| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/27/2013 | DE102012222504A1 Messen von Stromstärke und Widerstand unter Verwendung einer kombinierten Dioden/Widerstands-Struktur zum Überwachen von Abweichungen im Herstellungsverfahren für integrierte Schaltungen Measurement of current, and resistance using a combined diode / resistor structure for monitoring variations in the manufacturing process for integrated circuits |
| 06/27/2013 | DE102012217336A1 Verfahren zum Ersetzen von Silicium durch Metall bei der Herstellung von Chips mit integrierten Schaltungen Method for replacing of silicon by metal in the manufacture of integrated circuit chips |
| 06/27/2013 | DE102012217031A1 Halbleiterbauelement und herstellungsverfahren dafür Semiconductor device and manufacturing processes for |
| 06/27/2013 | DE102012212095A1 Laserbearbeitungsverfahren für einen Wafer A laser processing method for a wafer |
| 06/27/2013 | DE102012203318A1 Method for exposing objective layer within multilayer circuit board, involves forming recess from surface of multilayer printed circuit board upto sacrificial layer or into sacrificial layer by erosion process |
| 06/27/2013 | DE102012112880A1 Semiconductor component has trenches arranged within first capacitor region of capacitors, are perpendicular to trenches arranged within second capacitor region of capacitors |
| 06/27/2013 | DE102012112769A1 Modul mit einer diskreten Vorrichtung, die auf einem DCB-Substrat montiert ist Module with a discrete device that is mounted on a DCB substrate |
| 06/27/2013 | DE102012108406A1 Halbleitervorrichtungen und Verfahren zur Herstellung derselben Semiconductor devices and methods of manufacturing the same |
| 06/27/2013 | DE102012005916B3 Vorrichtung zur Bestrahlung eines Substrats Apparatus for irradiating a substrate |
| 06/27/2013 | DE102012004849B3 Wire for cutting workpiece e.g. semiconductor wafer, has roughened wire surface that is provided with chemically separated chromium coating portion having specified layer thickness |
| 06/27/2013 | DE102011122906A1 Lateral transistor component e.g. MOSFET, has dielectric layer comprising transition region in which thickness increases toward another thickness and inclined at specific angle, and body region arranged between source and drift regions |
| 06/27/2013 | DE102011122091A1 Schottky-Halbleiterprozess Schottky semiconductor process |
| 06/27/2013 | DE102011089759A1 Method for manufacturing semiconductor component e.g. thin film transistor, involves forming semiconductor layer on intermediate layers arranged on support substrate, and removing portion of substrate to access semiconductor layer |
| 06/27/2013 | DE102011089569A1 Verfahren zum Verbinden zweier Siliziumsubstrate und entsprechende Anordnung zweier Siliziumsubstrate A method of joining two silicon substrates and corresponding arrangement of two silicon substrates |
| 06/27/2013 | DE102011089550A1 Lotkugelanordnung, Gehäuse mit einer Lotkugelanordnung sowie Herstellungsverfahren für eine Lotkugelanordnung Lotkugelanordnung, housing with a Lotkugelanordnung and manufacturing method for a Lotkugelanordnung |
| 06/27/2013 | DE102011089362A1 Method for polishing e.g. n-type silicon wafer, involves terminating polishing of semiconductor material made substrate by lifting surface of substrate covered with polishing pad and flushing surface of substrate with water at time |
| 06/27/2013 | DE102011087681A1 Hetero-Substrat zur Herstellung von integrierten Schaltkreisen mit optischen, opto-elektronischen und elektronischen Komponenten Hetero-substrate for the production of integrated circuits with optical, opto-electronic and electronic components |
| 06/27/2013 | DE102011056843A1 Verfahren zur Stabilisierung eines Wirkungsgrades von Siliziumsolarzellen A method for stabilizing an efficiency of silicon solar cells |
| 06/27/2013 | DE102010015263B4 Hitzeschild in einer thermischen Bearbeitungskammer und Verfahren zu seiner Herstellung Heat shield in a thermal processing chamber and method for its manufacture |
