Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2013
06/20/2013WO2013088706A1 Surface treatment apparatus, surface treatment method, substrate supporting mechanism, and recording medium
06/20/2013WO2013088686A1 Adhesive resin composition, laminate body, and self-peeling method
06/20/2013WO2013088680A1 Film forming device
06/20/2013WO2013088677A1 Plasma-treatment apparatus
06/20/2013WO2013088671A1 Silicon substrate having textured surface, and method for manufacturing same
06/20/2013WO2013088636A1 Soi wafer fabrication method
06/20/2013WO2013088631A1 Processing device
06/20/2013WO2013088603A1 Power introduction device and vacuum processing device using power introduction device
06/20/2013WO2013088548A1 Wafer conveyance robot
06/20/2013WO2013088547A1 Wafer conveyance device
06/20/2013WO2013088520A1 Semiconductor device manufacturing method, and semiconductor device
06/20/2013WO2013088325A1 Silicon nitride dry trim without top pulldown
06/20/2013WO2013088324A2 Silicon on insulator etch
06/20/2013WO2013088322A1 Device for treating surfaces of wafer-shaped articles and gripping pin for use in the device
06/20/2013WO2013088226A1 Process for stabilizing a bonding interface, located within a structure which comprises an oxide layer and structure obtained
06/20/2013WO2013087839A1 Method for determining the quality of a silicon wafer
06/20/2013WO2013087760A1 Forming a via electrical connection
06/20/2013WO2013087707A1 Substrates for semiconductor devices
06/20/2013WO2013087706A1 Synthetic diamond coated compound semiconductor substrates
06/20/2013WO2013087704A1 Substrates for semiconductor devices
06/20/2013WO2013087510A1 Silicone solvent
06/20/2013WO2013087386A1 High-voltage transistor component and production method
06/20/2013WO2013087101A1 Substrate-supported circuit parts with free-standing three-dimensional structures
06/20/2013WO2013086920A1 Monitoring structure and monitoring method for silicon wet etching depth
06/20/2013WO2013086912A1 Read only memory and manufacturing method therefor
06/20/2013WO2013086909A1 Array substrate, preparation method therefor and display device
06/20/2013WO2013086902A1 Method for improving irradiation resisting performance of soi structure
06/20/2013WO2013086813A1 Semiconductor device manufacturing method
06/20/2013WO2013086764A1 Mosfet performance enhancement with corner stress of sti
06/20/2013WO2013086755A1 Universal encapsulation substrate design method
06/20/2013WO2013086746A1 Liquid crystal display panel and manufacturing method thereof
06/20/2013WO2013086741A1 Emi shielding and thermal dissipation for semiconductor device
06/20/2013WO2013086693A1 Gate rounding for reduced transistor leakage current
06/20/2013WO2013086686A1 Preparation method of high-speed low-power-consumption phase change memory
06/20/2013WO2013061047A3 Silicon carbide epitaxy
06/20/2013WO2013056238A3 Programmable photolithography
06/20/2013WO2013052712A3 Selective etch of silicon by way of metastable hydrogen termination
06/20/2013WO2013017960A3 Apparatus and method for cleaning photovoltaic devices
06/20/2013WO2012083100A8 Electroplated lead-free bump deposition
06/20/2013US20130158378 Ionic barrier for floating gate in vivo biosensors
06/20/2013US20130157475 Film Deposition Using Tantalum Precursors
06/20/2013US20130157474 Substrate processing apparatus, method of processing substrate and method of manufacturing semiconductor device
06/20/2013US20130157473 Mask Manufacturing Device
06/20/2013US20130157472 Method and composition for removing resist, etch residue, and copper oxide from substrates having copper, metal hardmask and low-k dielectric material
06/20/2013US20130157471 Apparatus and Method for Decapsulating Packaged Integrated Circuits
06/20/2013US20130157470 Plasma etching method
06/20/2013US20130157469 Semiconductor Processing System with Source for Decoupled Ion and Radical Control
06/20/2013US20130157468 Etching method, substrate processing method, pattern forming method, method for manufacturing semiconductor element, and semiconductor element
06/20/2013US20130157467 Method for forming semiconductor device
06/20/2013US20130157466 Silicon nitride films for semiconductor device applications
06/20/2013US20130157465 Methods for stripping photoresist and/or cleaning metal regions
06/20/2013US20130157464 Planarizing method
06/20/2013US20130157463 Near-infrared absorbing film composition for lithographic application
