Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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07/09/2013 | US8481342 Method of manufacturing semiconductor device, semiconductor device and semiconductor composite device |
07/09/2013 | US8481341 Epitaxial film growth in retrograde wells for semiconductor devices |
07/09/2013 | US8481340 Method for preparing a light-emitting device using gas cluster ion beam processing |
07/09/2013 | US8481339 Magnetic memory and manufacturing method thereof |
07/09/2013 | US8481338 ALD processing techniques for forming non-volatile resistive-switching memories |
07/09/2013 | US8481247 Resist underlayer film forming composition containing liquid additive |
07/09/2013 | US8481244 Epoxy-containing polymer, photo-curable resin composition, patterning process, and electric/electronic part protective film |
07/09/2013 | US8481163 Carbon nanotube growth method |
07/09/2013 | US8481162 Stabilized semiconductor nanocrystals comprising a coating of polydentate ligand |
07/09/2013 | US8481142 System and method for monitoring chloride content and concentration induced by a metal etch process |
07/09/2013 | US8481123 Method for high pressure gas annealing |
07/09/2013 | US8481119 Bisamineazaallylic ligands and their use in atomic layer deposition methods |
07/09/2013 | US8480926 Liquid-crystalline compound and organic semiconductor device containing the compound |
07/09/2013 | US8480850 Plasma treatment system |
07/09/2013 | US8480849 Substrate processing apparatus and electrode structure |
07/09/2013 | US8480848 Plasma processing apparatus |
07/09/2013 | US8480847 Processing system |
07/09/2013 | US8479681 Single-shot semiconductor processing system and method having various irradiation patterns |
07/09/2013 | CA2484653C Method and apparatus for two dimensional assembly of particles |
07/04/2013 | WO2013102146A1 Die up fully molded fan-out wafer level packaging |
07/04/2013 | WO2013102137A2 Fully molded fan-out |
07/04/2013 | WO2013102022A1 Vacuum effector and method of use |
07/04/2013 | WO2013101907A1 Compositions and methods for selectively etching titanium nitride |
07/04/2013 | WO2013101851A1 System architecture for combined static and pass-by processing |
07/04/2013 | WO2013101790A2 Finfet with merged fins and vertical silicide |
07/04/2013 | WO2013101670A1 Plasma activation systems |
07/04/2013 | WO2013101423A1 Zero shrinkage smooth interface oxy-nitride and oxy-amorphous-silicon stacks for 3d memory vertical gate application |
07/04/2013 | WO2013101274A1 Increasing masking layer etch rate and selectivity |
07/04/2013 | WO2013101243A1 High density package interconnects |
07/04/2013 | WO2013101241A1 Organic thin film passivation of metal interconnections |
07/04/2013 | WO2013101239A1 Increasing current carrying capability through direct liquid cooling of test contacts |
07/04/2013 | WO2013101238A1 Test probes |
07/04/2013 | WO2013101237A1 Hard mask etch stop for tall fins |
07/04/2013 | WO2013101230A1 Variable gate width for gate all-around transistors |
07/04/2013 | WO2013101226A1 Apparatus and method for automated sort probe assembly and repair |
07/04/2013 | WO2013101219A1 Wrap-around trench contact structure and methods of fabrication |
07/04/2013 | WO2013101204A1 Self-enclosed asymmetric interconnect structures |
07/04/2013 | WO2013101203A1 Balancing energy barrier between states in perpendicular magnetic tunnel junctions |
07/04/2013 | WO2013101202A1 Techniques for phase tuning for process optimization |
07/04/2013 | WO2013101172A1 Compound tunneling field effect transistor integrated on silicon substrate and method for fabricating the same |
07/04/2013 | WO2013101115A1 Defective artifact removal in photolithography masks corrected for optical proximity |
07/04/2013 | WO2013101109A1 Sub-second annealing lithography techniques |
07/04/2013 | WO2013101108A1 Pattern decomposition lithography techniques |
07/04/2013 | WO2013101107A1 Double patterning lithography techniques |
07/04/2013 | WO2013101105A1 Spacer assisted pitch division lithography |
07/04/2013 | WO2013101096A1 Airgap interconnect with hood layer and method of forming |
07/04/2013 | WO2013101028A1 Avd hardmask for damascene patterning |
07/04/2013 | WO2013101007A1 Methods of integrating multiple gate dielectric transistors on a tri-gate (finfet) process |
07/04/2013 | WO2013101004A1 Contact techniques and configurations for reducing parasitic resistance in nanowire transistors |
07/04/2013 | WO2013101003A1 Techniques and configurations for stacking transistors of an integrated circuit device |
07/04/2013 | WO2013101001A1 Methods of forming hetero-layers with reduced surface roughness and bulk defect density on non-native surfaces and the structures formed thereby |
07/04/2013 | WO2013100995A1 Photonic package architecture |
07/04/2013 | WO2013100955A1 Annealing a sacrificial layer |
