Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2013
06/27/2013WO2013095550A1 Semiconductor device having a necked semiconductor body and method of forming semiconductor bodies of varying width
06/27/2013WO2013095548A1 Gate aligned contact and method to fabricate same
06/27/2013WO2013095540A1 Memory with elements having two stacked magnetic tunneling junction (mtj) devices
06/27/2013WO2013095539A1 Chemically altered carbosilanes for pore sealing applications
06/27/2013WO2013095527A1 Electrostatic discharge compliant patterned adhesive tape
06/27/2013WO2013095523A1 Cmos-compatible gold-free contacts
06/27/2013WO2013095522A1 Electrostatic discharge compatible dicing tape with laser scribe capability
06/27/2013WO2013095492A1 Interconnect arrangement for hexagonal attachment configurations
06/27/2013WO2013095474A1 Methods for forming fins for metal oxide semiconductor device structures
06/27/2013WO2013095468A1 Ball placement in a photo-patterned template for fine pitch interconnect
06/27/2013WO2013095443A1 Semiconductor devices having three-dimensional bodies with modulated heights
06/27/2013WO2013095442A1 Dense interconnect with solder cap (disc) formation with laser ablation and resulting semiconductor structures and packages
06/27/2013WO2013095438A1 Fully encapsulated conductive lines
06/27/2013WO2013095433A1 Electroless filled conductive structures
06/27/2013WO2013095396A1 Conformal low temperature hermetic dielectric diffusion barriers
06/27/2013WO2013095384A1 Semiconductor device with isolated body portion
06/27/2013WO2013095377A1 Self-aligned contact metallization for reduced contact resistance
06/27/2013WO2013095376A1 Strained channel region transistors employing source and drain stressors and systems including the same
06/27/2013WO2013095375A1 Iii-v layers for n-type and p-type mos source-drain contacts
06/27/2013WO2013095362A1 High performance transient uniform cooling solution for thermal compression bonding process
06/27/2013WO2013095357A1 Method for reducing size and center positioning of magnetic memory element contacts
06/27/2013WO2013095349A1 Semiconductor device having metallic source and drain regions
06/27/2013WO2013095347A1 Selective laser annealing process for buried regions in a mos device
06/27/2013WO2013095346A1 Non-planar iii-n transistor
06/27/2013WO2013095345A1 Group iii-n transistors for system on chip (soc) architecture integrating power management and radio frequency circuits
06/27/2013WO2013095344A1 Using an optically transparent solid material as a support structure for attachment of a semiconductor material to a substrate
06/27/2013WO2013095343A1 Group iii-n nanowire transistors
06/27/2013WO2013095342A1 High voltage field effect transistors
06/27/2013WO2013095341A1 Cmos implementation of germanium and iii-v nanowires and nanoribbons in gate-all-around architecture
06/27/2013WO2013095340A1 Pulsed laser anneal process for transistors with partial melt of a raised source-drain
06/27/2013WO2013095336A1 Spin transfer torque memory (sttm) device with half-metal and method to write and read the device
06/27/2013WO2013095260A1 Insulation of micro structures
06/27/2013WO2013095147A1 Method of bonding two substrates and device manufactured thereby
06/27/2013WO2013095069A1 Exposure apparatus
06/27/2013WO2013095030A1 Substrate-processing apparatus and substrate-processing method
06/27/2013WO2013094998A1 Adhesive composition for semiconductor, and adhesive film comprising same
06/27/2013WO2013094983A1 Dicing die bonding film and semiconductor apparatus
06/27/2013WO2013094930A1 Non-ultraviolet dicing die-bonding film
06/27/2013WO2013094924A1 Adhesive film for semiconductor and semiconductor package using same
06/27/2013WO2013094918A1 Transparent substrate having nano pattern and method of manufacturing the same
06/27/2013WO2013094856A1 System and method for examining wire bonds
06/27/2013WO2013094772A1 Semiconductor device
06/27/2013WO2013094759A1 Polymer powder, curable resin composition, and cured product thereof
06/27/2013WO2013094733A1 Measurement method and device, and maintenance method and device
06/27/2013WO2013094717A1 Substrate processing device
06/27/2013WO2013094716A1 Plasma creation device and plasma processing device
06/27/2013WO2013094707A1 Deposition apparatus
06/27/2013WO2013094688A1 Thin film transistor and method for fabricating thin film transistor
06/27/2013WO2013094680A1 Substrate processing device, method for manufacturing semiconductor device, and vaporizer
06/27/2013WO2013094665A1 Composite substrate
06/27/2013WO2013094660A1 Method of producing cured product and method of forming pattern
06/27/2013WO2013094621A1 Semiconductor device and method for manufacturing semiconductor device
06/27/2013WO2013094582A1 Nmr imaging device and nmr imaging method
