Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2013
07/04/2013US20130168802 Soi structures with reduced metal content
07/04/2013US20130168801 Method of forming isolation area and structure thereof
07/04/2013US20130168799 Semiconductor device having groove-shaped via-hole
07/04/2013US20130168797 Method and structure for using discontinuous laser scribe lines
07/04/2013US20130168786 Magnetic shift register with pinning structure
07/04/2013US20130168783 Micro-electro-mechanical system (mems) capacitive ohmic switch and design structures
07/04/2013US20130168782 Micro-electro-mechanical system (mems) structures and design structures
07/04/2013US20130168781 Two-wafer mems ionization device
07/04/2013US20130168780 Method and structure to reduce fet threshold voltage shift due to oxygen diffusion
07/04/2013US20130168776 Complementary Metal Oxide Semiconductor (CMOS) Device Having Gate Structures Connected By A Metal Gate Conductor
07/04/2013US20130168773 High-K Metal Gate Electrode Structure Formed by Removing a Work Function on Sidewalls in Replacement Gate Technology
07/04/2013US20130168771 Method of Forming CMOS FinFET Device
07/04/2013US20130168770 High-voltage oxide transistor and method of manufacturing the same
07/04/2013US20130168766 Drain extended mos transistor and method for fabricating the same
07/04/2013US20130168765 Trench dmos device with improved termination structure for high voltage applications
07/04/2013US20130168764 Trench semiconductor power device having active cells under gate metal pad
07/04/2013US20130168761 Semiconductor power device having improved termination structure for mask saving
07/04/2013US20130168760 Trench mosfet with resurf stepped oxide and diffused drift region
07/04/2013US20130168758 Semiconductor device and method for manufacturing the same
07/04/2013US20130168757 Nonvolatile memory device and method for fabricating the same
07/04/2013US20130168756 Source/drain zones with a delectric plug over an isolation region between active regions and methods
07/04/2013US20130168755 Single poly eeprom and method for fabricating the same
07/04/2013US20130168754 Method for fabricating a semiconductor device with increased reliability
07/04/2013US20130168753 Nonvolatile memory device and method for fabricating the same
07/04/2013US20130168752 Nonvolatile memory device and method for fabricating the same
07/04/2013US20130168748 Fin fet structure with dual-stress spacers and method for forming the same
07/04/2013US20130168747 Semiconductor Device and Method for Manufacturing A Semiconductor Device
07/04/2013US20130168746 Semiconductor device and related manufacturing method
07/04/2013US20130168745 Nonvolatile memory device and method for fabricating the same
07/04/2013US20130168744 Semiconductor Device Having a Metal Gate and Fabricating Method Thereof
07/04/2013US20130168743 Strained transistor structure
07/04/2013US20130168742 Integrated circuit configuration and fabricating method thereof
07/04/2013US20130168741 Complementary junction field effect transistor device and its gate-last fabrication method
07/04/2013US20130168738 Semiconductor wafer, insulated gate field effect transistor, and method for producing semiconductor wafer
07/04/2013US20130168737 Integrated Heterojunction Semiconductor Device and Method for Producing an Integrated Heterojunction Semiconductor Device
07/04/2013US20130168732 Vertical BJT and SCR for ESD
07/04/2013US20130168731 Semiconductor power device having wide termination trench and self-aligned source regions for mask saving
07/04/2013US20130168728 Lateral insulated-gate bipolar transistor and manufacturing method thereof
07/04/2013US20130168708 Method for disposing fine objects, apparatus for arranging fine objects, illuminating apparatus and display apparatus
07/04/2013US20130168707 Array substrate structure of display panel and method of making the same
07/04/2013US20130168702 Method For Preparing a GaAS Substrate For A Ferromagnetic Semiconductor, Method for Manufacturing One Such Semiconductor, Resulting Substrate and Semiconductor, And Uses Of Said Semiconductor
