Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2005
02/03/2005US20050024839 Ball grid array package
02/03/2005US20050024812 Semiconductor device with capacitor and manufacturing method thereof
02/03/2005US20050024811 Semiconductor device with adhesion-improvement capacitor and process for producing the device
02/03/2005US20050024809 Electrostatic chuck
02/03/2005US20050024643 Calibration method for a lithographic apparatus and device manufacturing method
02/03/2005US20050024630 Device for examining end part
02/03/2005US20050024622 Exposure mask and method for divisional exposure
02/03/2005US20050024621 Stage system including fine-motion cable unit, exposure apparatus, and method of manufacturing device
02/03/2005US20050024620 Lithographic apparatus, device manufacturing method, and device manufactured thereby
02/03/2005US20050024619 Exposure apparatus
02/03/2005US20050024616 Lithographic manufacturing process, lithographic projection apparatus, and device manufactured thereby
02/03/2005US20050024615 Lithographic apparatus and device manufacturing method
02/03/2005US20050024614 Mirror, lithographic apparatus, device manufacturing method, and device manufactured thereby
02/03/2005US20050024613 Spatial light modulator, lithographic apparatus and device manufacturing method
02/03/2005US20050024611 Lithographic apparatus and integrated circuit manufacturing method
02/03/2005US20050024610 Exposure apparatus and stage device, and device manufacturing method
02/03/2005US20050024609 Lithographic apparatus and device manufacturing method
02/03/2005US20050024550 Thin film transistor array panel and manufacturing method thereof
02/03/2005US20050024549 Method for manufacturing thin film transistor array
02/03/2005US20050024520 Image sensor having integrated thin film infrared filter
02/03/2005US20050024358 Power supply circuit, operational amplifier circuit, liquid crystal device and electronic instrument
02/03/2005US20050024178 Switchable inductance
02/03/2005US20050024127 Semiconductor device including reference voltage generation circuit attaining reduced current consumption during stand-by
02/03/2005US20050024126 Booster circuit
02/03/2005US20050024124 Voltage supply with low power and leakage current
02/03/2005US20050024123 Bias circuit and method of producing semiconductor device
02/03/2005US20050024121 Methods and systems for reducing leakage current in semiconductor circuits
02/03/2005US20050024115 Mixing prevention circuit for preventing mixing of semiconductor chips and semiconductor chip discrimination method
02/03/2005US20050024079 Method for evaluating semiconductor device
02/03/2005US20050024076 Systems for wafer level burn-in of electronic devices
02/03/2005US20050024047 Eddy current system for in-situ profile measurement
02/03/2005US20050023938 High-frequency oscillation element, magnetic information recording head, and magnetic storage device
02/03/2005US20050023773 Substrate supporting apparatus
02/03/2005US20050023715 Method for producing a semiconductor-molding tablet, a semiconductor-molding tablet obtained thereby and a semiconductor device using the same
02/03/2005US20050023707 Bipolar transistors with low-resistance emitter contacts
02/03/2005US20050023706 Semiconductor device and semiconductor device manufacturing method
02/03/2005US20050023705 Power grid layout techniques on integrated circuits
02/03/2005US20050023702 Semiconductor device and method for fabricating the same
02/03/2005US20050023701 Semiconductor device and method of manufacturing the same
02/03/2005US20050023698 Alternating aluminum and copper layers with aluminum top layer; reduced resistivity and resistance capacitance delay
02/03/2005US20050023697 Methods for making integrated-circuit wiring from copper, silver, gold, and other metals
02/03/2005US20050023696 Semiconductor device having a wiring layer of damascene structure and method for manufacturing the same
02/03/2005US20050023695 Methods for making nearly planar dielectric films in integrated circuits
02/03/2005US20050023694 Integrated low k dielectrics and etch stops
02/03/2005US20050023693 Reliable low-k interconnect structure with hybrid dielectric
02/03/2005US20050023692 Semiconductor apparatus including a radiator for diffusing the heat generated therein
02/03/2005US20050023691 Semiconductor device and manufacturing method thereof
02/03/2005US20050023690 Insulating tube, semiconductor device employing the tube, and method of manufacturing the same
02/03/2005US20050023689 Chemical planarization performance for copper/low-k interconnect structures
02/03/2005US20050023688 Two step semiconductor manufacturing process for copper interconnects
