Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2013
07/18/2013US20130181230 Semiconductor substrate and semiconductor substrate manufacturing method
07/18/2013US20130181228 Power semiconductor module and method of manufacturing the same
07/18/2013US20130181225 Semiconductor device and method of manufacturing the same
07/18/2013US20130181220 Method for estimating the diffusion length of metallic species within a three-dimensional integrated structure, and corresponding three-dimensional integrated structure
07/18/2013US20130181212 Semiconductor device and method for forming the same
07/18/2013US20130181203 Display Device
07/18/2013US20130181191 Electronic devices including bio-polymeric material and method for manufacturing the same
07/18/2013US20130181189 Logic Elements Comprising Carbon Nanotube Field Effect Transistor (CNTFET) Devices and Methods of Making Same
07/18/2013US20130181184 Nonvolatile semiconductor memory device and method of manufacturing the same
07/18/2013US20130181183 Resistive memory cell structures and methods
07/18/2013US20130181171 Metamaterial Optical Elements Self-Assembled on Protein Scaffolds
07/18/2013US20130181040 Semiconductor device manufacturing system and semiconductor device manufacturing method
07/18/2013US20130180963 Methods and apparatus for rapidly responsive heat control in plasma processing devices
07/18/2013US20130180847 High-throughput batch porous silicon manufacturing equipment design and processing methods
07/18/2013US20130180659 Liquid treatment apparatus
07/18/2013US20130180551 Substrate Processing Apparatus
07/18/2013US20130180516 Self-contained Heating Unit and Drug-Supply Unit Employing Same
07/18/2013US20130180448 Substrate transfer device and substrate processing system
07/18/2013US20130180446 Susceptor
07/18/2013DE19823583B4 Kombiniertes Halbleiterspeicher- und -logikbauelement sowie Speichertest-Steuerschaltung und Speichertestverfahren hierfür Combined semiconductor memory and -logikbauelement and memory test control circuit and memory test method therefor
07/18/2013DE112011103351T5 Herstellung von Einheiten mit metallischen Ersatz-Gates Production of units with metal replacement gate
07/18/2013DE112011103350T5 Chemisch-Mechanische Planarisierungsprozesse zum Herstellen von Finfet-Einheiten Chemical-mechanical planarization processes for producing FinFET devices
07/18/2013DE112011103224T5 Elektrolytische Gold- oder Goldpalladium-Oberflächenveredelungsanwendung in der Bearbeitung eines kernlosen Substrats Electrolytic gold or gold palladium surface finishing applications in the processing of a coreless substrate
07/18/2013DE112011103185T5 Polierzusammensetzung und Spülzusammensetzung Polishing composition and fluid composition
07/18/2013DE112011103163T5 Kristallqualitäts-Evaluierungsvorrichtung für Dünnfilm-Halbleiter unter Verwendung einer μ- PCD Technik Crystal quality evaluation apparatus for thin-film semiconductor using a μ- PCD technique
07/18/2013DE112011102804T5 Verbesserte Schaltvorrichtung mit geschichteter Vorrichtungsstruktur Improved switching device with layered device structure
07/18/2013DE112011101750T5 Verfahren und Struktur zur Verbesserung der Leitfähigkeit enger kupfergefüllter Durchkontaktierungen A method and structure for improving the conductivity close copper-filled vias
07/18/2013DE10260851B4 Verfahren zur Herstellung einer Kühlvorrichtung für Leistungsbauelemente, Kühlvorrichtung und elektronisches Steuergerät A process for producing a cooling device for the power components, the cooling device and electronic control unit
07/18/2013DE102013100423A1 Halbleitertransistor mit Grabenkontakten und Herstellungsverfahren dafür Semiconductor transistor with grave contacts and manufacturing method thereof
07/18/2013DE102013100422A1 Verfahren zum Bilden von selbstjustierenden Grabenkontakten von Halbleiterkomponenten und Halbleiterkomponente A method of forming self-aligned contacts grave of semiconductor components and semiconductor component
