| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 06/12/2013 | CN102339729B Wafer cleaning and drying machine |
| 06/12/2013 | CN102315141B Photoetching registration mark protective device and metal sputtering technological method |
| 06/12/2013 | CN102306641B Storage module and packaging method |
| 06/12/2013 | CN102306626B Semiconductor heterojunction field effect transistor grid structure preparation method |
| 06/12/2013 | CN102299154B 半导体结构及其制作方法 The semiconductor structure and method of making |
| 06/12/2013 | CN102299150B Power semiconductor assembly with adjustable output capacitance value and manufacturing method |
| 06/12/2013 | CN102299142B Packaging structure with antenna and manufacturing method thereof |
| 06/12/2013 | CN102299049B Petal-basket floating silicon chip automation separation mechanism |
| 06/12/2013 | CN102272910B Bidirectionally movable table |
| 06/12/2013 | CN102263016B Method for forming N-type groove power device |
| 06/12/2013 | CN102254845B Method for detecting bottom outline of contact plug |
| 06/12/2013 | CN102244102B Electron tunneling based enclosure type grid control metal-insulator device |
| 06/12/2013 | CN102244078B Controlled silicon chip structure of mesa technology and implementation method |
| 06/12/2013 | CN102244050B Heat radiator and manufacturing method thereof |
| 06/12/2013 | CN102237309B Method for integrating manganese-oxide-based resistive memory with copper interconnection rear end process |
| 06/12/2013 | CN102237283B Flip-chip bonding method and flip-chip bonding construction of non-array bumps |
| 06/12/2013 | CN102231391B Quantum-effect device based on MIS (Metal-Insulator-Semiconductor) structure |
| 06/12/2013 | CN102222692B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 06/12/2013 | CN102214683B Semiconductor structure having suspended source and suspended drain, and formation method of semiconductor structure |
| 06/12/2013 | CN102214681B Semiconductor structure and formation method thereof |
| 06/12/2013 | CN102214614B Chip package body |
| 06/12/2013 | CN102214574B Method for manufacturing semiconductor device |
| 06/12/2013 | CN102208437B Semiconductor device and method of making the same |
| 06/12/2013 | CN102201385B QFN semiconductor package and fabricating method thereof |
| 06/12/2013 | CN102194759B Semiconductor element package, ring structure and method for manufacturing the semiconductor element package |
| 06/12/2013 | CN102194752B Method for manufacturing CMOS (complementary metal oxide semiconductor) device structure |
| 06/12/2013 | CN102194749B Method for making complementary type metal-oxide semiconductor device |
| 06/12/2013 | CN102194691B Modeling method for multigrid metallic oxide semiconductor field effect transistor (MOSFET) model |
| 06/12/2013 | CN102194676B Method for manufacturing semiconductor device grid |
| 06/12/2013 | CN102194675B Method for producing grid of semiconductor device |
| 06/12/2013 | CN102194659B Dry film conveying mechanism of wafer film pressing machine |
| 06/12/2013 | CN102187438B Method and apparatus for removing photoresist |
| 06/12/2013 | CN102186639B 输送装置及真空装置 Delivery device and vacuum device |
| 06/12/2013 | CN102183509B Plasma monitoring method and plasma monitoring device |
| 06/12/2013 | CN102176409B Semiconductor manufacturing system, processing system, interface system, container, carrier, and adsorption plant |
| 06/12/2013 | CN102176098B Pixel structure and manufacturing method thereof |
| 06/12/2013 | CN102169835B Integrated circuit device and method for fabricating the integrated circuit device |
| 06/12/2013 | CN102157442B Method for forming interconnection among microelectronic chips |
| 06/12/2013 | CN102157349B Method of manufacyuring semiconductor device |
| 06/12/2013 | CN102148187B Method for removing etching residues of Kelvin through hole |
| 06/12/2013 | CN102142413B 半导体元件及其制法 Semiconductor components Jiqizhifa |
| 06/12/2013 | CN102136452B Method for forming copper interconnected structure and CMP (Chemical Mechanical Polishing) equipment for same |
| 06/12/2013 | CN102124565B Memory devices and methods of forming the same |
| 06/12/2013 | CN102122633B Method for manufacturing contact hole |
| 06/12/2013 | CN102117780B PIP (Polysilicon-Insulator-Polysilicon) capacitor forming method based on BiCMOS (Bipolar Complementary Metal Oxide Semiconductor) process |
| 06/12/2013 | CN102113099B Silicon precursors to make ultra low-K films with high mechanical properties by plasma enhanced chemical vapor deposition |
| 06/12/2013 | CN102113091B Method for ultra-uniform sputter deposition using simultaneous RF and DC power on target |
| 06/12/2013 | CN102107782B Non-touch grasping tool |
| 06/12/2013 | CN102104025B Method for manufacturing gate oxide layer of EEPROM and gate oxide layer manufactured thereby |
| 06/12/2013 | CN102104013B Data card and assembling method thereof |
