Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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07/09/2013 | US8482027 Epitaxial wafer for light emitting diode |
07/09/2013 | US8482023 Leadframe having a heat sink supporting part, fabricating method of a light emitting diode package using the same, and light emitting diode package fabricated by the method |
07/09/2013 | US8482008 Method of manufacturing thin film transistor, thin film transistor, and display unit |
07/09/2013 | US8482003 Image display unit |
07/09/2013 | US8481998 Display device and method for manufacturing the same |
07/09/2013 | US8481988 Resistance change memory and manufacturing method thereof |
07/09/2013 | US8481964 Charged particle beam drawing apparatus and method |
07/09/2013 | US8481936 Scanning electron microscope system and method for measuring dimensions of patterns formed on semiconductor device by using the system |
07/09/2013 | US8481887 Method for machining tapered micro holes |
07/09/2013 | US8481845 Method to form a photovoltaic cell comprising a thin lamina |
07/09/2013 | US8481842 Process for producing Peltier modules, and Peltier module |
07/09/2013 | US8481626 Wax-based encapsulant/moisture barrier for use with electronics received in water meter pits |
07/09/2013 | US8481435 Protein repelling silicon and germanium surfaces |
07/09/2013 | US8481434 Method of manufacturing a semiconductor device and processing apparatus |
07/09/2013 | US8481433 Methods and apparatus for forming nitrogen-containing layers |
07/09/2013 | US8481432 Fabrication of semiconductor interconnect structure |
07/09/2013 | US8481431 Method for opening one-side contact region of vertical transistor and method for fabricating one-side junction region using the same |
07/09/2013 | US8481430 Method of manufacturing semiconductor device |
07/09/2013 | US8481429 Method of manufacturing semiconductor device |
07/09/2013 | US8481428 Polishing slurry and polishing method |
07/09/2013 | US8481427 Method for manufacturing a micromechanical component, and micromechanical component |
07/09/2013 | US8481426 Method of forming pattern structure and method of fabricating semiconductor device using the same |
07/09/2013 | US8481425 Method for fabricating through-silicon via structure |
07/09/2013 | US8481423 Methods to mitigate plasma damage in organosilicate dielectrics |
07/09/2013 | US8481422 Prevention and reduction of solvent and solution penetration into porous dielectrics using a thin barrier layer |
07/09/2013 | US8481421 Functional anchors connecting graphene-like carbon to metal |
07/09/2013 | US8481420 Integrated circuit packaging system with lead frame stacking module and method of manufacture thereof |
07/09/2013 | US8481419 Method for producing a metal contact on a coated semiconductor substrate |
07/09/2013 | US8481418 Low fabrication cost, high performance, high reliability chip scale package |
07/09/2013 | US8481417 Semiconductor structures including tight pitch contacts and methods to form same |
07/09/2013 | US8481416 Semiconductor devices having contact plugs with stress buffer spacers and methods of fabricating the same |
07/09/2013 | US8481415 Self-aligned contact combined with a replacement metal gate/high-K gate dielectric |
07/09/2013 | US8481414 Incorporating impurities using a discontinuous mask |
07/09/2013 | US8481413 Doping of semiconductor substrate through carbonless phosphorous-containing layer |
07/09/2013 | US8481412 Method of and apparatus for active energy assist baking |
07/09/2013 | US8481411 Method of manufacturing a semiconductor substrate having a cavity |
07/09/2013 | US8481410 Methods of epitaxial FinFET |
07/09/2013 | US8481409 Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate |
07/09/2013 | US8481408 Relaxation of strained layers |
07/09/2013 | US8481407 Processes for fabricating heterostructures |
07/09/2013 | US8481406 Methods of forming bonded semiconductor structures |
07/09/2013 | US8481405 Trap rich layer with through-silicon-vias in semiconductor devices |
07/09/2013 | US8481404 Leakage control in field effect transistors based on an implantation species introduced locally at the STI edge |
07/09/2013 | US8481403 Flowable film dielectric gap fill process |
07/09/2013 | US8481402 Epitaxy silicon on insulator (ESOI) |
07/09/2013 | US8481401 Component having a through-contact |
07/09/2013 | US8481400 Semiconductor manufacturing and semiconductor device with semiconductor structure |
07/09/2013 | US8481399 Method of manufacturing semiconductor device including capacitor element provided above wiring layer that includes wiring with an upper surface having protruding portion |
07/09/2013 | US8481398 Method of forming semiconductor device having a capacitor |
07/09/2013 | US8481397 Polysilicon resistor and E-fuse for integration with metal gate and high-k dielectric |
07/09/2013 | US8481396 Memory cell that includes a carbon-based reversible resistance switching element compatible with a steering element, and methods of forming the same |
07/09/2013 | US8481395 Methods of forming a dielectric containing dysprosium doped hafnium oxide |