06/27/2013WO2013094564A1 Mounting table and plasma processing apparatus
06/27/2013WO2013094554A1 Exposure system, and control device and control method therefor
06/27/2013WO2013094547A1 Semiconductor device and method for manufacturing the same
06/27/2013WO2013094528A1 Liquid management system and recovery and recycling device for cleaning liquid
06/27/2013WO2013094495A1 Insulation-layer material for electronic device, and electronic device
06/27/2013WO2013094491A1 Wafer holder
06/27/2013WO2013094482A1 Pd-COATED COPPER BALL BONDING WIRE
06/27/2013WO2013094421A1 Method for producing cyclic siloxane compound, insulating film using cyclic siloxane compound, and disiloxane compound
06/27/2013WO2013094403A1 Transparent conductive film laminate, method for producing same, thin-film solar cell, and method for producing same
06/27/2013WO2013094400A1 Substrate processing system, substrate processing device and method for accumulating data for substrate processing device
06/27/2013WO2013094390A1 Photo-curable composition and patterning method
06/27/2013WO2013094356A1 Semiconductor device and method of fabricating same
06/27/2013WO2013094328A1 Semiconductor device and method for producing same
06/27/2013WO2013094297A1 Semiconductor device and method for producing same
06/27/2013WO2013094287A1 Semiconductor device
06/27/2013WO2013094286A1 Substrate processing device, device manufacturing system and device manufacturing method
06/27/2013WO2013094184A1 Active matrix substrate and method for producing same
06/27/2013WO2013094117A1 Method for cutting work piece
06/27/2013WO2013094101A1 Semiconductor package, method and mold for producing same, input and output terminals of semiconductor package
06/27/2013WO2013094083A1 Group iii nitride semiconductor element, and method for producing same
06/27/2013WO2013094078A1 Semiconductor element, method for producing same, and combination of semiconductor elements
06/27/2013WO2013094070A1 Semiconductor manufacturing apparatus and push-up apparatus for semiconductor manufacturing apparatus
06/27/2013WO2013094068A1 Imprint device, and device manufacturing method
06/27/2013WO2013093988A1 Method for producing semiconductor device, and semiconductor device
06/27/2013WO2013093905A1 Fiber optical superconducting nanowire single photon detector
06/27/2013WO2013093759A1 Apparatus for treating surfaces of wafer-shaped articles
06/27/2013WO2013093590A1 Methods of fabricating semiconductor structures using thermal spray processes, and semiconductor structures fabricated using such methods
06/27/2013WO2013093581A1 Methods of fabricating dilute nitride semiconductor materials for use in photoactive devices and related structures
06/27/2013WO2013093579A1 Methods of forming dilute nitride materials for use in photoactive devices and related structures
06/27/2013WO2013093557A1 Chemical mechanical polishing composition comprising polyvinyl phosphonic acid and its derivatives
06/27/2013WO2013093383A1 Method of manufacturing a czt powder (s, se) by mechanosynthesis and use thereof for forming a thin layer
06/27/2013WO2013093360A1 Method for producing a mos stack on a diamond substrate
06/27/2013WO2013093238A1 Support including an electrostatic substrate holder
06/27/2013WO2013092759A2 Method for etching of sio2 layers on thin wafers
06/27/2013WO2013092665A1 Method for manufacturing a semiconductor micro- or nanowire, semiconductor structure comprising such a micro- or nanowire, and method for manufacturing a semiconductor structure
06/27/2013WO2013092131A1 Method for combined through-hole plating and via filling
06/27/2013WO2013092004A1 Method for producing a plurality of optoelectronic semiconductor chips, and optoelecronic semiconductor chip
06/27/2013WO2013091872A1 Method for producing a schottky diode
06/27/2013WO2013091714A1 Flexible substrate holder, device and method for detaching a first substrate
06/27/2013WO2013091448A1 Method for preparing polysilicon gate electrode of mos transistor
06/27/2013WO2013091374A1 Memory array structure and method for forming the same
06/27/2013WO2013091354A1 Substrate etching method and substrate processing device
06/27/2013WO2013091331A1 Cmos device for reducing charge sharing effect and preparation method therefor
06/27/2013WO2013091306A1 Thin film transistor substrate and manufacturing method thereof and liquid crystal display device
06/27/2013WO2013091298A1 Liquid crystal display device, low-temperature polysilicon display device and manufacturing method thereof
06/27/2013WO2013091257A1 Method for preparing solder lug
06/27/2013WO2013091169A1 Planar display panel and forming method therefor
1 ... 558 559 560 561 562 563 564 565 566 567 568 569 570 571 572 573 574 575 576 577 578 ... 6590