Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/1996
06/25/1996US5530401 Single source differential circuit
06/25/1996US5530394 CMOS circuit with increased breakdown strength
06/25/1996US5530379 Output buffer circuit that can be shared by a plurality of interfaces and a semiconductor device using the same
06/25/1996US5530374 Method of identifying probe position and probing method in prober
06/25/1996US5530371 Probe card assembly
06/25/1996US5530370 Testing apparatus for testing and handling a multiplicity of devices
06/25/1996US5530295 Electronic package
06/25/1996US5530294 Semiconductor contact that partially overlaps a conductive line pattern and a method of manufacturing same
06/25/1996US5530293 Dielectric for covering an interconnecting wire
06/25/1996US5530291 Electronic package assembly and connector for use therewith
06/25/1996US5530290 Large scale IC personalization method employing air dielectric structure for extended conductor
06/25/1996US5530286 Semiconductor device
06/25/1996US5530280 Process for producing crackstops on semiconductor devices and devices containing the crackstops
06/25/1996US5530279 Thin film capacitor with small leakage current and method for fabricating the same
06/25/1996US5530278 Semiconductor chip having a dam to prevent contamination of photosensitive structures thereon
06/25/1996US5530276 Nonvolatile semiconductor memory device
06/25/1996US5530274 Mos capacitor, Vpp switch circuit, charge pump circuit, eeprom, microcomputer, and IC card
06/25/1996US5530273 Semiconductor device capable of preventing reduction of cut-off frequency by Kark effect even when operated within a high electric current density range
06/25/1996US5530272 High electron mobility transistor including periodic heterojunction interface
06/25/1996US5530271 Integrated structure active clamp for the protection of power semiconductor devices against overvoltages
06/25/1996US5530270 Substrate for semiconductr device
06/25/1996US5530267 Single crystal metal oxides; light emitting diode
06/25/1996US5530265 Insulated gate semiconductor device and process for fabricating the same
06/25/1996US5530262 Bidirectional field emission devices, storage structures and fabrication methods
06/25/1996US5530222 Apparatus for positioning a furnace module in a horizontal diffusion furnace
06/25/1996US5529959 Charge-coupled device image sensor
06/25/1996US5529958 Method of manufacturing a semiconductor device having silicide
06/25/1996US5529956 Multi-layer wiring structure in semiconductor device and method for manufacturing the same
06/25/1996US5529955 Wiring forming method
06/25/1996US5529954 Annealing in atmosphere containing a predetermined element which reacts with metal element in first film
06/25/1996US5529953 Method of forming studs and interconnects in a multi-layered semiconductor device
06/25/1996US5529952 Refilling a trenched portion formed by multiple angled deposition in semiconductor
06/25/1996US5529951 Method of forming polycrystalline silicon layer on substrate by large area excimer laser irradiation
06/25/1996US5529950 Method for manufacturing a cubically integrated circuit arrangement
06/25/1996US5529948 LOCOS technology with reduced junction leakage
06/25/1996US5529947 Semiconductor device with clad substrate and fabrication process therefor
06/25/1996US5529946 Process of fabricating DRAM storage capacitors
06/25/1996US5529945 Methods for fabricating a multi-bit storage cell
06/25/1996US5529944 Method of making cross point four square folded bitline trench DRAM cell
06/25/1996US5529943 Method of making buried bit line ROM with low bit line resistance
06/25/1996US5529942 Self-aligned coding process for mask ROM
06/25/1996US5529940 Method of manufacturing a vertical MOSFET having a gate electrode of polycrystalline silicon
06/25/1996US5529939 Method of making an integrated circuit with complementary isolated bipolar transistors
06/25/1996US5529937 Crystallizing a thermal annealed non-monocrystal silicon film by irradiating silicon film with light after depositing a metal catalyst
06/25/1996US5529888 Containing water soluble copolymer of n-vinylpyrrolidone and another vinyl monomer, fluorinated organic acid
06/25/1996US5529881 Alkali-soluble resin and 1,2-naphthoquinonediazide sulfonic acid ester of specified polyhydroxy compound as photosensitive compound
06/25/1996US5529880 Photoresist with a mixture of a photosensitive esterified resin and an o-naphthoquinone diazide compound
