Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2013
06/13/2013WO2013084952A1 Adhesive sheet for semiconductor wafer processing, method for processing of semiconductor wafer using sheet
06/13/2013WO2013084906A1 Exposure device, and production method for structure
06/13/2013WO2013084902A1 Plasma processing apparatus and plasma processing method
06/13/2013WO2013084898A1 Exposure device and exposure method
06/13/2013WO2013084874A1 Membrane sheet with bumps for probe card, probe card and method for manufacturing membrane sheet with bumps for probe card
06/13/2013WO2013084846A1 Semiconductor device
06/13/2013WO2013084836A1 Sheet-shaped coupling agent, coupling method, and manufacturing method for electronic device
06/13/2013WO2013084807A1 Method for manufacturing semiconductor laser element, and semiconductor laser element
06/13/2013WO2013084761A1 Bonding device and bonding method
06/13/2013WO2013084732A1 Compound semiconductor layer, method for manufacturing compound semiconductor layer, compound thin film solar cell, and method for manufacturing compound thin film solar cell
06/13/2013WO2013084726A1 Field-effect transistor
06/13/2013WO2013084686A1 Polishing composition, and polishing method and substrate production method using same
06/13/2013WO2013084676A1 Organic transistor and method for manufacturing same
06/13/2013WO2013084646A1 Neutralizing jig, substrate treatment device using same, and method for neutralizing substrate treatment device
06/13/2013WO2013084620A1 Method for manufacturing semiconductor device
06/13/2013WO2013084598A1 Heat treatment method and heat treatment device
06/13/2013WO2013084575A1 Yellow room system
06/13/2013WO2013084574A1 Spin development method and device
06/13/2013WO2013084529A1 Imaging device and manufacturing method for same
06/13/2013WO2013084509A1 Pressurizing apparatus, substrate bonding apparatus, and bonded substrates
06/13/2013WO2013084496A1 Wireless module
06/13/2013WO2013084479A1 Wireless module
06/13/2013WO2013084459A1 Plasma treatment method and plasma treatment device
06/13/2013WO2013084451A1 Semiconductor device
06/13/2013WO2013084298A1 Positioning device and electronic component transportation device provided with same
06/13/2013WO2013084297A1 Post-operation processing device, transportation device for externally placed unit, and electronic component transportation device
06/13/2013WO2013084083A2 Method, apparatus and composition for wet etching
06/13/2013WO2013084035A1 Semiconductor on insulator structure with improved electrical characteristics
06/13/2013WO2013083897A1 Improved interface between a i/iii/vi2 layer and a back contact layer in a photovoltaic cell
06/13/2013WO2013083356A1 Flash lamp arrangement
06/13/2013WO2013083289A1 Apparatus and method for measuring a wafer-like substrate
06/13/2013WO2013083196A1 Substrate holder for full area processing, carrier and method of processing substrates
06/13/2013WO2013083193A1 A component handling assembly
06/13/2013WO2013083105A1 Method of etching for metal mixed oxides
06/13/2013WO2013083017A1 Grooved insulated-gate bipolar transistor and preparation method thereof
06/13/2013WO2013082844A1 Interconnection structure and method for fabricating the same
06/13/2013WO2013082827A1 Tft array substrate manufacturing method and tft array substrate
06/13/2013WO2013082776A1 Alignment apparatus for cutting machine
06/13/2013WO2013058557A3 Substrate alignment device
06/13/2013WO2013057465A3 Method of placing solder balls on a substrate using a stencil with spacing means and reversely tapered apertures and corresponding apparatus
06/13/2013WO2013055453A3 Solder-coated copper stud bump wafer level package and manufacturing method thereof
06/13/2013WO2013052509A3 Remote plasma burn-in
06/13/2013WO2013049173A3 Improved intrench profile
06/13/2013WO2013039608A3 Carrier head with composite plastic portions
06/13/2013WO2013032260A3 Electrostatic chuck
06/13/2013WO2013032191A9 Non-volatile polymer memory device including a buffer layer, and method for manufacturing same
06/13/2013WO2013032175A4 Bonding wire including a wire rod coated with a carbon allotrope
06/13/2013WO2013019062A3 Equipment for manufacturing semiconductor for epitaxial process
06/13/2013WO2013013986A3 Temporary adhesion of chemically similar substrates
06/13/2013WO2013012226A3 Cmp pad conditioner
06/13/2013WO2012177086A3 Method of fabricating wafer
06/13/2013WO2012134663A3 Method and apparatus utilizing a single lift mechanism for processing and transfer of substrates
06/13/2013WO2012026974A3 Pals compliant routing system
