Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2005
02/03/2005US20050023608 Method of forming a partially depleted silicon on insulator (PDSOI) transistor with a pad lock body extension
02/03/2005US20050023606 Modular bipolar-CMOS-DMOS analog integrated circuit and power transistor technology
02/03/2005US20050023605 High voltage semiconductor device having an increased breakdown voltage relative to its on-resistance
02/03/2005US20050023604 Semiconductor device with floating trap type nonvolatile memory cell and method for manufacturing the same
02/03/2005US20050023603 Atomic layer deposition of metal oxide and/or low asymmetrical tunnel barrier interpoly insulators
02/03/2005US20050023602 Programmable array logic or memory with p-channel devices and asymmetrical tunnel barriers
02/03/2005US20050023601 Semiconductor device and operation method thereof
02/03/2005US20050023600 NAND-type flash memory devices and methods of fabricating the same
02/03/2005US20050023599 Methods for fabricating flash memory devices
02/03/2005US20050023598 Semiconductor devices having a non-volatile memory transistor and methods for manufacturing the same
02/03/2005US20050023597 Nonvolatile semiconductor memory device
02/03/2005US20050023596 Method to form self-aligned floating gate to diffusion structures in flash
02/03/2005US20050023595 Programmable array logic or memory devices with asymmetrical tunnel barriers
02/03/2005US20050023594 Pr2O3-based la-oxide gate dielectrics
02/03/2005US20050023593 Multiple oxide thicknesses for merged memory and logic applications
02/03/2005US20050023592 Semiconductor device and method of manufacturing the same
02/03/2005US20050023591 Nonvolatile memory cell with multiple floating gates formed after the select gate and having upward protrusions
02/03/2005US20050023590 Multi-layer electrode and method of forming the same
02/03/2005US20050023589 Semiconductor memory device having a ferroelectric capacitor and method of manufacturing the same
02/03/2005US20050023588 Conductive container structures having a dielectric cap
02/03/2005US20050023587 Aluminum interconnects with metal silicide diffusion barriers
02/03/2005US20050023586 Electronic systems comprising memory devices
02/03/2005US20050023585 Storage capacitor structure
02/03/2005US20050023584 Atomic layer deposition and conversion
02/03/2005US20050023583 Multi media card formed by transfer molding
02/03/2005US20050023582 Fabrication of a feram capacitor using a noble metal hardmask
02/03/2005US20050023581 Magnetic random access memory and method of fabricating thereof
02/03/2005US20050023579 Semiconductor Device and method of fabricating the same
02/03/2005US20050023578 Stable PD-SOI devices and methods
02/03/2005US20050023577 Semiconductor device including a semiconductor substrate formed with a shallow impurity region, and a fabrication method for the same
02/03/2005US20050023576 Semiconductor structure having a strained region and a method of fabricating same
02/03/2005US20050023573 Deformable mirror using piezoelectric actuators formed as an integrated circuit and method of use
02/03/2005US20050023572 Electronic device package
02/03/2005US20050023571 High-voltage vertical transistor with a multi-layered extended drain structure
02/03/2005US20050023568 Semiconductor integrated circuit device
02/03/2005US20050023567 Semiconductor device and method for manufacturing the same
02/03/2005US20050023566 Semiconductor device incorporating an electrical contact to an internal conductive layer and method for making the same
02/03/2005US20050023565 Healing of micro-cracks in an on-chip dielectric
02/03/2005US20050023564 Arrays of nonvolatile memory cells wherein each cell has two conductive floating gates
02/03/2005US20050023563 Semiconductor chip with fuse unit
02/03/2005US20050023562 Standoffs for centralizing internals in packaging process
02/03/2005US20050023559 Magnetic oxide thin film, magnetic memory element, and method of manufacturing magnetic oxide thin film
02/03/2005US20050023557 Active matrix substrate, method of making the substrate, and display device
02/03/2005US20050023556 Bjt device configuration and fabrication method with reduced emitter width
02/03/2005US20050023555 GaN-based field effect transistor
02/03/2005US20050023552 Growth of GaAs epitaixial layers on Si substrate by using a novel GeSi buffer layer
02/03/2005US20050023550 Flip chip light emitting diode devices having thinned or removed substrates
02/03/2005US20050023544 Heteroepitaxially growing on heterosubstrate; reliability, high yield; single crystals; flatness, smoothness
02/03/2005US20050023535 Methods of fabricating delta doped silicon carbide metal-semiconductor field effect transistors having a gate disposed in a double recess structure
02/03/2005US20050023534 Thin film transistor array panel for a liquid crystal display and a method for manufacturing the same
02/03/2005US20050023533 Thin film transistor array substrate
02/03/2005US20050023531 Semiconductor device and method for manufacturing semiconductor device
02/03/2005US20050023529 Strained semiconductor by wafer bonding with misorientation
