Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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07/04/2013 | US20130171816 Apparatus and method for placing solder balls |
07/04/2013 | US20130171815 Manufacturing method of flash memory structure with stress area |
07/04/2013 | US20130171814 Method of manufacturing semiconductor device |
07/04/2013 | US20130171812 Self-aligned patterning with implantation |
07/04/2013 | US20130171811 Method for manufacturing compound semiconductor |
07/04/2013 | US20130171810 Methods of fabricating semiconductor device using high-k layer for spacer etch stop and related devices |
07/04/2013 | US20130171809 Semiconductor device and method of fabricating the same |
07/04/2013 | US20130171808 Double-sided reusable template for fabrication of semiconductor substrates for photovoltaic cell and microelectronics device manufacturing |
07/04/2013 | US20130171807 Methods of fabricating a semiconductor device including dual transistors |
07/04/2013 | US20130171806 Three-dimensional semiconductor memory device |
07/04/2013 | US20130171805 GaN Epitaxy With Migration Enhancement and Surface Energy Modification |
07/04/2013 | US20130171804 Method for manufacturing electronic component |
07/04/2013 | US20130171803 Method for fabricating an isolation structure |
07/04/2013 | US20130171802 Full wafer processing by multiple passes through a combinatorial reactor |
07/04/2013 | US20130171801 Semiconductor devices having nitrided gate insulating layer and methods of fabricating the same |
07/04/2013 | US20130171799 Current steering element and non-volatile memory element incorporating current steering element |
07/04/2013 | US20130171798 Method of manufacturing phase-change random access memory device |
07/04/2013 | US20130171797 Method for forming multi-component layer, method for forming multi-component dielectric layer and method for fabricating semiconductor device |
07/04/2013 | US20130171796 Methods of fabricating trench generated device structures |
07/04/2013 | US20130171795 Trench silicide contact with low interface resistance |
07/04/2013 | US20130171793 Methods of forming semiconductor devices using electrolyzed sulfuric acid (esa) |
07/04/2013 | US20130171792 Methods for Semiconductor Regrowth |
07/04/2013 | US20130171790 Methods of Manufacturing Semiconductor Devices and Transistors |
07/04/2013 | US20130171789 Method for manufacturing semiconductor device |
07/04/2013 | US20130171787 Method for fabricating non-volatile memory device |
07/04/2013 | US20130171786 Non-volatile memory (nvm) and logic integration |
07/04/2013 | US20130171785 Non-volatile memory (nvm) and logic integration |
07/04/2013 | US20130171784 Methods for isolating portions of a loop of pitch-multiplied material and related structures |
07/04/2013 | US20130171782 Method of manufacturing a semiconductor device |
07/04/2013 | US20130171781 Graphene electronic device and manufacturing method thereof |
07/04/2013 | US20130171777 Processing unit comprising integrated circuits including a common configuration of electrical interconnects |
07/04/2013 | US20130171775 Exposed die pad package with power ring |
07/04/2013 | US20130171774 Stackable semiconductor package and manufacturing method thereof |
07/04/2013 | US20130171773 Bonded structure employing metal semiconductor alloy bonding |
07/04/2013 | US20130171772 Through-silicon via structure formation process |
07/04/2013 | US20130171765 Aqueous acidic solution and etching solution and method for texturizing the surface of single crystal and polycrystal silicon substrates |
07/04/2013 | US20130171764 Method for manufacturing a semiconductor device |
07/04/2013 | US20130171760 Solid state image pickup device and method of producing solid state image pickup device |
07/04/2013 | US20130171753 Progressive-refractivity antireflection layer and method for fabricating the same |
07/04/2013 | US20130171752 Method for Collective Fabrication of 3D Electronic Modules Comprising Only Validated PCBs |
07/04/2013 | US20130171751 Package method for electronic components by thin substrate |
07/04/2013 | US20130171750 Package method for electronic components by thin substrate |
07/04/2013 | US20130171749 Package method for electronic components by thin substrate |
07/04/2013 | US20130171748 Method of testing a semiconductor device and suctioning a semiconductor device in the wafer state |
07/04/2013 | US20130171747 Fabricating method of semiconductor device |
07/04/2013 | US20130171746 Multi-zone temperature control for semiconductor wafer |
07/04/2013 | US20130171745 Energy meter calibration and monitoring |
07/04/2013 | US20130171744 Methods of thermally treating a semiconductor wafer |
07/04/2013 | US20130171449 Dicing film |
07/04/2013 | US20130170302 Semiconductor memory device and method of fabrication and operation |