06/20/2013US20130157462 Method of forming pattern for semiconductor device
06/20/2013US20130157461 Method for fabricating semiconductor memory device
06/20/2013US20130157459 Method for fabricating interconnecting lines inside via holes of semiconductor device
06/20/2013US20130157458 Semiconductor device having a copper plug
06/20/2013US20130157457 Interconnects for stacked non-volatile memory device and method
06/20/2013US20130157456 Methods relating to the fabrication of devices having conductive substrate vias with catch-pad etch-stops
06/20/2013US20130157455 Electrical Contact Alignment Posts
06/20/2013US20130157454 Self-aligned wet etching process
06/20/2013US20130157453 Methods of manufacturing semiconductor device
06/20/2013US20130157452 Semiconductor device including polysilicon resistor and metal gate resistor and methods of fabricating thereof
06/20/2013US20130157451 Methods of forming gate structures for reduced leakage
06/20/2013US20130157450 Methods of Forming Metal Silicide Regions on Semiconductor Devices
06/20/2013US20130157448 Method for manufacturing a silicon carbide wafer and respective equipment
06/20/2013US20130157447 Single crystal silicon tfts made by lateral crystallization from a nanowire seed
06/20/2013US20130157445 POLYCRYSTALLINE ALUMINUM NITRIDE BASE MATERIAL FOR CRYSTAL GROWTH OF GaN-BASE SEMICONDUCTOR AND METHOD FOR MANUFACTURING GaN-BASE SEMICONDUCTOR USING THE SAME
06/20/2013US20130157444 Semiconductor device having super junction structure and method for manufacturing the same
06/20/2013US20130157443 Production of electronic switching devices
06/20/2013US20130157442 Defect reduction in seeded aluminum nitride crystal growth
06/20/2013US20130157441 Method for fabricating semiconductor device
06/20/2013US20130157440 Composite wafer for fabrication of semiconductor devices
06/20/2013US20130157439 Chip assembly with a coreless substrate employing a patterned adhesive layer
06/20/2013US20130157438 Substrate holding unit, substrate bonding apparatus, multi-layered substrate manufacturing apparatus, substrate bonding method, multi-layer substrate manufacturing method, and multi-layered semiconductor apparatus manufacturing method
06/20/2013US20130157437 Pattern forming method
06/20/2013US20130157436 Forming through substrate vias
06/20/2013US20130157435 Materials and Methods of Forming Controlled Void
06/20/2013US20130157432 Enhancing integrity of a high-k gate stack by protecting a liner at the gate bottom during gate head exposure
06/20/2013US20130157431 Structure and method for thermal treatment with epitaxial sicp thermal stability improvement
06/20/2013US20130157430 Electrostatic Discharge Protection Device and Method
06/20/2013US20130157429 High voltage transistor using diluted drain
06/20/2013US20130157428 Methods of Manufacturing Semiconductor Devices Including Transistors
06/20/2013US20130157427 Etching composition and method for fabricating semiconductor device using the same
06/20/2013US20130157425 Semiconductor device and manufacturing method thereof
06/20/2013US20130157424 Method for improved mobility using hybrid orientaion technology (HOT) in conjunction with
06/20/2013US20130157421 Methods for the fabrication of integrated circuits including back-etching of raised conductive structures
06/20/2013US20130157420 Methods of Forming Graphene-Containing Switches
06/20/2013US20130157419 Method of manufacturing semiconductor device
06/20/2013US20130157418 Integrated circuit packaging system with interconnects and method of manufacture thereof
06/20/2013US20130157417 Method of manufacturing substrate for mounting electronic device
06/20/2013US20130157416 Methods of forming a semiconductor device
06/20/2013US20130157415 Method for producing semiconductor device
06/20/2013US20130157414 Stacked-die package and method therefor
06/20/2013US20130157410 Memory Cell Constructions, and Methods for Fabricating Memory Cell Constructions
06/20/2013US20130157406 Low- cost solution approach to deposit selenium and sulfur for cu(in,ga)(se,s)2 formation
06/20/2013US20130157398 Display device and method of fabricating the same
06/20/2013US20130157393 Semiconductor device and manufacturing method of the same
06/20/2013US20130157391 Methods and systems for inspecting bonded wafers
06/20/2013US20130157390 Ion implantation method and ion implantation apparatus
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