02/03/2005US20050023528 Semiconductor device and method for fabricating the same
02/03/2005US20050023526 Semiconductor device
02/03/2005US20050023525 Semiconductor device and manufacturing method thereof
02/03/2005US20050023521 Electro-optical device, method for making the same, and electronic apparatus
02/03/2005US20050023520 Strained silicon carbon alloy MOSFET structure and fabrication method thereof
02/03/2005US20050023516 Combined barrier layer and seed layer
02/03/2005US20050023486 Electron beam exposure apparatus and electron beam measurement module
02/03/2005US20050023480 Corrector for correcting first-order chromatic aberrations of the first degree
02/03/2005US20050023444 System and method for compensating for dark current in photosensitive devices
02/03/2005US20050023327 Method and apparatus for flip chip attachment by post collapse re-melt and re-solidification of bumps
02/03/2005US20050023271 Hot plate unit
02/03/2005US20050023270 Ceramic substrate and process for producing the same
02/03/2005US20050023269 Hot plate for semiconductor producing/examining device
02/03/2005US20050023267 Selective reflectivity process chamber with customized wavelength response and method
02/03/2005US20050023266 Heat treatment apparatus and method
02/03/2005US20050023260 Semiconductor wafer dividing apparatus and semiconductor device manufacturing method
02/03/2005US20050023259 Methods of bonding solder balls to bond pads on a substrate, and bonding frames
02/03/2005US20050023247 Chemical-mechanical polishing methods
02/03/2005US20050023242 introducing substrates having pattern layers into mechanical cells, then flowing silican chloride gas into the chamber, striking a plasma in the chamber and anisotropic etching the photoresist
02/03/2005US20050023231 Substrate supporting rod and substrate cassette using the same
02/03/2005US20050023187 Thermophoretic protection of reticles
02/03/2005US20050023178 Bag
02/03/2005US20050023148 Selectively transferring a prepatterned dielectric mask precursor through which voids extend to solidify and adhere to a substrate; depositing material through the voids; removing the mask to leave one or more openings through the deposited layer; depositing a 2nd material through the openings; polishing
02/03/2005US20050023147 Including an interconnect pattern having portions of its surface with different properties; since the first and second plating layers are formed on the interconnect pattern, oxidation of the surface of the interconnect pattern can be prevented, and also the electrical contact resistance can be lowered
02/03/2005US20050023133 The rate at which material particles are sputtered from the target and deposited on the wafer is controllable in response to power supplied to the target; maintaining a desired deposition rate maintains the wafer temperature below the critical temperature.
02/03/2005US20050023033 Intermediate substrate, intermediate substrate with semiconductor element, substrate with intermediate substrate, and structure having semiconductor element, intermediate substrate and substrate
02/03/2005US20050022935 Apparatus for improved low pressure inductively coupled high density plasma reactor
02/03/2005US20050022934 Plasma etching apparatus
02/03/2005US20050022932 Disturbance-free, recipe-controlled plasma processing system and method
02/03/2005US20050022931 Chemical mechanical polishing apparatus
02/03/2005US20050022930 Substrate treatment apparatus, substrate treatment method and substrate manufacturing method
02/03/2005US20050022905 Integrated circuit substrate material and method
02/03/2005US20050022862 Methods and apparatus for fabricating solar cells
02/03/2005US20050022851 [water cleaning apparatus]
02/03/2005US20050022845 An aqueous cleaning solution of ammonium fluoride that may contain hydrofluoric acid is replenished by adding ammonia or aqueous ammonia to the cleaning liquid intermittently during the cleaning step.
02/03/2005US20050022840 Method of manufacturing a semiconductor integrated circuit device
02/03/2005US20050022839 Systems and methods for photoresist strip and residue treatment in integrated circuit manufacturing
02/03/2005US20050022746 Holder for supporting wafers during semiconductor manufacture
02/03/2005US20050022745 Electroless plating method, electroless plating device, and production method and production device of semiconductor device
02/03/2005US20050022744 Susceptor for Semiconductor Manufacturing Equipment, and Semiconductor Manufacturing Equipment in Which the Susceptor Is Installed
02/03/2005US20050022742 Chemical vapor deposition processing equipment for use in fabricating a semiconductor device
02/03/2005US20050022741 Chemical vapor deposition apparatus and method of forming thin layer using same
02/03/2005US20050022740 Plasma processing system and cleaning method for the same
02/03/2005US20050022738 Precursor mixtures for use in preparing layers on substrates
02/03/2005US20050022737 Semiconductor-processing apparatus provided with susceptor and placing block
02/03/2005US20050022732 Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus
02/03/2005US20050022725 Process for depositing III-V semiconductor layers on a non-III-V substrate