| 06/12/2013 | CN102082125B Manufacture method of power MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) |
| 06/12/2013 | CN102074582B Integrated circuit structure and formation method thereof |
| 06/12/2013 | CN102073211B Half tone mask and fabricating method and flat panel display |
| 06/12/2013 | CN102067281B Semiconductor device and method for manufacturing the same |
| 06/12/2013 | CN102064131B Method for forming self-aligned contact hole by taking undoped silicon oxide as polycrystalline silicon cap layer |
| 06/12/2013 | CN102054656B Method for controlling chip temperature during quick thermal treatment |
| 06/12/2013 | CN102034757B Method for producing semiconductor device containing common source cathode transistor |
| 06/12/2013 | CN102024750B Chip-level ECO shrink |
| 06/12/2013 | CN102023431B Thin film transistor liquid crystal display (TFT-LCD) array substrate and manufacturing method thereof |
| 06/12/2013 | CN102017159B Silicon carbide semiconductor device and process for producing the silicon carbide semiconductor device |
| 06/12/2013 | CN102017113B Semiconductor device and method for manufacturing the same |
| 06/12/2013 | CN102017105B Hermetically-sealed packages for electronic components having reduced unused areas |
| 06/12/2013 | CN102017081B Boron nitride and boron-nitride derived materials deposition method |
| 06/12/2013 | CN102013424B Integrated circuit and manufacturing method thereof |
| 06/12/2013 | CN102007579B Cleaning water for electronic material, method for cleaning electronic material and system for supplying water containing dissolved gas |
| 06/12/2013 | CN102007578B Method for manufacturing semiconductor device and method for cleaning semiconductor substrate |
| 06/12/2013 | CN101992507B Wafer cutting tool and method for cutting wafer by using same |
| 06/12/2013 | CN101983463B Article conveying robot device |
| 06/12/2013 | CN101960582B Wiring board, semiconductor device, and process for producing semiconductor device |
| 06/12/2013 | CN101950748B Semiconductor device and method for manufacturing the same |
| 06/12/2013 | CN101930965B Structure of power grid for semiconductor devices and method of making the same |
| 06/12/2013 | CN101924080B Power semiconductor module featuring resiliently supported substrates and method for fabricating a power semiconductor module |
| 06/12/2013 | CN101877341B Reworkable electronic device assembly and method |
| 06/12/2013 | CN101872741B Dominant wavelength distribution convergent light emitting element and manufacturing method thereof |
| 06/12/2013 | CN101855309B Polishing composition |
| 06/12/2013 | CN101834157B Mask plate and method for manufacturing isolation structure of shallow trench by applying same |
| 06/12/2013 | CN101825787B Touch display screen and manufacture method thereof |
| 06/12/2013 | CN101779270B Substrate bonding apparatus and substrate bonding method |
| 06/12/2013 | CN101752315B Method for manufacturing integrated circuit structure |
| 06/12/2013 | CN101750874B Extreme ultraviolet photomask and methods and apparatuses for manufacturing the extreme ultraviolet photomask |
| 06/12/2013 | CN101728302B Edge contact clamping type wafer end actuator |
| 06/12/2013 | CN101720510B Junction diode with reduced reverse current |
| 06/12/2013 | CN101715601B Method of removing resist and apparatus therefor |
| 06/12/2013 | CN101689532B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 06/12/2013 | CN101677060B Part mounting device |
| 06/12/2013 | CN101656243B Lead frame, resin package, semiconductor device and resin package manufacturing method |
| 06/12/2013 | CN101634789B Pixel structure and manufacture method thereof |
| 06/12/2013 | CN101608098B Polishing slurry for metal chemical mechanical polishing, and use thereof |
| 06/12/2013 | CN101581887B Fluid handling structure, lithographic apparatus and device manufacturing method |
| 06/12/2013 | CN101553931B Structure and method for forming a planar schottky contact |
| 06/12/2013 | CN101498762B Electrical measurement tool |
| 06/12/2013 | CN101471281B Method of forming isolation layer of semiconductor memory device |
| 06/12/2013 | CN101471232B Method of forming a semiconductor device pattern |
| 06/12/2013 | CN101463227B Chemico-mechanical polishing solution for barrier layer |
| 06/12/2013 | CN101459172B 半导体器件 Semiconductor devices |
| 06/12/2013 | CN101451045B Process for preparing chemico-mechanical polishing liquid |
| 06/12/2013 | CN101432659B 感光性树脂组合物及感光性薄膜 The photosensitive resin composition and photosensitive film |
| 06/12/2013 | CN101419943B Method for manufacturing semiconductor substrate, display panel, and display device |
| 06/12/2013 | CN101409223B Manufacturing method of semiconductor device |
| 06/12/2013 | CN101395712B Method and apparatus for thermal processing structures formed on a substrate |