Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2013
07/11/2013US20130175618 Finfet device
07/11/2013US20130175614 Semiconductor devices and methods of fabricating the same
07/11/2013US20130175613 Semiconductor Device with a Lightly Doped Gate
07/11/2013US20130175611 Semiconductor device and method of manufacturing the same
07/11/2013US20130175610 Transistor with stress enhanced channel and methods for fabrication
07/11/2013US20130175608 Semiconductor device and fabricating method thereof
07/11/2013US20130175607 Semiconductor device and fabricating method thereof
07/11/2013US20130175606 Integrated circuit having raised source drains devices with reduced silicide contact resistance and methods to fabricate same
07/11/2013US20130175600 Sonos stack with split nitride memory layer
07/11/2013US20130175599 Inline method to monitor ono stack quality
07/11/2013US20130175598 Damascene Word Line
07/11/2013US20130175597 Nanowire floating gate transistor
07/11/2013US20130175596 Integrated circuit with a thin body field effect transistor and capacitor
07/11/2013US20130175595 Integrated circuit including dram and sram/logic
07/11/2013US20130175594 Integrated circuit including dram and sram/logic
07/11/2013US20130175589 Decoupling capacitor and method of making same
07/11/2013US20130175588 Coherent spin field effect transistor
07/11/2013US20130175585 Methods of Forming Faceted Stress-Inducing Stressors Proximate the Gate Structure of a Transistor
07/11/2013US20130175584 FinFETs and the Methods for Forming the Same
07/11/2013US20130175583 Semiconductor devices having dielectric caps on contacts and related fabrication methods
07/11/2013US20130175581 Zener diode in a sige bicmos process and method of fabricating the same
07/11/2013US20130175579 Transistor with recessed channel and raised source/drain
07/11/2013US20130175578 IO ESD Device and Methods for Forming the Same
07/11/2013US20130175577 NFET Device with Tensile Stressed Channel Region and Methods of Forming Same
07/11/2013US20130175546 Diamond Semiconductor System and Method
07/11/2013US20130175545 Semiconductor device with strain-inducing regions and method thereof
07/11/2013US20130175544 Semiconductor device, and method of manufacturing semiconductor device
07/11/2013US20130175543 COMPOSITE GaN SUBSTRATE, METHOD FOR MANUFACTURING COMPOSITE GaN SUBSTRATE, GROUP III NITRIDE SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING GROUP III NITRIDE SEMICONDUCTOR DEVICE
07/11/2013US20130175541 Method of growing nitride semiconductor layer
07/11/2013US20130175539 High electron mobility transistors and methods of manufacturing the same
07/11/2013US20130175538 Substrate structure, semiconductor device fabricated from the same, and method of fabricating the semiconductor device
07/11/2013US20130175536 El display device, driving method thereof, and electronic equipment provided with the el display device
07/11/2013US20130175535 Semiconductor device, display device, and production method for semiconductor device and display device
07/11/2013US20130175534 Semiconductor device and method of manufacturing the same
07/11/2013US20130175532 Pixel structure and manufacturing method thereof
07/11/2013US20130175531 Pixel structure and manufacturing method thereof
07/11/2013US20130175529 Semiconductor Diode and Method for Forming a Semiconductor Diode
07/11/2013US20130175527 Sensor arrangement, a measurement circuit, chip-packages and a method for forming a sensor arrangement
07/11/2013US20130175505 Thin film transistor and method of manufacturing the same
07/11/2013US20130175503 Compressive (PFET) and Tensile (NFET) Channel Strain in Nanowire FETs Fabricated with a Replacement Gate Process
07/11/2013US20130175502 Nanowire Field Effect Transistors
07/11/2013US20130175501 Pulsed Growth of Catalyst-Free Growth of GaN Nanowires and Application in Group III Nitride Semiconductor Bulk Material
07/11/2013US20130175499 Boundary-Modulated Nanoparticle Junctions And A Method For Manufacture Thereof
07/11/2013US20130175494 Memory cells including top electrodes comprising metal silicide, apparatuses including such cells, and related methods
07/11/2013US20130175490 Nonvolatile semiconductor memory device and method of manufacturing the same
07/11/2013US20130175323 Serial thermal linear processor arrangement
07/11/2013US20130174983 Plasma processor and plasma processing method
07/11/2013US20130174982 Metal hard mask fabrication
07/11/2013US20130174884 Anisotropic ambipolar transverse thermoelectrics and methods for manufacturing the same
07/11/2013US20130174781 Gallium nitride-based led fabrication with pvd-formed aluminum nitride buffer layer
07/11/2013US20130174417 Interposer-on-Glass Package Structure
07/11/2013DE112011103391T5 Entformungseinrichtung Demolding
07/11/2013DE112011103319T5 Klebstoffzusammensetzung und Halbleitervorrichtung, die diese verwendet The adhesive composition and semiconductor device using this
07/11/2013DE112011103222T5 Verfahren zum Ausbilden vollständig eingelassener, kontakthöckerfreier Aufbauschichtverpackungen und dadurch ausgebildete Strukturen A method of forming completely sunken, contact bump-free design layer packaging and thus formed structures
07/11/2013DE112011102926T5 Halbleiterbauteil Semiconductor device
07/11/2013DE112008001548B4 Plasmabearbeitungsvorrichtung und Plasmabearbeitungsverfahren Plasma processing apparatus and plasma processing method