| 06/27/2013 | DE102006001792B4 Halbleitermodul mit Halbleiterchipstapel und Verfahren zur Herstellung desselben The same semiconductor module with the semiconductor chip stack, and process for preparing |
| 06/27/2013 | DE10030472B4 Halbleiter-Fabrikautomatisierungssystem und Verfahren zur Überwachung zumimdest eines Servers in Echtzeit Semiconductor factory automation system and method for monitoring zumimdest a server in real time |
| 06/26/2013 | EP2608274A1 Ink for production of compound semiconductor thin film, compound semiconductor thin film produced using the ink, solar cell equipped with the compound semiconductor thin film, and process for production of the solar cell |
| 06/26/2013 | EP2608270A2 Semiconductor device and method of manufacturing the same |
| 06/26/2013 | EP2608255A1 Method of bonding two substrates and device manufactured thereby |
| 06/26/2013 | EP2608253A2 TSV provided with a stress-release structure and method for manufacturing same |
| 06/26/2013 | EP2608252A1 Manufacturing a flexible structure by layer transfer |
| 06/26/2013 | EP2608251A1 Method of manufacturing organic semiconductor thin film and monocrystalline organic semiconductor thin film |
| 06/26/2013 | EP2608250A2 Metal-insulator-metal capacitor and method for manufacturing the same |
| 06/26/2013 | EP2608249A1 Method for producing transistor |
| 06/26/2013 | EP2608248A1 Heat treatment method for wafer, method for producing silicon wafer, silicon wafer, and heat treatment apparatus |
| 06/26/2013 | EP2608247A1 EUV photoresist encapsulation |
| 06/26/2013 | EP2608246A1 System and method for design, procurement and manufacturing collaboration |
| 06/26/2013 | EP2607527A1 Process for production of aluminum-containing iii nitride single crystal |
| 06/26/2013 | EP2607519A2 Scratch resistant coated glass article including layer(s) resistant to fluoride-based etchant(s), and method of making article using combustion CVD |
| 06/26/2013 | EP2606510A1 Method for producing at least one optoelectronic semiconductor component |
| 06/26/2013 | EP2606509A1 Semiconductor chip assembly and method of preparing the same |
| 06/26/2013 | EP2606508A2 Cmp slurry recycling system and methods |
| 06/26/2013 | EP2606507A1 Pseudo-substrate for use in the production of semiconductor components and method for producing a pseudo-substrate |
| 06/26/2013 | EP2288244B1 Wiring circuit substrate |
| 06/26/2013 | CN203026546U Automatic solar battery cell feeding device |
| 06/26/2013 | CN203026492U Tool for taking away chips from wafers |
| 06/26/2013 | CN203026491U Anti-falling device of automatic feeding device of polycrystalline wool making machine |
| 06/26/2013 | CN203026490U Wafer boat |
| 06/26/2013 | CN203026489U Track structure for manufacturing full-automatic transistor die bonder of integrated circuit |
| 06/26/2013 | CN203026488U Expansion and overturning integrated equipment |
| 06/26/2013 | CN203026487U Chip mounter work bench capable of achieving rotary posture correction of chip |
| 06/26/2013 | CN203026486U Mechanical structure for bonding chips of integrated circuit in multi-row manner |
| 06/26/2013 | CN203026485U Annealing furnace heated and cooled quickly |
| 06/26/2013 | CN203021033U Stacking device of chips |
| 06/26/2013 | CN103180978A LED package production system and resin coating method in LED package production system |
| 06/26/2013 | CN103180973A Iii-nitride light emitting device |
| 06/26/2013 | CN103180971A Iii-nitride layer grown on a substrate |
| 06/26/2013 | CN103180961A 改进的肖特基整流器 Improved Schottky rectifiers |
| 06/26/2013 | CN103180959A Semiconductor element and manufacturing method therefor |
| 06/26/2013 | CN103180958A Trench dmos device with improved termination structure for high voltage applications |
| 06/26/2013 | CN103180957A Hemt with floating and grounded substrate regions |
| 06/26/2013 | CN103180956A Method of manufacturing a SiC bipolar junction transistor and sic bipolar junction transistor thereof |
| 06/26/2013 | CN103180952A Gettering agents in memory charge storage structures |