06/13/2013US20130151836 Semiconductor device including encryption section, semiconductor device including external interface, and content reproduction method
06/13/2013US20130149941 Method Of Machining Semiconductor Substrate And Apparatus For Machining Semiconductor Substrate
06/13/2013US20130149874 Method of Manufacturing Semiconductor Device, Method of Processing Substrate, Substrate Processing Apparatus and Non-Transitory Computer-Readable Recording Medium
06/13/2013US20130149873 Method of Manufacturing Semiconductor Device, Method of Processing Substrate, Substrate Processing Apparatus and Non-Transitory Computer-Readable Recording Medium
06/13/2013US20130149872 Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and non-transitory computer-readable recording medium
06/13/2013US20130149871 Chemical vapor deposition film profile uniformity control
06/13/2013US20130149870 Substrate carrier and applications thereof
06/13/2013US20130149869 Silicon on insulator etch
06/13/2013US20130149868 Masking Method and Apparatus
06/13/2013US20130149867 Substrate processing system, gas supply unit, method of substrate processing, computer program, and storage medium
06/13/2013US20130149866 Baffle plate for semiconductor processing apparatus
06/13/2013US20130149865 Method and structure for differential silicide and recessed or raised source/drain to improve field effect transistor
06/13/2013US20130149864 Semiconductor Device and Manufacturing Method Thereof
06/13/2013US20130149863 Method for fabricating semiconductor device by damascene process
06/13/2013US20130149862 Method for forming fine pattern having variable width and method for manufacturing semiconductor device using the same
06/13/2013US20130149861 Contact for memory cell
06/13/2013US20130149859 Tungsten metallization: structure and fabrication of same
06/13/2013US20130149858 Method of manufacturing bump
06/13/2013US20130149856 Interface Structure for Copper-Copper Peeling Integrity
06/13/2013US20130149855 Semiconductor device and method of manufacturing the same
06/13/2013US20130149854 Method of manufacturing semiconductor device and semiconductor device
06/13/2013US20130149852 Method for forming a semiconductor device
06/13/2013US20130149851 Methods of Protecting Elevated Polysilicon Structures During Etching Processes
06/13/2013US20130149850 Method for manufacturing semiconductor device
06/13/2013US20130149849 Combining ztcr resistor with laser anneal for high performance pmos transistor
06/13/2013US20130149848 Method for manufacturing vertical-channel tunneling transistor
06/13/2013US20130149847 METHOD OF MANUFACTURING GaN-BASED FILM AND COMPOSITE SUBSTRATE USED THEREFOR
06/13/2013US20130149846 Method of manufacturing semiconductor device and substrate processing apparatus
06/13/2013US20130149845 n- and p-Channel Field Effect Transistors with Single Quantum Well for Complementary Circuits
06/13/2013US20130149844 Method of growing zinc oxide nanowire
06/13/2013US20130149843 In-situ Gettering Method for Removing Metal Impurities from the Surface and Interior of a Upgraded Metallurgical Grade Silicon Wafer
06/13/2013US20130149842 Laminated sheet and method of manufacturing semiconductor device using the laminated sheet
06/13/2013US20130149841 Wafer dicing employing edge region underfill removal
06/13/2013US20130149840 Method for manufacturing soi substrate and semiconductor device
06/13/2013US20130149839 Apparatus for bonding substrates to each other
06/13/2013US20130149838 Process for filling deep trenches in a semiconductor material body, and semiconductor device resulting from the same process
06/13/2013US20130149837 Semiconductor device and method of manufacturing the same
06/13/2013US20130149836 Method of double-sided patterning
06/13/2013US20130149830 Methods of forming field effect transistors having silicon-germanium source/drain regions therein
06/13/2013US20130149827 Semiconductor device and method of manufacturing same
06/13/2013US20130149826 FinFETs with Multiple Fin Heights
06/13/2013US20130149824 Method for manufacturing a tunneling field effect transistor with a u-shaped channel
06/13/2013US20130149823 Semiconductor device having silicon on stressed liner (sol)
06/13/2013US20130149822 Method for fabricating semiconductor device
06/13/2013US20130149821 Methods for a Gate Replacement Process
06/13/2013US20130149820 Method for manufacturing semiconductor device
06/13/2013US20130149817 Fabricating methods of semiconductor devices and pick-up apparatuses of semiconductor devices therein
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