Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2014
11/04/2014US8876976 Chemical vapor deposition apparatus for equalizing heating temperature
11/04/2014US8876975 Thin film deposition apparatus
11/04/2014US8876973 Film of n type (100) oriented single crystal diamond semiconductor doped with phosphorous atoms, and a method of producing the same
11/04/2014US8876453 Substrate processing apparatus and method of manufacturing semiconductor device
11/04/2014US8875866 Article transport facility
11/04/2014US8875766 Device and method for the application of a sheet-like jointing means onto a contact area of a wafer
11/04/2014US8875720 Apparatus and method for washing polycrystalline silicon
11/04/2014US8875657 Balancing RF bridge assembly
10/2014
10/30/2014US20140323035 Random delay generation for thin-film transistor based circuits
10/30/2014US20140323018 Polishing device for removing polishing byproducts
10/30/2014US20140323016 Polishing method and polishing apparatus
10/30/2014US20140322927 Drawing apparatus and method of manufacturing article
10/30/2014US20140322926 Method of manufacturing semiconductor device
10/30/2014US20140322925 Method of laser annealing process
10/30/2014US20140322924 Silicon containing compounds for ald deposition of metal silicate films
10/30/2014US20140322923 Dielectrics containing at least one of a refractory metal or a non-refractory metal
10/30/2014US20140322922 Method and apparatus for microwave treatment of dielectric films
10/30/2014US20140322921 Method and apparatus for microwave treatment of dielectric films
10/30/2014US20140322920 Method of manufacturing semiconductor device using the same
10/30/2014US20140322919 Semiconductor wafer chuck and method
10/30/2014US20140322918 Micro-posts having improved uniformity and a method of manufacture thereof
10/30/2014US20140322917 Grapho-epitaxy dsa process with dimension control of template pattern
10/30/2014US20140322916 Methods of fabricating a semiconductor device using voids in a sacrificial layer
10/30/2014US20140322915 Semiconductor device having hard mask structure and fine pattern and forming method thereof
10/30/2014US20140322914 Gap embedding composition, method of embedding gap and method of producing semiconductor device by using the composition
10/30/2014US20140322913 Polishing composition
10/30/2014US20140322912 Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers
10/30/2014US20140322911 Semiconductor devices and methods of forming the same
10/30/2014US20140322910 Via-free interconnect structure with self-aligned metal line interconnections
10/30/2014US20140322909 Wafer Backside Interconnect Structure Connected to TSVs
10/30/2014US20140322907 Self-aligned process to fabricate a memory cell array with a surrounding-gate access transistor
10/30/2014US20140322906 Method for Patterned Doping of a Semiconductor
10/30/2014US20140322905 Method of forming the buffer layer in the ltps products
10/30/2014US20140322904 Semiconductor device and method for fabricating the same
10/30/2014US20140322903 Enriched silicon precursor compositions and apparatus and processes for utilizing same
10/30/2014US20140322902 Methods for using isotopically enriched levels of dopant gas compositions in an ion implantation process
10/30/2014US20140322901 Semiconductor nanocrystals, method for preparing, and products
10/30/2014US20140322900 Low-pressure chemical vapor deposition apparatus and thin-film deposition method thereof
10/30/2014US20140322899 Substrate recycling method
10/30/2014US20140322898 Nanocomposite and method of making thereof
10/30/2014US20140322897 Flow controlled liner having spatially distributed gas passages
10/30/2014US20140322895 Method for manufacturing a bonded soi wafer
10/30/2014US20140322893 Manufacturing method of semiconductor device
10/30/2014US20140322891 Method of forming shallow trench isolations
10/30/2014US20140322890 Polishing systems and methods for removing conductive material from microelectronic substrates
10/30/2014US20140322879 Method of forming sigma-shaped trench
10/30/2014US20140322878 Semiconductor device including gate electrode for applying tensile stress to silicon substrate, and method of manufacturing the same
10/30/2014US20140322873 High performance stress-enhanced mosfets using si:c and sige epitaxial source/drain and method of manufacture
10/30/2014US20140322871 Partial soi on power device for breakdown voltage improvement
10/30/2014US20140322869 Method for manufacturing chip package structure
10/30/2014US20140322867 Conductive via structures for routing porosity and low via resistance, and processes of making
