Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2013
06/19/2013CN102061131B Polishing liquid for reducing microscratch of surfaces of silicon wafers and preparation and use method thereof
06/19/2013CN102047389B Junction formation on wafer substrates using group IV nanoparticles
06/19/2013CN102047386B Low temperature deposition of silicon-containing films
06/19/2013CN102044479B Method for forming semiconductor device
06/19/2013CN102044476B Forming method of metal pattern
06/19/2013CN102033376B Fringe field switching mode liquid crystal display device and method of fabricating the same
06/19/2013CN102027026B Photocurable composition and manufacturing method for a molded body having a fine pattern on the surface
06/19/2013CN102024839B Phase change memory, isolation structure for memory unit and manufacturing method thereof
06/19/2013CN102023425B TFT-LCD array substrate and double-tuned mask board for manufacturing array substrate
06/19/2013CN102017112B Electrical bond connection arrangement
06/19/2013CN101998926B Article storage facility
06/19/2013CN101997032B Semiconductor device and manufacturing method thereof
06/19/2013CN101997026B Substrate structure processed by a substrate and manufacturing method thereof
06/19/2013CN101996875B Methods for fabricating non-volatile memory
06/19/2013CN101990702B Polishing system having track
06/19/2013CN101981657B Methods of forming buffer layer architecture on silicon and structures formed thereby
06/19/2013CN101964359B Bipolar transistor, forming method thereof and virtual ground circuit
06/19/2013CN101927455B Polishing pad and method for polishing a semiconductor wafer
06/19/2013CN101925995B Method of fabricating epitaxially grown layers on composite structure
06/19/2013CN101916544B Electro-optics apparatus
06/19/2013CN101909803B Cold jointing apparatus, and cold jointing method
06/19/2013CN101908517B Bonding pad, manufacturing method and bonding method thereof
06/19/2013CN101908499B Method for fabricating integrated circuit
06/19/2013CN101901810B Memory device and methods for fabricating and operating the same
06/19/2013CN101887865B Substrate support with electrostatic chuck having dual temperature zones
06/19/2013CN101842165B Mechanically integrated and closely coupled print head and mist source
06/19/2013CN101826466B Semiconductor device, method of manufacturing the same, and electronic apparatus
06/19/2013CN101821352B Adhesive and connecting structure using the same
06/19/2013CN101800193B Method for manufacturing ditch type metal-oxide semiconductor element
06/19/2013CN101796398B Apparatus and method for detecting semiconductor substrate anomalies
06/19/2013CN101795528B Inductively coupled plasma processing apparatus
06/19/2013CN101794806B Cross-point semiconductor memory device and manufacturing method thereof
06/19/2013CN101777548B Substrate with built-in chip and manufacturing method thereof
06/19/2013CN101752208B Semiconductor high-voltage terminal structure and production method thereof
06/19/2013CN101736319B Gas injector and film deposition apparatus
06/19/2013CN101722462B Method for polishing both sides of a semiconductor wafer
06/19/2013CN101714499B A machining device
06/19/2013CN101689491B Apparatus and method for drying substrates
06/19/2013CN101677111B Semiconductor device, electronic device, and method of manufacturing semiconductor device
06/19/2013CN101652855B Electronic device including a nonvolatile memory array and methods of using the same
06/19/2013CN101625995B Wafer processing method
06/19/2013CN101621024B Wafer tipping machine and tipping method
06/19/2013CN101582398B Ball-bump bonded ribbon-wire interconnect
06/19/2013CN101555987B Rectangular parallelepiped fluid storage and dispensing vessel
06/19/2013CN101521169B Semiconductor device and a method of manufacturing the same
06/19/2013CN101490836B Transistor with asymmetry for data storage circuitry
06/19/2013CN101369541B Method for manufacturing semiconductor device
06/19/2013CN101355037B 显示装置及其制造方法 Display device and method of manufacturing
06/19/2013CN101336472B Multigate device with recessed strain regions
06/19/2013CN101288035B Repeatable heat-treating methods and apparatus
06/19/2013CN101253611B Thin film transistor array substrate fabrication method and thin film transistor array substrate
06/19/2013CN101124656B Shadow mask deposition of materials using reconfigurable shadow masks
