| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/03/2013 | CN103187404A Semiconductor chip stacking and packaging structure and process thereof |
| 07/03/2013 | CN103187402A Testing structure, forming method of testing structure and washing time judging method of washing process |
| 07/03/2013 | CN103187401A Wafer heater and electronic mobility detector |
| 07/03/2013 | CN103187400A Silicon through hole detection structure and detection method |
| 07/03/2013 | CN103187398A Silicon through hole detection structure and detection method |
| 07/03/2013 | CN103187395A Interconnection structure of semiconductors and formation method |
| 07/03/2013 | CN103187394A Packages with passive devices and methods of forming same |
| 07/03/2013 | CN103187393A Structure and method for transformer with magnetic features |
| 07/03/2013 | CN103187392A Metal line structure and forming method of |
| 07/03/2013 | CN103187391A Semiconductor device and manufacturing method thereof |
| 07/03/2013 | CN103187389A Multilayer electronic structure with stair-stepping holes |
| 07/03/2013 | CN103187388A Packaged semiconductor device and method of packaging the semiconductor device |
| 07/03/2013 | CN103187387A Bump structure and electronic packaging solder joint structure and fabricating method thereof |
| 07/03/2013 | CN103187386A Substrate structure, packaging structure and manufacturing method thereof |
| 07/03/2013 | CN103187384A Metal dielectric layer, manufacturing method thereof and circuit board |
| 07/03/2013 | CN103187380A Semiconductor device having a through-substrate via |
| 07/03/2013 | CN103187379A Semiconductor stack structure and fabrication method thereof |
| 07/03/2013 | CN103187378A Power semiconductor device and manufacturing method thereof |
| 07/03/2013 | CN103187375A Device and method for manufacturing an electronic device |
| 07/03/2013 | CN103187374A Power component encapsulation structure |
| 07/03/2013 | CN103187371A Semiconductor structure and method for manufacturing the same |
| 07/03/2013 | CN103187369A Monolithic integration of photonics and electronics in cmos processes |
| 07/03/2013 | CN103187368A Formation method of transistor in embedded type flash memory |
| 07/03/2013 | CN103187367A Manufacturing method of semiconductor element with metal grid electrode |
| 07/03/2013 | CN103187366A Thin film transistor (TFT) array substrate formation method |
| 07/03/2013 | CN103187365A Interlayer alignment of multi-layer support structure |
| 07/03/2013 | CN103187364A Method for preparing seed layer in deep hole with high depth-to-width ratio |
| 07/03/2013 | CN103187363A Manufacturing method of copper interconnection |
| 07/03/2013 | CN103187362A Manufacturing method for dual-embedded Damascus structure device with air gap |
| 07/03/2013 | CN103187361A Manufacturing method of copper interconnection layers |
| 07/03/2013 | CN103187360A Interconnection structure forming method |
| 07/03/2013 | CN103187359A Forming method of metal interconnecting wire |
| 07/03/2013 | CN103187358A Manufacturing method of copper barrier layer |
| 07/03/2013 | CN103187357A Method for preventing hooped metal residue being formed on metal interconnection line |
| 07/03/2013 | CN103187356A Semiconductor chip and manufacture method of intermetallic dielectric layer |
| 07/03/2013 | CN103187355A Semiconductor substrate with isolated structure and manufacturing method thereof |
| 07/03/2013 | CN103187354A Forming method of locally oxidized silicon isolation |
| 07/03/2013 | CN103187353A Method for forming shallow groove isolation area |
| 07/03/2013 | CN103187352A Manufacture method of semiconductor device |
| 07/03/2013 | CN103187351A Fabrication method of integrated circuit |
| 07/03/2013 | CN103187350A Silicon wafer thinning fixture with through-hole electroplating copper salient points and thinning technique |
| 07/03/2013 | CN103187349A Fixture with salient point wafer bonding and bonding method thereof |
| 07/03/2013 | CN103187348A Wafer fixed device, semiconductor device and wafer fixed method |
| 07/03/2013 | CN103187347A Method for unloading battery silicon wafer |
| 07/03/2013 | CN103187346A Fixture for clamping and corroding wafer |
| 07/03/2013 | CN103187345A Taking and placing device |
| 07/03/2013 | CN103187344A Substrate plate |
| 07/03/2013 | CN103187343A Intelligent defect diagnosis method |
| 07/03/2013 | CN103187342A Die attach apparatus |
| 07/03/2013 | CN103187341A Substrate processing device and method |