07/04/2013 | US20130169713 Method of making liquid discharge head, liquid discharge head, liquid discharge apparatus having liquid discharge head, and manufacturing apparatus of liquid discharge head |
07/04/2013 | US20130169383 Switchable filters and design structures |
07/04/2013 | US20130169343 Using interrupted through-silicon-vias in integrated circuits adapted for stacking |
07/04/2013 | US20130169307 Contact resistance test structure and method suitable for three-dimensional integrated circuits |
07/04/2013 | US20130168876 Module package and production method |
07/04/2013 | US20130168874 Die up fully molded fan-out wafer level packaging |
07/04/2013 | US20130168873 Power semiconductor device and manufacturing method thereof |
07/04/2013 | US20130168870 Device and method for manufacturing an electronic device |
07/04/2013 | US20130168869 Metal Layout of an Integrated Power Transistor and the Method Thereof |
07/04/2013 | US20130168868 Semiconductor stack structure and fabrication method thereof |
07/04/2013 | US20130168867 Method for forming metal line in semiconductor device |
07/04/2013 | US20130168866 Chip-on-lead package and method of forming |
07/04/2013 | US20130168865 Semiconductor device having groove-shaped via-hole |
07/04/2013 | US20130168864 Method for producing ultra-thin tungsten layers with improved step coverage |
07/04/2013 | US20130168862 Method of manufacturing barrier layer patterns of a semiconductor memory device and structure of barrier layer patterns of semiconductor memory device |
07/04/2013 | US20130168861 Electrically conductive device and manufacturing method thereof |
07/04/2013 | US20130168858 Embedded wafer level ball grid array bar systems and methods |
07/04/2013 | US20130168857 Molded interposer package and method for fabricating the same |
07/04/2013 | US20130168856 Package on Package Devices and Methods of Packaging Semiconductor Dies |
07/04/2013 | US20130168855 Methods and Apparatus for Package On Package Devices with Reduced Strain |
07/04/2013 | US20130168853 Package substrate and method of fabricating the same |
07/04/2013 | US20130168852 MEMS Devices and Methods of Forming Same |
07/04/2013 | US20130168851 Bump structure and electronic packaging solder joint structure and fabricating method thereof |
07/04/2013 | US20130168850 Semiconductor device having a through-substrate via |
07/04/2013 | US20130168849 Fully Molded Fan-Out |
07/04/2013 | US20130168848 Packaged semiconductor device and method of packaging the semiconductor device |
07/04/2013 | US20130168846 Underfill process and materials for singulated heat spreader stiffener for thin core panel processing |
07/04/2013 | US20130168843 Embedded heat spreader for package with multiple microelectronic elements and face-down connection |
07/04/2013 | US20130168841 Programmable Interposer with Conductive Particles |
07/04/2013 | US20130168840 Semiconductor integrated device with mechanically decoupled active area and related manufacturing process |
07/04/2013 | US20130168835 High resistivity silicon-on-insulator substrate and method of forming |
07/04/2013 | US20130168833 METHOD FOR ENHANCING GROWTH OF SEMIPOLAR (Al,In,Ga,B)N VIA METALORGANIC CHEMICAL VAPOR DEPOSITION |
07/04/2013 | US20130168832 Semiconductor device |
07/04/2013 | US20130168830 Semiconductor wafer plating bus |
07/04/2013 | US20130168829 Phenolic resin composition, and methods for manufacturing cured relief pattern and semiconductor |
07/04/2013 | US20130168828 Through-hole forming method and inkjet head |
07/04/2013 | US20130168827 Design method of wiring layout, semiconductor device, program for supporting design of wiring layout, and method for manufacturing semiconductor device |
07/04/2013 | US20130168826 Laser system with polarized oblique incidence angle and associated methods |
07/04/2013 | US20130168824 P-doped silicon layers |
07/04/2013 | US20130168823 Systems and methods for backside threshold voltage adjustment |
07/04/2013 | US20130168822 Self aligned structures and design structure thereof |
07/04/2013 | US20130168821 Soi lateral bipolar transistor having multi-sided base contact and methods for making same |
07/04/2013 | US20130168820 Power sige heterojunction bipolar transistor (hbt) with improved drive current by strain compensation |
07/04/2013 | US20130168819 Fin-like BJT |
07/04/2013 | US20130168816 Resistor and fabrication method thereof |
07/04/2013 | US20130168815 Temperature switch with resistive sensor |
07/04/2013 | US20130168812 Memory capacitor having a robust moat and manufacturing method thereof |
07/04/2013 | US20130168805 Packages with Passive Devices and Methods of Forming the Same |
07/04/2013 | US20130168804 Stress-generating structure for semiconductor-on-insulator devices |
07/04/2013 | US20130168803 Semiconductor-On-Insulator Devices and Associated Methods |