06/19/2013CN101114119B Multi-tone optical mask, method of manufacturing the same and method of manufacturing thin-film transistor substrate by using the same
06/19/2013CN101017783B Method for making the separated dual-bar field effect transistor
06/18/2013USRE44303 Passivation layer for a circuit device and method of manufacture
06/18/2013USRE44300 Power device with high switching speed and manufacturing method thereof
06/18/2013US8467639 Zinc oxide diodes for optical interconnections
06/18/2013US8467594 Method and apparatus for inspecting patterns formed on a substrate
06/18/2013US8467035 Pellicle frame and lithographic pellicle
06/18/2013US8467025 Thin film transistor array panel for liquid crystal display
06/18/2013US8466565 Substrate and semiconductor device
06/18/2013US8466563 Apparatus and methods for 3-D stacking of thinned die
06/18/2013US8466560 Dummy structures having a golden ratio and method for forming the same
06/18/2013US8466554 Electronic device having interconnections, openings, and pads having greater width than the openings
06/18/2013US8466548 Semiconductor device including excess solder
06/18/2013US8466545 Stackable semiconductor package
06/18/2013US8466544 Semiconductor device and method of forming interposer and opposing build-up interconnect structure with connecting conductive TMV for electrical interconnect of Fo-WLCSP
06/18/2013US8466531 Imaging device package, method of manufacturing the imaging device package, and electronic apparatus
06/18/2013US8466522 Element array, electromechanical conversion device, and process for producing the same
06/18/2013US8466520 Transistor with an embedded strain-inducing material having a gradually shaped configuration
06/18/2013US8466519 Read-only memory device with contacts formed therein
06/18/2013US8466518 Semiconductor device and semiconductor device manufacturing method
06/18/2013US8466511 Vertical channel fin field-effect transistors having increased source/drain contact area and methods for fabricating the same
06/18/2013US8466508 Non-volatile memory structure including stress material between stacked patterns
06/18/2013US8466507 Semiconductor device and a method of manufacturing the same
06/18/2013US8466502 Metal-gate CMOS device
06/18/2013US8466496 Selective partial gate stack for improved device isolation
06/18/2013US8466493 Self-aligned III-V field effect transistor (FET), integrated circuit (IC) chip with self-aligned III-V FETS and method of manufacture
06/18/2013US8466489 Apparatus and method for transient electrical overstress protection
06/18/2013US8466482 Semiconductor device and manufacturing method thereof
06/18/2013US8466480 Light emitting device, method of manufacturing the same, light emitting device package and lighting system
06/18/2013US8466479 Light emitting diodes (LEDs) with improved light extraction by roughening
06/18/2013US8466473 Structure and method for Vt tuning and short channel control with high k/metal gate MOSFETs
06/18/2013US8466471 Nitride semiconductor free-standing substrate and method for making same
06/18/2013US8466469 Semiconductor device having pair of flexible substrates
06/18/2013US8466463 Semiconductor device and manufacturing method thereof
06/18/2013US8466456 Organic light-emitting display device and method of manufacturing the same
06/18/2013US8466445 Silver-selenide/chalcogenide glass stack for resistance variable memory and manufacturing method thereof
06/18/2013US8466415 Methods for performing circuit edit operations with low landing energy electron beams
06/18/2013US8466074 Method for processing a substrate using a laser beam
06/18/2013US8466073 Capping layer for reduced outgassing
06/18/2013US8466072 Process of localized electrografting onto photosensitive semiconductor substrates
06/18/2013US8466071 Method for etching single wafer
06/18/2013US8466070 Methods of forming semiconductor structures
06/18/2013US8466069 Method for manufacturing semiconductor device
06/18/2013US8466068 Methods and apparatus for forming memory lines and vias in three dimensional memory arrays using dual damascene process and imprint lithography
06/18/2013US8466067 Post-planarization densification
06/18/2013US8466066 Method for forming micro-pattern in semiconductor device
06/18/2013US8466065 Semiconductor device and manufacturing method thereof
06/18/2013US8466064 Semiconductor integrated circuit device and method of manufacturing a semiconductor integrated circuit device