| 06/26/2013 | CN103180951A Improved device switching using layered device structure |
| 06/26/2013 | CN103180950A Integrated circuitry comprising nonvolatile memory cells and methods of forming a nonvolatile memory cell |
| 06/26/2013 | CN103180949A Device structure for long endurance memristors |
| 06/26/2013 | CN103180944A Electronic components assembly |
| 06/26/2013 | CN103180938A Capacitance array body and signal processing device comprising same |
| 06/26/2013 | CN103180937A Sheet adhesion device and adhesion method |
| 06/26/2013 | CN103180936A 电子装置和电子部件 The electronic device and the electronic component |
| 06/26/2013 | CN103180935A Compound gan substrate and method for producing same, and group iii nitride semiconductor device and method for producing same |
| 06/26/2013 | CN103180934A Low temperature implant to improve BJT current gain |
| 06/26/2013 | CN103180933A Method of improving mechanical properties of semiconductor interconnects with nanoparticles |
| 06/26/2013 | CN103180932A Methods and apparatus for controlling photoresist line width roughness |
| 06/26/2013 | CN103180931A Polishing composition |
| 06/26/2013 | CN103180930A N-well/p-well strap structures |
| 06/26/2013 | CN103180690A Pattern measuring method, pattern measuring apparatus, and program using same |
| 06/26/2013 | CN103180494A Method of manufacturing gan-based film and composite substrate used therefor |
| 06/26/2013 | CN103180493A Process for growing silicon carbide single crystal and device for the same |
| 06/26/2013 | CN103180267A Heating device |
| 06/26/2013 | CN103180266A Electrostatic chuck |
| 06/26/2013 | CN103180262A Cordierite ceramic, and member for semiconductor manufacture devices which comprises same |
| 06/26/2013 | CN103180101A Polishing composition and polishing method using same |
| 06/26/2013 | CN103180100A Polishing pad and method for producing same |
| 06/26/2013 | CN103180079A Production method for solder transfer base material, solder precoating method, and solder transfer base material |
| 06/26/2013 | CN103180029A Method for the removal of f2 and/or of2 from gas |
| 06/26/2013 | CN103178122A Iii-v semiconductor devices with buried contacts |
| 06/26/2013 | CN103178121A Pin二极管及其制造方法 Pin diode and its manufacturing method |
| 06/26/2013 | CN103178120A Fast recovery epitaxial diode (FRED) and preparation method thereof |
| 06/26/2013 | CN103178119A Array substrate, method for preparing array substrate and display device |
| 06/26/2013 | CN103178117A Bipolar type thin film transistor and production method thereof |
| 06/26/2013 | CN103178115A Semiconductor device and method of manufacturing the same |
| 06/26/2013 | CN103178114A Insulated gate bipolar transistor structure having low substrate leakage |
| 06/26/2013 | CN103178113A Semiconductor device and method of manufacturing the same |
| 06/26/2013 | CN103178111A Deep groove structure and production method thereof |
| 06/26/2013 | CN103178110A Deep trench structure in super junction technique and manufacturing method thereof |
| 06/26/2013 | CN103178109A High voltage isolation n-type Lateral Double-Diffused Metal Oxide Semiconductor (NLDMOS) structure and manufacture method thereof |
| 06/26/2013 | CN103178108A Compound semiconductor device with buried field plate |
| 06/26/2013 | CN103178107A High electron mobility transistor structure with improved breakdown voltage performance |
| 06/26/2013 | CN103178104A Semiconductor device multistage field plate terminal structure and manufacturing method thereof |
| 06/26/2013 | CN103178103A Semiconductor device and method of manufacturing the same |
| 06/26/2013 | CN103178102A Insulated gate bipolar transistor (IGBT) and producing method thereof |
| 06/26/2013 | CN103178101A Insulated gate bipolar transistor (IGBT) and producing method |
| 06/26/2013 | CN103178100A Vertical plug and play (PNP) type triode and production method thereof |
| 06/26/2013 | CN103178099A MIS type semiconductor device and production method therefor |