07/04/2013 | WO2013100951A1 Backside bulk silicon mems |
07/04/2013 | WO2013100917A1 Optical transmission of test data for testing integrated circuits |
07/04/2013 | WO2013100914A1 Methods to enhance doping concentration in near-surface layers of semiconductors and methods of making same |
07/04/2013 | WO2013100913A1 Transient thermal management systems for semiconductor devices |
07/04/2013 | WO2013100906A1 Carbon nanotube semiconductor devices and deterministic nanofabrication methods |
07/04/2013 | WO2013100897A1 Damage monitor structure for through-silicon via (tsv) arrays |
07/04/2013 | WO2013100894A1 Method of forming low resistivity tanx/ta diffusion barriers for backend interconnects |
07/04/2013 | WO2013100644A1 Etching-solution composition and wet etching method using same |
07/04/2013 | WO2013100449A1 Silicon carbide epitaxial wafer and method for fabricating the same |
07/04/2013 | WO2013100294A1 Apparatus for fabricating ingot and method of fabricating ingot |
07/04/2013 | WO2013100158A1 Actinic ray-sensitive or radiation-sensitive resin composition, and, actinic ray-sensitive or radiation-sensitive film and pattern forming method, each using the same |
07/04/2013 | WO2013099662A1 Actinic ray-sensitive or radiation-sensitive resin composition, and, resist film, pattern forming method, electronic device manufacturing method, and electronic device, each using the composition |
07/04/2013 | WO2013098794A2 Nickel allyl amidinate precursors for deposition of nickel-containing films |
07/04/2013 | WO2013098657A1 Nanostructure and process of fabricating same |
07/04/2013 | WO2013097915A1 Device and method for producing an analogue control signal |
07/04/2013 | WO2013049578A4 Group iii-v substrate material with particular crystallographic features and methods of making |
07/04/2013 | WO2013048155A3 Method for forming fine patterns of semiconductor device using directed self assembly process |
07/04/2013 | WO2013043730A3 Electrical contacts to nanostructured areas |
07/04/2013 | WO2013039645A3 Integrated building based air handler for server farm cooling system |
07/04/2013 | WO2013006241A4 Pedestal with edge gas deflector for edge profile control |
07/04/2013 | WO2013002941A8 Integrated circuit comprising a mosfet having ballast resistors and corresponding manufacturing method |
07/04/2013 | WO2012125560A3 Method and apparatus for plasma dicing a semi-conductor wafer |
07/04/2013 | WO2011119819A3 Implant alignment through a mask |
07/04/2013 | US20130174105 Method and apparatus for plasma processing |
07/04/2013 | US20130171839 C-rich carbon boron nitride dielectric films for use in electronic devices |
07/04/2013 | US20130171838 Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and non-transitory computer-readable recording medium |
07/04/2013 | US20130171837 Semiconductor process |
07/04/2013 | US20130171836 Method for surface treatment on a metal oxide and method for preparing a thin film transistor |
07/04/2013 | US20130171835 Composition for water-repellent treatment of surface, and method for water-repellent treatment of surface of semiconductor substrate using same |
07/04/2013 | US20130171834 In-situ deposition of film stacks |
07/04/2013 | US20130171833 Methods and apparatus for wetting pretreatment for through resist metal plating |
07/04/2013 | US20130171832 Enhanced Isolation For Combinatorial Atomic Layer Deposition (ALD) |
07/04/2013 | US20130171831 Substrate processing apparatus and substrate processing method |
07/04/2013 | US20130171830 Method for removing germanium suboxide |
07/04/2013 | US20130171829 Titanium-Nitride Removal |
07/04/2013 | US20130171828 Processing liquid for suppressing pattern collapse of microstructure, and method for producing microstructure using same |
07/04/2013 | US20130171827 Method and apparatus for manufacturing three-dimensional-structure memory device |
07/04/2013 | US20130171826 Semiconductor device production method and rinse |
07/04/2013 | US20130171825 Photoresist pattern trimming methods |
07/04/2013 | US20130171824 Process for chemically mechanically polishing substrates containing silicon oxide dielectric films and polysilicon and/or silicon nitride films |
07/04/2013 | US20130171823 CMP Slurry Composition and Polishing Method Using the Same |
07/04/2013 | US20130171822 Tungsten feature fill with nucleation inhibition |
07/04/2013 | US20130171821 Method of fabricating metal contact using double patterning technology and device formed thereby |
07/04/2013 | US20130171820 Methods for three-dimensional integrated circuit through hole via gapfill and overburden removal |
07/04/2013 | US20130171819 Methods for integration of metal/dielectric interconnects |
07/04/2013 | US20130171818 Method of Manufacturing A Semiconductor Device |
07/04/2013 | US20130171817 Structure and method for reducing vertical crack propagation |