07/18/2013DE102013100079A1 Verfahren zum Prozessieren eines Kontaktpads A method for processing a contact pad
07/18/2013DE102013100062A1 Verfahren zum Entwerfen eines Ein-Chip-Systems mit einer Tapless-Standardzelle, Entwurfssystem und Ein-Chip-System A method of designing a single-chip system having a Tapless standard cell design system and a single-chip system
07/18/2013DE102013100025A1 Semiconductor device e.g. integrated circuit integrated with metal-insulator-metal (MIM) capacitor, has MIM capacitor which is formed in the grooves, partially over the substrate
07/18/2013DE102012222879A1 Leistungshalbleitermodul und Verfahren zu seiner Herstellung The power semiconductor module and method for its preparation
07/18/2013DE102012222252A1 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation
07/18/2013DE102012215529A1 Halbleitervorrichtung Semiconductor device
07/18/2013DE102012207245B3 Method for manufacturing composite component carrier for supporting e.g. organic LED on circuit board, involves isolating carrier elements of leadframe from each other and embedding isolated carrier elements in mold material
07/18/2013DE102012200559A1 Verfahren zur Herstellung eines Emitters einer Solarzelle und Solarzelle Process for the preparation of an emitter of a solar cell and solar cell
07/18/2013DE102012200532A1 Method for manufacturing e.g. MOSFET, involves forming insulating substrate by spraying insulative material on exposed surface portions of chip and contact carrier device that remains uncovered by insulative material
07/18/2013DE102012113110A1 Integrierte Halbleitervorrichtung mit Heteroübergang und Verfahren zur Erzeugung einer integrierten Halbleitervorrichtung mit Heteroübergang Integrated semiconductor device comprising hetero-junction, and method for producing an integrated semiconductor device having heterojunction
07/18/2013DE102010060798B4 Verfahren zum Verpacken einer Halbleitervorrichtung mit einer Klemme A method of packaging a semiconductor device having a terminal
07/18/2013DE102010037276B4 Verfahren zur Herstellung eines Halbleiterbauelements A process for producing a semiconductor device
07/18/2013DE102008045744B4 Halbleiterbaustein mit einer an eine Rückseite eines Chips gekoppelten Elektronikkomponente und Verfahren zur Herstellung A semiconductor device having a coupled to a backside of a chip electronic component and methods for making
07/18/2013DE102008038552B4 Vertikaldiode unter Verwendung von Silizium, ausgebildet durch selektives epitaxiales Aufwachsen Vertical diode using silicon, is formed by selective epitaxial growth
07/18/2013DE102008036285B4 Integrierte Schaltung mit einer durch einen galvanischen Prozess erzeugten Verbindung mit einem Kühlkörper und Verfahren dazu Integrated circuit comprising a produced by a galvanic process conjunction with a heat sink and method thereof
07/18/2013DE102004029102B4 Substratbearbeitungseinrichtung und Substratbearbeitungsverfahren Substrate processing apparatus and substrate processing method
07/18/2013DE10136510B4 Optisches Beleuchtungssystem in einer Belichtungseinheit Illumination optical system in an exposure unit
07/17/2013EP2615891A1 Method for surface mounting electronic component, and substrate having electronic component mounted thereon
07/17/2013EP2615889A1 Plasma processing apparatus
07/17/2013EP2615888A1 Plasma processing apparatus
07/17/2013EP2615657A1 Organic semiconductor material, organic semiconductor composition, organic thin film, field-effect transistor, and manufacturing method therefor
07/17/2013EP2615651A1 Method for producing group iii nitride semiconductor light emitting element and group iii nitride semiconductor light emitting element
07/17/2013EP2615650A2 III-nitride epitaxial substrate and deep ultraviolet light emiting device using the same
07/17/2013EP2615643A2 Field-effect transistor and manufacturing method thereof
07/17/2013EP2615638A2 Semiconductor Package Structure and Method for Manufacturing The Same