07/11/2013DE112006001634B4 Verfahren zum Herstellen einer oberflächenmontierbaren elektrischen Lichtemissionsvorrichtung mit einem Kühlkörper A method of manufacturing a surface mount electrical light-emitting device with a heat sink
07/11/2013DE10237896B4 Verfahren zum Ausbilden einer integrierten Abstandsschicht für die Gate-/Source-/Drain-Isolierung in einer vertikalen Arraystruktur und Transistor mit vertikalem Gate A method of forming an integrated spacer layer for the gate / source / drain insulation in a vertical array structure and transistor with vertical gate
07/11/2013DE102013100219A1 Halbleiterdiode und Verfahren zum Ausbilden einer Halbleiterdiode Semiconductor diode and method of forming a semiconductor diode
07/11/2013DE102013100156A1 Semiconductor package useful in e.g. current sensors and thermal sensors, comprises isolating container e.g. glass having a recess, semiconductor chip disposed in recess, and backplane disposed under membrane portion of isolating container
07/11/2013DE102013100042A1 Halbleitervorrichtung, Halbleitersystem, und Verfahren zur Herstellung der Halbleitervorrichtung A semiconductor device, semiconductor system, and method for manufacturing the semiconductor device
07/11/2013DE102012206598A1 Herstellung von metall-hartmasken Manufacture of metal hard mask
07/11/2013DE102012200278A1 Unpackaged power semiconductor e.g. FET for use in circuit carrier, has electrical conductive individual-conductors extending transverse to surface area, where part of each conductor is connected with surface area in end region
07/11/2013DE102012200258A1 Method for manufacturing three-dimension integrated chip, involves connecting contact surfaces of isolated components with integrated circuit portions of substrate, and removing another substrate from isolated components
07/11/2013DE102012103295A1 Device useful for coating semiconductor substrates, comprises processing unit, which is centrally arranged transfer module, loading- or unloading interface, power modules comprising a gas mixing system, pipelines, and a service space
07/11/2013DE102011002578B4 Induktor und Herstellungsverfahren Inducer and methods of manufacture
07/11/2013DE102008008920B4 Verfahren zur Herstellung eines vertikalen Leistungstransistors Process for the preparation of a vertical power transistor
07/11/2013DE102007043341B4 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation
07/11/2013DE102007042950B4 Integrierte Schaltung mit einer Gateelektrodenstruktur und ein entsprechendes Verfahren zur Herstellung Integrated circuit comprising a gate electrode structure and a corresponding method for producing
07/11/2013DE102006009961B4 Verfahren zur Herstellung eines Halbleiterbauteils A process for producing a semiconductor device
07/11/2013DE10145727B4 Verfahren und Vorrichtung zum Verringern des Stromverbrauchs einer elektronischen Schaltung Method and apparatus for reducing the power consumption of an electronic circuit
07/10/2013EP2613375A1 Organic semiconductor particulate material, organic semiconductor thin-film, dispersion liquid for forming organic semiconductor film, method for producing organic semiconductor thin-film, and organic thin-film transistor
07/10/2013EP2613357A2 Field-effect transistor and manufacturing method thereof
07/10/2013EP2613347A1 Substrate plate
07/10/2013EP2613346A1 Thin film transistor, manufacturing method thereof and display device
07/10/2013EP2613345A1 Silicon etchant and method for producing transistor by using same
07/10/2013EP2613344A1 Polishing composition
07/10/2013EP2613343A2 Method for manufacturing a double-gate non-volatile memory cell
07/10/2013EP2613342A2 Method for manufacturing a double-gate non-volatile memory cell
07/10/2013EP2613341A1 Epitaxial substrate for electronic device and method of producing the same
07/10/2013EP2613340A1 Device manufacturing apparatus and method therefor
07/10/2013EP2613216A1 Semiconductor element for current control, and control device using same
07/10/2013EP2613199A1 Photoresist residue and polymer residue removing liquid composition
07/10/2013EP2612742A1 Method for resin molding and resin molding apparatus
07/10/2013EP2612544A1 System, method and apparatus for controlling ion energy distribution
07/10/2013EP2612368A1 Process for the production of photovoltaic cells
07/10/2013EP2612365A2 Method for the wet-chemical etching back of a solar cell emitter
07/10/2013EP2612361A2 Photovoltaic cell having discontinuous conductors
07/10/2013EP2612357A1 Multilayer memory array
07/10/2013EP2612355A2 Manufacturing fixture for a ramp-stack chip package
07/10/2013EP2612354A2 A light emitting apparatus
07/10/2013EP2612353A1 Method for directly adhering two plates together, including a step for forming a temporary protective nitrogen layer
07/10/2013EP2612352A1 Process for producing a film, for example a single-crystal film, on a polymer substrate
07/10/2013EP2612351A1 Substrate heating device
07/10/2013EP2612350A1 Method and device for producing a metallic contact structure for making electrical contact with a photovoltaic solar cell
07/10/2013EP2612349A2 Apparatus and method for preparation of compounds or intermediates thereof from a solid material, and using such compounds and intermediates
07/10/2013EP2612348A1 P-doped silicon layers
07/10/2013EP2612347A2 Treatment, before the bonding of a mixed copper oxide surface, by a plasma containing nitrogen and hydrogen
07/10/2013EP2612156A1 Modular scanner, and method for operating same
07/10/2013EP2611950A1 Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv) with heated substrate and cooled electrolyte