10/30/2014US20140322866 Package for Three Dimensional Integrated Circuit
10/30/2014US20140322865 Semiconductor Device and Method of Forming Stacked Semiconductor Die and Conductive Interconnect Structure Through an Encapsulant
10/30/2014US20140322864 Low cte interposer
10/30/2014US20140322847 Wafer processing method
10/30/2014US20140322834 Apparatus and method for bonding substrates
10/30/2014US20140322833 Irradiation apparatus for irradiating charged particle beam, method for irradiation of charged particle beam, and method for manufacturing article
10/30/2014US20140322832 Method of fabricating semiconductor device
10/30/2014US20140322831 Lithography apparatus, lithography method, and method of manufacturing article
10/30/2014US20140322830 Semiconductor device and manufacturing method thereof
10/30/2014US20140322546 Thermally oxidized heterogeneous composite substrate and method for manufacturing same
10/30/2014US20140322528 Base film for dicing sheet and dicing sheet
10/30/2014US20140322474 Adhesive resin composition, laminate, and self-stripping method
10/30/2014US20140321957 Wafer transport robot
10/30/2014US20140321488 Tunable Laser With High Thermal Wavelength Tuning Efficiency
10/30/2014US20140321222 Semiconductor memory of which defective cell is replaceable with redundant cell and manufacturing method of semiconductor memory
10/30/2014US20140320867 Method for processing wafer
10/30/2014US20140320840 Exposure Apparatus and Exposure Method
10/30/2014US20140320837 Monitoring apparatus and method particularly useful in photolithographically processing substrates
10/30/2014US20140320231 Integrated-Circuit Module with Waveguide Transition Element
10/30/2014US20140319786 Apparatus and method for aligning and centering wafers
10/30/2014US20140319784 Method for manufacturing semiconductor device
10/30/2014US20140319703 Self-defining, low capacitance wire bond pad
10/30/2014US20140319702 Stackable Package by Using Internal Stacking Modules
10/30/2014US20140319700 Semiconductor device and method of manufacturing same
10/30/2014US20140319699 Reliable packaging and interconnect structures
10/30/2014US20140319698 Redistribution Layer Contacting First Wafer through Second Wafer
10/30/2014US20140319697 Disabling electrical connections using pass-through 3d interconnects and associated systems and methods
10/30/2014US20140319694 Anticipatory implant for tsv
10/30/2014US20140319693 Semiconductor device and method of forming the same
10/30/2014US20140319690 Semiconductor device and method of fabricating the same
10/30/2014US20140319687 Substrate with a functional layer comprising a sulphurous compound
10/30/2014US20140319686 Semiconductor device and manufacturing method thereof
10/30/2014US20140319685 Hybrid Graphene-Metal Interconnect Structures
10/30/2014US20140319679 Semiconductor Method and Device of Forming a Fan-Out POP Device with PWB Vertical Interconnect Units
10/30/2014US20140319676 Electronic component manufacturing method and electrode structure
10/30/2014US20140319671 Semiconductor device and grinding method of semiconductor device
10/30/2014US20140319664 Quad flat no-lead (qfn) packaging structure and method for manufacturing the same
10/30/2014US20140319663 Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device
10/30/2014US20140319661 Semiconductor Device and Method of Forming Shielding Layer Over Semiconductor Die Mounted to TSV Interposer
10/30/2014US20140319660 Solid-state electronic device
10/30/2014US20140319655 Method for coupling a graphene layer and a substrate and device comprising the graphene/substrate structure obtained
10/30/2014US20140319653 Integrated Switchable Capacitive Device
10/30/2014US20140319650 Programmable electrical fuse
10/30/2014US20140319626 Metal Gate Stack Having TiAlCN as Work Function Layer and/or Blocking/Wetting Layer
10/30/2014US20140319623 Methods of integrating multiple gate dielectric transistors on a tri-gate (finfet) process
10/30/2014US20140319622 Semiconductor device and methods for forming the same
10/30/2014US20140319620 Methods for fabricating integrated circuits with polycrystalline silicon resistor structures using a replacment gate process flow, and the integrated circuits fabricated thereby
10/30/2014US20140319616 Method for producing a metal-gate mos transistor, in particular a pmos transistor, and corresponding integrated circuit
10/30/2014US20140319612 Semiconductor-on-insulator structure and process for producing same
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