| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/13/2013 | US20130149816 Semiconductor device and method for manufacturing semiconductor device |
| 06/13/2013 | US20130149802 Method of manufacturing semiconductor element |
| 06/13/2013 | US20130149800 Method of Controlling Semiconductor Device Fabrication |
| 06/13/2013 | US20130149799 Wafer temperature correction system for ion implantation device |
| 06/13/2013 | US20130149796 Semiconductor device with ferro-electric capacitor |
| 06/13/2013 | US20130149795 Etching method and method of manufacturing semiconductor device |
| 06/13/2013 | US20130149794 Method of manufacturing semiconductor device |
| 06/13/2013 | US20130149647 Holding apparatus, drawing apparatus, and method of manufacturing article |
| 06/13/2013 | US20130149637 Titania and sulfur co-doped quartz glass member and making method |
| 06/13/2013 | US20130149485 Support substrate |
| 06/13/2013 | US20130149468 Methods and apparatus for incorporating nitrogen in oxide films |
| 06/13/2013 | US20130149078 Substrate-processing apparatus and substrate-transferring method |
| 06/13/2013 | US20130149075 High throughput load lock for solar wafers |
| 06/13/2013 | US20130148413 Solid, multi-state molecular random access memory |
| 06/13/2013 | US20130148401 Systems and methods for stacked semiconductor memory devices |
| 06/13/2013 | US20130148398 Three-dimensional non-volatile memory device, memory system including the same and method of manufacturing the same |
| 06/13/2013 | US20130148094 Stage unit, exposure apparatus, and exposure method |
| 06/13/2013 | US20130148093 Holding apparatus, drawing apparatus, and method of manufacturing article |
| 06/13/2013 | US20130148090 Exposure apparatus |
| 06/13/2013 | US20130148075 Liquid crystal lens and manufacturing method thereof |
| 06/13/2013 | US20130148041 Semiconductor device |
| 06/13/2013 | US20130147540 Semiconductor modules and methods of forming the same |
| 06/13/2013 | US20130147509 Test pattern of semiconductor device, method of manufacturing test pattern and method of testing semiconductor device by using test pattern |
| 06/13/2013 | US20130147472 Micro-Fabricated Atomic Magnetometer and Method of Forming the Magnetometer |
| 06/13/2013 | US20130147319 Loading element of a film bulk acoustic resonator |
| 06/13/2013 | US20130147129 Wafer supporting structure |
| 06/13/2013 | US20130147067 Locally tailoring chemical mechanical polishing (cmp) polish rate for dielectrics |
| 06/13/2013 | US20130147066 Structure and method for e-beam in-chip overlay mark |
| 06/13/2013 | US20130147065 Semiconductor Device and Method of Forming Adjacent Channel and Dam Material Around Die Attach Area of Substrate to Control Outward Flow of Underfill Material |
| 06/13/2013 | US20130147062 Multi-chip package and method of manufacturing the same |
| 06/13/2013 | US20130147061 Trap Rich Layer with Through-Silicon-Vias in Semiconductor Devices |
| 06/13/2013 | US20130147059 Chip-to-wafer bonding method and three-dimensional integrated semiconductor device |
| 06/13/2013 | US20130147057 Through silicon via (tsv) isolation structures for noise reduction in 3d integrated circuit |
| 06/13/2013 | US20130147056 Resized wafer with a negative photoresist ring and design structures thereof |
| 06/13/2013 | US20130147055 Semiconductor Device and Method of Forming Guard Ring Around Conductive TSV through Semiconductor Wafer |
| 06/13/2013 | US20130147054 Semiconductor Device and Method of Forming Thick Encapsulant for Stiffness with Recesses for Stress Relief in FO-WLCSP |
| 06/13/2013 | US20130147053 Semiconductor Device and Method of Making Single Layer Substrate with Asymmetrical Fibers and Reduced Warpage |
| 06/13/2013 | US20130147052 Offset of contact opening for copper pillars in flip chip packages |
| 06/13/2013 | US20130147051 Method of protecting against via failure and structure therefor |
| 06/13/2013 | US20130147050 Semiconductor having integrally-formed enhanced thermal management |
| 06/13/2013 | US20130147049 Circuit Probing Structures and Methods for Probing the Same |
| 06/13/2013 | US20130147047 Integrated Circuit and Method of Forming an Integrated Circuit |
| 06/13/2013 | US20130147045 Flash Memory Having Multi-Level Architecture |
| 06/13/2013 | US20130147043 Substrate with embedded stacked through-silicon via die |
| 06/13/2013 | US20130147041 Stack package structure and fabrication method thereof |
| 06/13/2013 | US20130147040 Mems chip scale package |
| 06/13/2013 | US20130147036 Semiconductor Device and Method of Forming UBM Structure on Back Surface of TSV Semiconductor Wafer |
| 06/13/2013 | US20130147035 Semiconductor Device and Method of Forming Recesses in Conductive Layer to Detect Continuity for Interconnect Between Semiconductor Die and Substrate |
| 06/13/2013 | US20130147032 Passivation layer for packaged chip |
| 06/13/2013 | US20130147031 Semiconductor device with bump structure on post-passivation interconncet |
| 06/13/2013 | US20130147028 Heat spreader for multiple chip systems |
