semiconductor transistor produced by said method, pixel circuit including said drive circuit and display element, display panel having said pixel circuits arranged in a matrix, and display device including said panel |
06/28/2012 | WO2012085984A1 Method for producing field-effect semiconductor transistor, pixel circuit including display element and drive circuit using field-effect semiconductor transistor produced by said method, display panel having said pixel circuits arranged in a matrix, and display device including said panel |
06/28/2012 | WO2012085817A1 Process for treating a semiconductor wafer |
06/28/2012 | WO2012085724A1 Method of fabricating a flip chip electrical coupling, a flip chip electrical coupling, and a device comprising a flip chip electrical coupling |
06/28/2012 | WO2012085347A1 Method and apparatus for performing an operation aimed at a part of an electronic structure |
06/28/2012 | WO2012085219A1 Strain relaxation using metal materials and related structures |
06/28/2012 | WO2012084610A1 Dissolved nitrogen concentration monitoring method, substrate cleaning method, and substrate cleaning apparatus |
06/28/2012 | WO2012084556A1 Electrical module for being received by automatic placement machines by means of generating a vacuum |
06/28/2012 | WO2012084261A1 Method and device for depositing silicon on a substrate |
06/28/2012 | WO2012084253A1 Lithography-free schottky semiconductor process having the possibility of integrating a protective diode |
06/28/2012 | WO2012084223A1 Printing table assembly, method for operating a printing table assembly |
06/28/2012 | WO2012084187A1 Retaining device for substrates and method for coating a substrate |
06/28/2012 | WO2012084048A1 A method for providing an ecpr master electrode |
06/28/2012 | WO2012084047A1 An ecpr master electrode and a method for providing such ecpr master electrode |
06/28/2012 | WO2012084046A1 An ecpr master electrode, and a method for providing such master electrode |
06/28/2012 | WO2012083978A1 Accommodating device for retaining wafers |
06/28/2012 | WO2012083955A1 Single-position hall effect measurements |
06/28/2012 | WO2012083787A1 Metal-oxide-semiconductor (mos) device and method for fabricating the same |
06/28/2012 | WO2012083784A1 Semiconductor device and method for fabricating the same |
06/28/2012 | WO2012083783A1 Double-diffusion metal-oxide semiconductor devices |
06/28/2012 | WO2012083621A1 Chemical mechanical polishing equipment and warm-up method thereof |
06/28/2012 | WO2012083604A1 Semiconductor device manufacturing method |
06/28/2012 | WO2012083603A1 Planarizing method of interlayer dielectric layer |
06/28/2012 | WO2012083600A1 Method for preventing metal silicide transverse intruding into channel region |
06/28/2012 | WO2012083590A1 Power semiconductor field effect transistor structure with charge trapping material in the gate dielectric |
06/28/2012 | WO2012083561A1 Nozzle for electronic assembly |
06/28/2012 | WO2012083510A1 Organic semiconductor materials, preparation methods and applications thereof |
06/28/2012 | WO2012061740A3 Touch fingerprint sensor using 1-3 piezo composites and acoustic impediography principle |
06/28/2012 | WO2012061266A3 Method of forming an array of nanostructures |
06/28/2012 | WO2012061232A3 Method of depositing dielectric films using microwave plasma |
06/28/2012 | WO2012061199A3 No flow underfill |
06/28/2012 | WO2012061130A3 Low temperature implant to improve bjt current gain |
06/28/2012 | WO2012059848A3 Iii-nitride light emitting device |
06/28/2012 | WO2012054689A3 Substrate support with symmetrical feed structure |
06/28/2012 | WO2012054644A3 Wafer container with door guide and seal |
06/28/2012 | WO2012054630A3 Front opening wafer container with door deflection minimization |
06/28/2012 | WO2012054444A3 Gettering agents in memory charge storage structures |
06/28/2012 | WO2012054379A3 Methods and apparatus for recovery and reuse of reagents |
06/28/2012 | WO2012054263A3 Multiple matching reference spectra for in-situ optical monitoring |
06/28/2012 | WO2012051113A3 ATOMIC LAYER DEPOSITION OF CRYSTALLINE PrCaMnO (PCMO) AND RELATED STRUCTURES AND METHODS |
06/28/2012 | WO2012050322A3 Method and apparatus for manufacturing three-dimensional- structure memory device |
06/28/2012 | WO2012048044A3 Module for ozone cure and post-cure moisture treatment |
06/28/2012 | WO2012047697A3 Pecvd oxide-nitride and oxide-silicon stacks for 3d memory application |
06/28/2012 | WO2012047531A3 Substrate processing system with multiple processing devices deployed in shared ambient emvironment and associated methods |
06/28/2012 | WO2012047035A3 Substrate processing device for supplying reaction gas through symmetry-type inlet and outlet |
06/28/2012 | WO2012037376A3 Epitaxial growth temperature control in led manufacture |
06/28/2012 | WO2012037278A3 Transfer chamber metrology for improved device yield |
06/28/2012 | WO2012036522A3 Substrate structure for high-efficiency light emitting diodes and method of growing epitaxial base-layers thereon |
06/28/2012 | WO2012036499A3 Thin film deposition apparatus |
06/28/2012 | WO2012036444A3 Polishing pad for cmp |
06/28/2012 | WO2012033305A3 Method for manufacturing a semiconductor device |
06/28/2012 | WO2012033287A9 Cmp pad conditioner and method for manufacturing the same |
06/28/2012 | WO2012027857A3 Method for manufacturing a tandem solar cell with microcrystalline absorber layer |
06/28/2012 | WO2012021321A3 Composite substrates for direct heating and increased temperature uniformity |
06/28/2012 | WO2011156657A3 High productivity thin film deposition method and system |
06/28/2012 | WO2011054405A3 Method and apparatus for treating substrates |
06/28/2012 | WO2010052245A3 Reverse-conducting semiconductor device |
06/28/2012 | US20120164918 Chemical Mechanical Polish Process Control for Improvement in Within-Wafer Thickness Uniformity |
06/28/2012 | US20120164848 Method for forming nitride film |
06/28/2012 | US20120164847 Thin film forming method, thin film forming apparatus, and program |
06/28/2012 | US20120164846 Method of Forming Metal Oxide Hardmask |
06/28/2012 | US20120164845 Dual zone gas injection nozzle |
06/28/2012 | US20120164844 Method and apparatus for forming oxide film on carbon film |
06/28/2012 | US20120164843 Transfer of high temperature wafers |
06/28/2012 | US20120164842 Trench embedding method and film-forming apparatus |
06/28/2012 | US20120164841 Combinatorial non-contact wet processing |
06/28/2012 | US20120164840 Substrate Processing Method and Substrate Processing Apparatus |
06/28/2012 | US20120164839 Substrate processing method |
06/28/2012 | US20120164838 Method for planarizing interlayer dielectric layer |
06/28/2012 | US20120164837 Feature size reduction |
06/28/2012 | US20120164836 Integrated circuit fabrication methods utilizing embedded hardmask layers for high resolution patterning |
06/28/2012 | US20120164835 Method of Forming Via Hole |
06/28/2012 | US20120164834 Variable-Density Plasma Processing of Semiconductor Substrates |