07/04/2013US20130168701 Silicon carbide semiconductor element and method for fabricating the same
07/04/2013US20130168697 Silicon carbide structure and manufacturing method thereof
07/04/2013US20130168696 Silicon Carbide Schottky Diode Device with Mesa Termination and Manufacturing Method Thereof
07/04/2013US20130168695 Cmos having a sic/sige alloy stack
07/04/2013US20130168693 Protective-film-attached composite substrate and method of manufacturing semiconductor device
07/04/2013US20130168692 POLYCRYSTALLINE ALUMINUM NITRIDE BASE MATERIAL FOR CRYSTAL GROWTH OF GaN-BASE SEMICONDUCTOR AND METHOD FOR MANUFACTURING GaN-BASE SEMICONDUCTOR USING THE SAME
07/04/2013US20130168689 Nitride based semiconductor device and manufacturing method thereof
07/04/2013US20130168688 Nitride based semiconductor device and manufacturing method thereof
07/04/2013US20130168686 High electron mobility transistor and method of forming the same
07/04/2013US20130168685 High electron mobility transistor and method of forming the same
07/04/2013US20130168683 Thin film transistor and manufacturing method thereof
07/04/2013US20130168682 Semiconductor device and manufacturing method thereof
07/04/2013US20130168676 Super-Junction Structure of Semiconductor Device and Method of Forming the Same
07/04/2013US20130168673 Intra Die Variation Monitor Using Through-Silicon Via
07/04/2013US20130168672 Multichip Module with Reroutable Inter-Die Communication
07/04/2013US20130168668 Thin film transistor array substrate, method for manufacturing the same, and annealing oven for performing the same method
07/04/2013US20130168666 Semiconductor device and method of forming the same
07/04/2013US20130168632 Resistance variable memory device and method for fabricating the same
07/04/2013US20130168141 Substrate with through-electrode and method for producing same
07/04/2013US20130168019 System for splitting of brittle materials with trenching technology
07/04/2013US20130168017 Edge protection seal for bonded substrates
07/04/2013US20130167867 Composition And Method For Removing Photoresist And Bottom Anti-Reflective Coating For A Semiconductor Substrate
07/04/2013US20130167774 Batch type apparatus for manufacturing semiconductor devices
07/04/2013US20130167632 Microelectromechanical system device with electrical interconnections and method for fabricating the same
07/04/2013US20130167588 Sheet wafer furnace with gas preservation system
07/04/2013US20130167369 Apparatuses for mounting semiconductor chips
07/04/2013US20130167339 Device manufacturing apparatus and method for the same
07/04/2013US20130167338 Electrical Device, System and Method for Operating with Reduced Acoustic Noise Generation
07/04/2013DE112011103061T5 Speichervorrichtung Memory device
07/04/2013DE112011103040T5 Verfahren zum Ausbilden von Wafer-Durchkontaktierungen in Halbleiterstrukturen unter Verwendung von Opfermaterial und mit diesen Verfahren hergestellte Halbleiterstrukturen A method of forming wafer vias in semiconductor structures using sacrificial material and using this method produced semiconductor structures
07/04/2013DE112011102943T5 Ersatzmetall-Gate mit randlosem Kontakt Replacement metal gate with rimless Contact
07/04/2013DE112011102903T5 Übertragungssystem und Übertragungsverfahren Transmission system and communication method
07/04/2013DE112011102787T5 Epitaxialwafer und Halbleitereinrichtung Epitaxial wafer and semiconductor device
07/04/2013DE102012213880A1 Metallgateelektrodenstrukturen mit großem ε, die durch Entfernen eines Austrittsarbeitsmetalls an Seitenwänden in einer Austauschgatetechnik hergestellt ist Metal gate electrode structures with large ε, which is prepared by removing a work function metal on the side walls in a replacement gate technology
07/04/2013DE102012205914A1 Mandrelmodifzierung zum Erreichen einer einzelfinnen-finnähnlichen Feldeffekttransistor-(FINET-)Vorrichtung transistor (finest) device Mandrelmodifzierung to achieve a single finnen-finn similar field effect transistor (FINET-) transistor device (finest) device
