Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2013
06/26/2013CN103178098A Gate structure and forming method of same
06/26/2013CN103178097A Dummy gate for a high voltage transistor device
06/26/2013CN103178093A High-voltage junction field effect transistor structure and manufacture method
06/26/2013CN103178092A Structure and production method of ultrahigh-voltage LDMOS (laterally diffused metal oxide semiconductor) device
06/26/2013CN103178091A Lateral diffusion metal oxide semiconductor transistor and manufacture method thereof
06/26/2013CN103178089A Transistor structure and method for preparing the same
06/26/2013CN103178088A Semiconductor device and fabricating method thereof
06/26/2013CN103178087A Ultra-high voltage LDMOS (Laterally Diffused Metal Oxide Semiconductor) device structure and production method thereof
06/26/2013CN103178086A VPNP (Vertical Positive-Negative-Positive) device in SiGe (Silicon-germanium) HBT (Heterojunction Bipolar Transistor) technology and manufacturing method thereof
06/26/2013CN103178082A Display device and method for manufacturing the same
06/26/2013CN103178081A 有机发光二极管显示器及其制造方法 The organic light emitting diode display and method of manufacturing
06/26/2013CN103178080A Organic light-emitting display apparatus and method of manufacturing organic light-emitting display apparatus
06/26/2013CN103178079A Organic light-emitting display apparatus and method of manufacturing the same
06/26/2013CN103178078A Organic light-emitting display apparatus and method of manufacturing the same
06/26/2013CN103178074A 发光二极管阵列及其形成方法 And a method for forming a light-emitting diode array
06/26/2013CN103178069A Non-volatile memory with low cost and single polycrystalline framework and preparation method thereof
06/26/2013CN103178068A Non-volatile memory device and method for fabricating the same
06/26/2013CN103178067A Nonvolatile memory device and method for manufacturing the same
06/26/2013CN103178066A 3-dimensional non-volatile memory device, memory system, and method of manufacturing the device
06/26/2013CN103178065A 3D nonvolatile memory device, memory system including same, and method of manufacturing same
06/26/2013CN103178064A Storage device with non-capturing type switch transistor and production method thereof
06/26/2013CN103178062A Metal nanocrystalline storage
06/26/2013CN103178061A Capacitor array and method of fabricating the same
06/26/2013CN103178060A Field effect transistor complementary inverter and production method thereof
06/26/2013CN103178057A 显示器及电子单元 Displays and electronic unit
06/26/2013CN103178053A Wafer level test structure and method
06/26/2013CN103178050A Semiconductor package structure and manufacturing method thereof
06/26/2013CN103178049A Self-aligned contact hole insulating layer structure and preparation method
06/26/2013CN103178048A Semiconductor device and method of manufacturing same
06/26/2013CN103178047A Semiconductor device and method for manufacturing the same
06/26/2013CN103178044A Multilayer electronic supporting structure having integrated metal core
06/26/2013CN103178043A Wiring board and method of manufacturing the same
06/26/2013CN103178041A Lead frame strip and glue sealing method
06/26/2013CN103178040A 半导体结构及其制造方法 The semiconductor structure and a method of manufacturing
06/26/2013CN103178039A Semiconductor package and manufacturing method thereof
06/26/2013CN103178038A Chip device package and fabrication method thereof
06/26/2013CN103178036A Semiconductor and manufacturing method thereof
06/26/2013CN103178034A Semiconductor package, packaging substrate and fabrication method thereof
06/26/2013CN103178031A Chip connection method
06/26/2013CN103178030A Module including discrete device mounted on dcb substrate and method for manufacturing the same
06/26/2013CN103178025A Semiconductor device and fabrication method
06/26/2013CN103178023A Mixed substrate encapsulation method and mixed substrate encapsulation structure for semiconductor device
06/26/2013CN103178021A Oxide thin-film transistor array substrate, manufacturing method for same and display panel
06/26/2013CN103178020A Method of manufacturing semiconductor device
06/26/2013CN103178019A Method for manufacturing word lines of embedded flash memory
06/26/2013CN103178018A Method for manufacturing separation gate quick-flashing memory unit
06/26/2013CN103178017A Manufacture method of metal nanocrystalline storage