| 06/13/2013 | US20130147025 Method of stacking flip-chip on wire-bonded chip |
| 06/13/2013 | US20130147024 Balanced leadframe package structure and method of manufacturing the same |
| 06/13/2013 | US20130147021 Multi-layer substrate structure and manufacturing method for the same |
| 06/13/2013 | US20130147020 Component Having a Via and Method for Manufacturing It |
| 06/13/2013 | US20130147018 Structure for Reducing Integrated Circuit Corner Peeling |
| 06/13/2013 | US20130147012 Circuit board component shim structure |
| 06/13/2013 | US20130147009 Semiconductor device and method for manufacturing the same |
| 06/13/2013 | US20130147007 Deep isolation trench structure and deep trench capacitor on a semiconductor-on-insulator substrate |
| 06/13/2013 | US20130146996 Magnetic device fabrication |
| 06/13/2013 | US20130146993 Semiconductor structure having a polysilicon structure and method of forming same |
| 06/13/2013 | US20130146992 Deep trench embedded gate transistor |
| 06/13/2013 | US20130146991 Device Including Two Power Semiconductor Chips and Manufacturing Thereof |
| 06/13/2013 | US20130146989 Integrated semiconductor device and manufacturing method therefor |
| 06/13/2013 | US20130146984 Semiconductor device and method of manufacturing the same |
| 06/13/2013 | US20130146983 Nitride based semiconductor device and manufacturing method thereof |
| 06/13/2013 | US20130146981 Antenna cell design to prevent plasma induced gate dielectric damage in semiconductor integrated circuits |
| 06/13/2013 | US20130146980 Apparatuses and methods for transposing select gates |
| 06/13/2013 | US20130146977 Semiconductor structure and method for manufacturing the same |
| 06/13/2013 | US20130146976 Integrated circuits formed on strained substrates and including relaxed buffer layers and methods for the manufacture thereof |
| 06/13/2013 | US20130146975 Semiconductor device and integrated circuit with high-k/metal gate without high-k direct contact with sti |
| 06/13/2013 | US20130146973 Customized shield plate for a field effect transistor |
| 06/13/2013 | US20130146967 Trench-Gate Resurf Semiconductor Device and Manufacturing Method |
| 06/13/2013 | US20130146962 Semiconductor device and method of manufacturing the same |
| 06/13/2013 | US20130146959 Method and Structure For Forming On-Chip High Quality Capacitors With ETSOI Transistors |
| 06/13/2013 | US20130146958 Method for forming buried bit line, semiconductor device having the same, and fabricating method thereof |
| 06/13/2013 | US20130146957 Embedded dynamic random access memory device formed in an extremely thin semiconductor on insulator (etsoi) substrate |
| 06/13/2013 | US20130146954 Method Of Memory Array And Structure Form |
| 06/13/2013 | US20130146953 Method and Structure For Forming ETSOI Capacitors, Diodes, Resistors and Back Gate Contacts |
| 06/13/2013 | US20130146952 On-chip capacitors in combination with cmos devices on extremely thin semiconductor on insulator (etsoi) substrates |
| 06/13/2013 | US20130146950 Semiconductor device and manufacturing method thereof |
| 06/13/2013 | US20130146949 Mechanisms for forming stressor regions in a semiconductor device |
| 06/13/2013 | US20130146947 SELF-ALIGNED EMITTER-BASE IN ADVANCED BiCMOS TECHNOLOGY |
| 06/13/2013 | US20130146944 Semiconductor device including stepped gate electrode and fabrication method thereof |
| 06/13/2013 | US20130146943 In situ grown gate dielectric and field plate dielectric |
| 06/13/2013 | US20130146939 Silicone adhesive for semiconductor element |
| 06/13/2013 | US20130146896 Semiconductor optical device having an air media layer and the method for forming the air media layer thereof |
| 06/13/2013 | US20130146895 Pinch-off control of gate edge dislocation |
| 06/13/2013 | US20130146894 Bipolar junction transistor structure for reduced current crowding |
| 06/13/2013 | US20130146889 Compound semiconductor device and manufacturing method of the same |
| 06/13/2013 | US20130146886 Vertical GaN JFET with Gate Source Electrodes on Regrown Gate |
| 06/13/2013 | US20130146885 Vertical GaN-Based Metal Insulator Semiconductor FET |
| 06/13/2013 | US20130146883 Semiconductor thin film, thin film transistor, method for manufacturing same, and manufacturing equipment of semiconductor thin film |
| 06/13/2013 | US20130146875 Split electrode for organic devices |
| 06/13/2013 | US20130146874 Semiconductor integrated circuit |
| 06/13/2013 | US20130146872 Semiconductor Device and Method of Forming Conductive Pillars Having Recesses or Protrusions to Detect Interconnect Continuity Between Semiconductor Die and Substrate |
| 06/13/2013 | US20130146865 High-sensitivity transparent gas sensor and method for manufacturing the same |
| 06/13/2013 | US20130146864 Thin film transistor display panel and manufacturing method thereof |
| 06/13/2013 | US20130146863 High quality gan high-voltage hfets on silicon |
| 06/13/2013 | US20130146862 Array substrate including thin film transistor and method of fabricating the same |