07/09/2013 | US8481394 Memory cell that includes a carbon-based memory element and methods of forming the same |
07/09/2013 | US8481393 Semiconductor substrate and method for manufacturing the same, and method for manufacturing semiconductor device |
07/09/2013 | US8481392 Methods of fabricating semiconductor device using high-K layer for spacer etch stop and related devices |
07/09/2013 | US8481391 Process for manufacturing stress-providing structure and semiconductor device with such stress-providing structure |
07/09/2013 | US8481390 Method for forming impurity region of vertical transistor and method for fabricating vertical transistor using the same |
07/09/2013 | US8481389 Method of removing high-K dielectric layer on sidewalls of gate structure |
07/09/2013 | US8481388 Non-volatile memory device having a nitride-oxide dielectric layer |
07/09/2013 | US8481387 Method of forming an insulation structure and method of manufacturing a semiconductor device using the same |
07/09/2013 | US8481386 Nanocrystal memories and methods of forming the same |
07/09/2013 | US8481384 Method for producing MIM capacitors with high K dielectric materials and non-noble electrodes |
07/09/2013 | US8481383 Method of forming semiconductor device having buffer layer between sidewall insulating film and semiconductor substrate |
07/09/2013 | US8481382 Method and apparatus for manufacturing semiconductor device |
07/09/2013 | US8481381 Superior integrity of high-k metal gate stacks by preserving a resist material above end caps of gate electrode structures |
07/09/2013 | US8481380 Asymmetric wedge JFET, related method and design structure |
07/09/2013 | US8481379 Method for manufacturing fin field-effect transistor |
07/09/2013 | US8481378 Effecting selectivity of silicon or silicon-germanium deposition on a silicon or silicon-germanium substrate by doping |
07/09/2013 | US8481377 Method for manufacturing a semiconductor device with impurity doped oxide semiconductor |
07/09/2013 | US8481376 Group III nitride semiconductor devices with silicon nitride layers and methods of manufacturing such devices |
07/09/2013 | US8481375 Semiconductor device and method for producing the same |
07/09/2013 | US8481374 Semiconductor element comprising a low variation substrate diode |
07/09/2013 | US8481373 Method for manufacturing thin film transistor substrate |
07/09/2013 | US8481372 JFET device structures and methods for fabricating the same |
07/09/2013 | US8481371 Thin package system with external terminals and method of manufacture thereof |
07/09/2013 | US8481370 Semiconductor device and method for manufacturing the same |
07/09/2013 | US8481369 Method of making semiconductor package with improved standoff |
07/09/2013 | US8481368 Semiconductor package of a flipped MOSFET and its manufacturing method |
07/09/2013 | US8481366 Semiconductor device and manufacturing method therefor |
07/09/2013 | US8481365 MEMS devices |
07/09/2013 | US8481364 Flexible micro-system and fabrication method thereof |
07/09/2013 | US8481363 Semiconductor device and manufacturing method thereof |
07/09/2013 | US8481362 Thin film transistor and method for preparing the same |
07/09/2013 | US8481361 Methods of depositing antimony-comprising phase change material onto a substrate and methods of forming phase change memory circuitry |
07/09/2013 | US8481359 Methods of forming a phase change material |
07/09/2013 | US8481358 CCD sensors with multiple contact patterns |
07/09/2013 | US8481357 Thin film solar cell with ceramic handling layer |
07/09/2013 | US8481356 Method for manufacturing a back contact solar cell |
07/09/2013 | US8481355 Modular system and process for continuous deposition of a thin film layer on a substrate |
07/09/2013 | US8481354 Methods of creating a micro electro-mechanical systems accelerometer using a single double silicon-on-insulator wafer |
07/09/2013 | US8481353 Method of separating nitride films from the growth substrates by selective photo-enhanced wet oxidation |
07/09/2013 | US8481352 Method of fabricating light emitting diode chip |
07/09/2013 | US8481351 Active matrix substrate manufacturing method and liquid crystal display device manufacturing method |
07/09/2013 | US8481350 Asymmetric DBR pairs combined with periodic and modulation doping to maximize conduction and reflectivity, and minimize absorption |
07/09/2013 | US8481349 Method for manufacturing semiconductor light emitting device |
07/09/2013 | US8481348 Phase change memory and method for fabricating the same |
07/09/2013 | US8481346 Method of analyzing iron concentration of boron-doped P-type silicon wafer and method of manufacturing silicon wafer |
07/09/2013 | US8481345 Method to determine the position-dependant metal correction factor for dose-rate equivalent laser testing of semiconductor devices |
07/09/2013 | US8481344 Methods of evaporating metal onto a semiconductor wafer in a test wafer holder |
07/09/2013 | US8481343 Manufacturing method of molded image sensor packaging structure with predetermined focal length and the structure using the same |