06/26/2013CN103178016A Methods of forming gate structures for reduced leakage
06/26/2013CN103178015A Method of manufacturing semiconductor memory device
06/26/2013CN103178014A Manufacturing method of U-shaped trenches
06/26/2013CN103178013A Method of manufacturing a semiconductor device
06/26/2013CN103178012A CMOS devices with metal gates and methods for forming the same
06/26/2013CN103178011A Complementary metal oxide semiconductor (CMOS) and forming method thereof
06/26/2013CN103178010A Semiconductor device manufacturing method
06/26/2013CN103178009A Method of manufacturing sidewall spacers on a memory device and a semiconductor device
06/26/2013CN103178008A Method of dicing substrate and apparatus for dicing substrate using thereof
06/26/2013CN103178007A Scribing method, chip manufacturing method and convex glass packaging diode
06/26/2013CN103178006A Method for adjusting threshold voltage of low-temperature polycrystalline silicon transistor valve
06/26/2013CN103178005A Organic light emitting display device and method of manufacturing the same
06/26/2013CN103178004A Thin film transistor substrate and manufacturing method thereof and display
06/26/2013CN103178003A Gold wire bonding interconnection method based on nickel-palladium-gold coating layer
06/26/2013CN103178002A Air gap, air gap forming method and semiconductor device
06/26/2013CN103178001A Method for processing porous ultra-low dielectric constant layer
06/26/2013CN103178000A Semiconductor device and forming method thereof
06/26/2013CN103177999A Graphite frame for deposition antireflective film process
06/26/2013CN103177998A Method for taking down rollable device
06/26/2013CN103177997A Reaction device for processing wafers, electrostatic chuck (ESC) and wafer temperature control method
06/26/2013CN103177996A Reaction device for processing wafers, electrostatic chuck (ESC) and wafer temperature control method
06/26/2013CN103177995A Positioning plate for one-off welding of IGBT (insulated gate bipolar transistor)
06/26/2013CN103177994A Guiding device for docking
06/26/2013CN103177993A Device for transferring substrate
06/26/2013CN103177992A Transfer apparatus and transfer method
06/26/2013CN103177991A Substrate processing apparatus, conversion method and load-shifting method
06/26/2013CN103177990A Rapid thermal processing lamphead with improved cooling
06/26/2013CN103177989A Protective tape peeling method and protective tape peeling device
06/26/2013CN103177988A Apparatuses for bonding semiconductor chips
06/26/2013CN103177987A Molding apparatus and a method for molding
06/26/2013CN103177986A 涂布装置 Coating device
06/26/2013CN103177985A Semiconductor wafer fabrication device
06/26/2013CN103177984A Vision monitoring method for full encapsulation process
06/26/2013CN103177983A Detection device and detection method
06/26/2013CN103177982A Monitor test key of epi profile
06/26/2013CN103177981A Device for detecting laser mark position in wafer production
06/26/2013CN103177980A Bonding head device on full-automatic lead bonding equipment
06/26/2013CN103177979A Wire bonding device, tool and main body, semiconductor device manufacturing and bonding device
06/26/2013CN103177978A High-frequency rotating mechanism and lead wire bonding machine
06/26/2013CN103177977A Exposing connectors in packages through selective treatment
06/26/2013CN103177976A Diode encapsulation method
06/26/2013CN103177975A Soft landing method of swing arm
06/26/2013CN103177974A Process for manufacturing discrete electronic component of copper sheet electrode
06/26/2013CN103177973A Manufacture method of thickened bonding block
06/26/2013CN103177972A Annealing process of sapphire substrate material
06/26/2013CN103177971A NMOS (N-channel metal oxide semiconductor) device, with GaAs material growing in silicon grooves, based on ART (aspect radio trapping ) structure
06/26/2013CN103177970A Method for manufacturing oxide thin-film transistor
06/26/2013CN103177969A Preparation method of metallic oxide thin film transistor
06/26/2013CN103177968A Semiconductor device manufacturing method
06/26/2013CN103177967A Semiconductor devices and methods of forming the same
06/26/2013CN103177966A Transistor and production method thereof
06/26/2013CN103177965A Method for forming fin field effect tube
06/26/2013CN103177964A LDMOS (Laterally Diffused Metal Oxide Semiconductor) with selective shallow slot through hole and production method thereof
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