07/17/2013EP2615636A2 Probe card and method for manufacturing same
07/17/2013EP2615635A1 Semiconductor device production method and rinse
07/17/2013EP2615634A1 Method for cleaning silicon substrate, and method for producing solar cell
07/17/2013EP2615633A1 Composition for water-repellent treatment of surface, and method for water-repellent treatment of surface of semiconductor substrate using same
07/17/2013EP2615632A1 Treatment liquid for inhibiting pattern collapse in microstructures, and microstructure manufacturing method using said treatment liquid
07/17/2013EP2615631A1 Processing liquid for suppressing pattern collapse of microstructure, and method for producing microstructure using same
07/17/2013EP2615630A1 Treatment liquid for inhibiting pattern collapse in microstructures, and microstructure manufacturing method using said treatment liquid
07/17/2013EP2615629A1 Epitaxial substrate for semiconductor element, method for producing epitaxial substrate for semiconductor element, and semiconductor element
07/17/2013EP2615628A1 Method of growing nitride semiconductor layer
07/17/2013EP2615627A1 Manufacturing method of composite poly-silicon substrate of solar cell
07/17/2013EP2615626A1 Electrostatic chuck heater
07/17/2013EP2615625A1 Overhead vehicle for an automated material handling system
07/17/2013EP2615497A1 Resist pattern forming method
07/17/2013EP2615480A1 Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
07/17/2013EP2615479A1 Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
07/17/2013EP2615467A1 System and method for monitoring in real time the operating state of an IGBT device
07/17/2013EP2615411A2 Eddy current sensor
07/17/2013EP2615124A1 Organopolysiloxane, temporary adhesive composition containing organopolysiloxane, and method of producing thinned wafer using the same
07/17/2013EP2615122A1 Resin composition, and semiconductor device produced using resin composition
07/17/2013EP2614529A2 Methods of forming semiconductor contacts and related semiconductor devices
07/17/2013EP2614522A1 Semiconductor chip device with polymeric filler trench
07/17/2013EP2614521A1 Semiconductor chip device with underfill
07/17/2013EP2614520A1 Ozone and plasma generation using electron beam technology
07/17/2013EP2614519A1 Process for treating a substrate using a luminous flux of determined wavelength, and corresponding substrate
07/17/2013EP2614518A1 Methods of fabricating optoelectronic devices using layers detached from semiconductor donors and devices made thereby
07/17/2013EP2614122A1 Aqueous polishing compositions containing n-substituted diazenium dioxides and/or n'-hydroxy-diazenium oxide salts
07/17/2013EP2613906A1 Methods and apparatus for patterning photovoltaic devices and materials for use with such devices
07/17/2013CN203071117U Graphite plate
07/17/2013CN203071053U Quartz boat suitable for wafer guiding
07/17/2013CN203071052U Wafer box handle
07/17/2013CN203071051U Wafer separator for wet silicon wafer
07/17/2013CN203071050U Pickling tank
07/17/2013CN203071049U ESD dust-sticking glue bar
07/17/2013CN203071048U Chip testing?machine
07/17/2013CN1918708B 半导体装置 Semiconductor device
07/17/2013CN1917158B Power semiconductor packaging method and structure
07/17/2013CN1812683B Plasma reactor for improving plasma uniformity and device damage reduction
07/17/2013CN1782124B Porous low dielectric constant compositions and methods for making and using same
07/17/2013CN103210703A Assembling and packaging a discrete electronic component
07/17/2013CN103210506A Selective emitter solar cells formed by a hybrid diffusion and ion implantation process
07/17/2013CN103210500A Method for manufacturing semiconductor device
07/17/2013CN103210496A Semiconductor device and manufacturing method therefor
07/17/2013CN103210495A Semiconductor device and method for manufacturing same
07/17/2013CN103210493A Butted SOI junction isolation structures and devices and method of fabrication
07/17/2013CN103210486A Staged via formation from both sides of chip