| 07/03/2013 | CN103187340A Substrate processing apparatus and substrate processing method |
| 07/03/2013 | CN103187339A Substrate processing apparatus and substrate processing method |
| 07/03/2013 | CN103187338A Modularized semiconductor processing device |
| 07/03/2013 | CN103187337A Base plate surface processing device and method for processing base plate surface |
| 07/03/2013 | CN103187336A 压力调整装置 Pressure adjusting means |
| 07/03/2013 | CN103187335A Temperature control method and device for antireflective film preparation furnace |
| 07/03/2013 | CN103187334A Assembled equipment support device |
| 07/03/2013 | CN103187333A Multi-chip prober and contact position correction method thereof |
| 07/03/2013 | CN103187332A Semiconductor technology monitoring method and semiconductor technology monitoring device |
| 07/03/2013 | CN103187331A Chip picking device and chip pasting system |
| 07/03/2013 | CN103187330A Hfe testing method in wafer manufacturing process |
| 07/03/2013 | CN103187329A Analytical method of wafer yield |
| 07/03/2013 | CN103187328A Detection method of CMP terminal and formation method of phase change memory bottom contact structure |
| 07/03/2013 | CN103187327A Method for collective production of 3d electronic modules comprising only valid pcbs |
| 07/03/2013 | CN103187326A Package method of ultrathin substrate |
| 07/03/2013 | CN103187325A Laser positioning method used for bump manufacturing |
| 07/03/2013 | CN103187324A Preparation method and structure of welding spot |
| 07/03/2013 | CN103187323A Semiconductor chip and thickening manufacture method of pressure welding block metal layer of semiconductor chip |
| 07/03/2013 | CN103187322A Fully molded fan-out |
| 07/03/2013 | CN103187321A Encapsulation die with low adhesion coating film |
| 07/03/2013 | CN103187320A Quad flat no-lead (QFN) package spill-proof protective method |
| 07/03/2013 | CN103187319A Package method for ultrathin substrate |
| 07/03/2013 | CN103187318A Package method for ultrathin substrate |
| 07/03/2013 | CN103187317A Assembling method of semiconductor component |
| 07/03/2013 | CN103187316A Hole wall metalizing process during production of ceramic shells |
| 07/03/2013 | CN103187315A Methods for stud bump formation and apparatus for performing same |
| 07/03/2013 | CN103187314A Package carrier and manufacturing method thereof |
| 07/03/2013 | CN103187313A Spherical array packaging chip reballing method |
| 07/03/2013 | CN103187312A Fabrication method of rewiring layer in wafer level packaging structure and wafer level packaging structure |
| 07/03/2013 | CN103187311A Fabrication method of package substrate |
| 07/03/2013 | CN103187310A Complementary junction field effect transistor (c-JFET) device and rear grid electrode manufacturing method thereof |
| 07/03/2013 | CN103187309A 结型场效应晶体管及其制造方法 Junction field-effect transistor and manufacturing method thereof |
| 07/03/2013 | CN103187308A Technotron and forming method thereof |
| 07/03/2013 | CN103187307A Thin film transistor using multiple active channel layers |
| 07/03/2013 | CN103187306A Methods for semiconductor regrowth |
| 07/03/2013 | CN103187305A Method for fabricating a semiconductor device with increased reliability |
| 07/03/2013 | CN103187304A Methods of manufacturing semiconductor devices and transistors |
| 07/03/2013 | CN103187303A Method for fabricating power semiconductor device |
| 07/03/2013 | CN103187302A Transistor operating method |
| 07/03/2013 | CN103187301A Trench type power transistor device with super junction and manufacturing method thereof |
| 07/03/2013 | CN103187300A Fin type field effect transistor and formation method of fin type field effect transistor |
| 07/03/2013 | CN103187299A Forming method of transistor |
| 07/03/2013 | CN103187298A 金属栅极场效应晶体管及其制作方法 Metal gate field effect transistor and manufacturing method thereof |
| 07/03/2013 | CN103187297A Manufacturing method of fin type field effect transistor |
| 07/03/2013 | CN103187296A Formation method of fin type field effect transistor |
| 07/03/2013 | CN103187295A Gate-grounded NMOS manufacturing method |
| 07/03/2013 | CN103187294A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 07/03/2013 | CN103187293A Manufacturing method of semiconductor device |
| 07/03/2013 | CN103187292A Method of manufacturing trench semiconductor power device |
| 07/03/2013 | CN103187291A Method of preparing trench semiconductor power discrete device |