07/04/2013DE102012200034A1 Verfahren zur Herstellung eines Verbundkörpers mit gesinterter Fügeschicht und Sintervorrichtung zur Herstellung eines derartigen Verbundkörpers A method for producing a composite sintered body with the bonding layer and sintering apparatus for producing such a composite body
07/04/2013DE102012113145A1 Device, used for loading and unloading substrates to be treated in batch process, includes processing chamber, and a lock chamber, where processing and lock chambers are bounded via chamber walls and comprise substrate transporting device
07/04/2013DE102012113139A1 Leistungshalbleitervorrichtung und Herstellungsverfahren dafür Power semiconductor device and manufacturing method thereof
07/04/2013DE102012113012A1 Elektronische Vorrichtung und Verfahren zum Herstellen einer elektronischen Vorrichtung An electronic device and method for manufacturing an electronic device
07/04/2013DE102012112667A1 Verfahren und Vorrichtung zum Ausbilden eines Nagelbondhügels Method and apparatus for forming a bump nail
07/04/2013DE102012109971A1 Verfahren zum Bilden von Halbleitervorrichtungen, bei dem elektrolysierte Schwefelsäure (ESA) verwendet wird A method for forming semiconductor devices is used in the electrolyzed sulfuric acid (ESA)
07/04/2013DE102012109484A1 Gepackte Halbleitervorrichtung und Verfahren zum Packen der Halbleitervorrichtung A semiconductor device package and method for packaging the semiconductor device
07/04/2013DE102012100030A1 Substratteller Substrate plate
07/04/2013DE102011119497B4 Band zu Band Tunnel-Feldeffekttransistor mit gradierter Halbleiterheterostruktur im Tunnelübergang und Verfahren zu dessen Herstellung Band to band tunneling field effect transistor having a graded semiconductor heterostructure in the tunnel junction and process for its preparation
07/04/2013DE102011090053A1 Vereinzelungsvorrichtung und Verfahren zum Vereinzeln eines metallischen oder keramischen Rohteiles Separating apparatus and method for separating a metallic or ceramic blank part
07/04/2013DE102011057172A1 Verfahren und Vorrichtung zur Herstellung einer Beschichtung auf einem Halbleiterbauelement Method and apparatus for producing a coating on a semiconductor device
07/04/2013DE102009049613B4 Leistungshalbleitervorrichtung Power semiconductor device
07/04/2013DE102009028868B4 Verfahren zur Behandlung von Wafern mit einer Flüssigkeit in einer Nassbank A method for the treatment of wafers with a liquid in a wet bench
07/04/2013DE102009021487B4 Halbleiterelement mit vergrabener isolierender Schicht und pn-Übergang sowie entsprechendes Herstellungsverfahren Semiconductor element with a buried insulating layer and pn junction and manufacturing method thereof
07/04/2013DE102009021486B4 Verfahren zur Feldeffekttransistor-Herstellung A process for the field effect transistor fabrication
07/04/2013DE102007038152B4 Vertikaler Bipolartransistor und Verfahren zu seiner Herstellung A vertical bipolar transistor and method for its preparation
07/04/2013DE102004059154B4 Verfahren zum Überprüfen einer laserbearbeiteten verschlechterten Schicht A method for checking a laser processed deteriorated layer
07/04/2013DE10164502B4 Verfahren zur hermetischen Verkapselung eines Bauelements Process for hermetic encapsulation of a component
07/03/2013EP2610926A1 Method of manufacturing light emitting device, and light emitting device
07/03/2013EP2610920A1 Process for production of solar cell module
07/03/2013EP2610907A1 Stacked electronic device and method for manufacturing such an electronic device
07/03/2013EP2610906A1 Method for collective production of 3D electronic modules comprising only valid PCBs
07/03/2013EP2610905A2 Packaging method for electronic components using a thin substrate
07/03/2013EP2610904A2 Packaging method for electronic components using a thin substrate
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