02/03/2005US20050023687 Activation of oxides for electroless plating
02/03/2005US20050023686 Having tunsten nitride base, tungsten silicon nitride overlay and both copper seed and conducting layers; preventing punch through or spiking; heat resistance
02/03/2005US20050023685 Nickel bonding cap over copper metalized bondpads
02/03/2005US20050023684 Semiconductor substrate cleaning
02/03/2005US20050023680 Semiconductor device with strain relieving bump design
02/03/2005US20050023676 Solder pads and method of making a solder pad
02/03/2005US20050023675 Semiconductor device and manufacturing method of the same
02/03/2005US20050023671 Semiconductor device and a method of manufacturing the same
02/03/2005US20050023670 Semiconductor device and a method of manufacturing the same
02/03/2005US20050023669 Semiconductor wafer, semiconductor device, method for manufacturing the semiconductor device, circuit board, and electronic apparatus
02/03/2005US20050023666 Semiconductor device and method of fabricating the same, circuit board, and electronic instrument
02/03/2005US20050023665 Curable encapsulant compositions
02/03/2005US20050023661 Hermetic sealing cap and method of manufacturing the same
02/03/2005US20050023660 Semiconductor device and its manufacturing method
02/03/2005US20050023659 Semiconductor chip package and stacked module having a functional part and packaging part arranged on a common plane
02/03/2005US20050023658 Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package
02/03/2005US20050023656 Vertical system integration
02/03/2005US20050023655 Packaged microelectronic devices and methods of forming same
02/03/2005US20050023649 Semiconductor chip with FIB protection
02/03/2005US20050023648 Semiconductor device and method of locating a predetermined point on the semiconductor device
02/03/2005US20050023647 Semiconductor wafer and method of manufacturing semiconductor device
02/03/2005US20050023646 Multi-layered structure including an epitaxial layer having a low dislocation defect density, semiconductor device comprising the same, and method of fabricating the semiconductor device
02/03/2005US20050023644 Stabilization in device characteristics of a bipolar transistor that is included in a semiconductor device with a CMOSFET
02/03/2005US20050023642 Semiconductor device and method for production thereof
02/03/2005US20050023640 Metal-insulator-metal capacitors including transition metal silicide films on doped polysilicon contact plugs and methods of forming the same
02/03/2005US20050023639 Inductor Q value improvement
02/03/2005US20050023636 Semiconductor device and method for manufacturing the same
02/03/2005US20050023635 Isolation techniques for reducing dark current in CMOS image sensors
02/03/2005US20050023634 Method of fabricating shallow trench isolation structure and microelectronic device having the structure
02/03/2005US20050023633 Semiconductor-on-insulator SRAM configured using partially-depleted and fully-depleted transistors
02/03/2005US20050023631 Controlled dry etch of a film
02/03/2005US20050023628 Multilayer high k dielectric films and method of making the same
02/03/2005US20050023627 Lanthanide doped TiOx dielectric films by plasma oxidation
02/03/2005US20050023626 Lanthanide oxide / hafnium oxide dielectrics
02/03/2005US20050023625 Atomic layer deposited HfSiON dielectric films
02/03/2005US20050023624 Atomic layer-deposited HfAlO3 films for gate dielectrics
02/03/2005US20050023623 Gate structure and method
02/03/2005US20050023622 Semiconductor device and method
02/03/2005US20050023621 Electrostatic discharge protection devices having transistors with textured surfaces
02/03/2005US20050023620 Titanium silicide boride gate electrode
02/03/2005US20050023619 Method of forming a transistor having multiple channels and structure thereof
02/03/2005US20050023617 Conductive lines buried in insulating areas
02/03/2005US20050023616 Localized strained semiconductor on insulator
02/03/2005US20050023615 Semiconductor element and semiconductor memory device using the same
02/03/2005US20050023614 Electrostatic discharge protection circuit
02/03/2005US20050023613 Stable PD-SOI devices and methods
02/03/2005US20050023612 Ultra-thin semiconductors bonded on glass substrates
02/03/2005US20050023611 Field effect transistor having a doped gate electrode with reduced gate depletion and method of forming the transistor
02/03/2005US20050023610 Semiconductor-on-insulator structure having high-temperature elastic constraints
02/03/2005US20050023609 Semiconductor device and method for manufacturing partial SOI substrates