06/25/1996US5529852 Containing aluminum oxide, calcium oxide, tungsten; adhesion, airtightness, thermoconductivity
06/25/1996US5529682 Heating previously metal-plated connectors until solderable metal flows to improve adhesion
06/25/1996US5529670 Collimating, heating the integrated circuit for sputtering titanium or titanium nitride
06/25/1996US5529640 Epitaxial metal-insulator-metal-semiconductor structures
06/25/1996US5529638 Method for wafer scrubbing
06/25/1996US5529634 Apparatus and method of manufacturing semiconductor device
06/25/1996US5529632 Microwave plasma processing system
06/25/1996US5529630 Apparatus for manufacturing a liquid crystal display substrate, and apparatus for evaluating semiconductor crystals
06/25/1996US5529626 Spincup with a wafer backside deposition reduction apparatus
06/25/1996US5529279 Thermal isolation structures for microactuators
06/25/1996US5529236 Wire bonding apparatus
06/25/1996US5529197 Polysilicon/polycide etch process for sub-micron gate stacks
06/25/1996US5529051 Method of preparing silicon wafers
06/25/1996US5528825 Method of manufacture of hybrid integrated circuit
06/25/1996CA2166037A1 Method of forming conductive paths on a substrate having depressions
06/25/1996CA2082021C Method of stabilizing the surface properties of objects to be thermally treated in a vacuum
06/25/1996CA2070308C Process of producing multiple-layer glass-ceramic circuit board
06/25/1996CA2016449C Planar isolation technique for integrated circuits
06/23/1996CA2162067A1 Method for integrating analog and digital functional components, and resulting semiconductor chip including an integrated dram
06/20/1996WO1996019096A1 Method and device for plasma processing
06/20/1996WO1996019013A1 Method and support for connecting an integrated circuit to another support via balls
06/20/1996WO1996019012A1 Forming polyimide coatings by screen printing
06/20/1996WO1996019011A1 A method of fabricating ldd mos transistors utilizing high energy ion implant through an oxide layer
06/20/1996WO1996019010A1 Method for fabricating asymmetrical ldd mos devices
06/20/1996WO1996019009A1 Vacuum microelectronic device and methodology for fabricating same
06/20/1996WO1996019000A1 Exit window for x-ray lithography beamline
06/20/1996DE19546962A1 Metallisation structure e.g. of liq. crystal device
06/20/1996DE19546578A1 Halbleiterlaservorrichtung und Herstellungsverfahren einer Halbleitervorrichtung A semiconductor laser device and manufacturing method of a semiconductor device
06/19/1996EP0717497A2 Compounded power MOSFET
06/19/1996EP0717477A2 Semiconductor device and method for manufacturing the same
06/19/1996EP0717450A2 Vertiacal insulated gate semiconductor device and method of manufacturing the same
06/19/1996EP0717449A2 Cell structure of a MOS type semiconductor device
06/19/1996EP0717448A1 Asymmetric low power MOS devices
06/19/1996EP0717444A2 Programming a logic level within an integrated circuit
06/19/1996EP0717442A1 Process and integrated circuit connection support to another support by means of bumps
06/19/1996EP0717441A2 Method of solder bonding a body, e.g. a silicon chip, to another body
06/19/1996EP0717439A2 A method of fabricating a TFT-EL pixel
06/19/1996EP0717438A2 Method for forming side contact of semiconductor device
06/19/1996EP0717437A2 Method of forming buried oxide layers
06/19/1996EP0717436A2 Process for fabricating a collimated metal layer and contact structure in a semiconductor device
06/19/1996EP0717435A1 Process for controlling dopant diffusion in a semiconductor layer and semiconductor layer formed thereby
06/19/1996EP0717434A2 Method of manufacturing compound semiconductor integrated circuit
06/19/1996EP0717432A1 Apparatus and methods for sputter depositing a film on a substrate
06/19/1996EP0717431A1 Reversing orientation of sputtering screen to avoid contamination
06/19/1996EP0717430A1 Substrate loading apparatus
06/19/1996EP0717416A2 Input circuit for both analog and digital signals
06/19/1996EP0717414A2 Semiconductor memory
06/19/1996EP0717413A2 Memory cell and wordline driver for embedded dram in ASIC process
06/19/1996EP0717370A2 Method of encapsulating a chipcard module and device for performing the method
06/19/1996EP0717319A1 Photoacid generating composition used in radiation-sensitive compositions
06/19/1996EP0717299A1 Exposure apparatus
06/19/1996EP0717287A2 Input and output boundary scan cells
06/19/1996EP0717279A1 Methodology for monitoring solvent quality