Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2005
04/26/2005US6884651 Producing method of CMOS image sensor
04/26/2005US6884650 Side-bonding method of flip-chip semiconductor device, MEMS device package and package method using the same
04/26/2005US6884647 Method for roughening semiconductor surface
04/26/2005US6884646 Method for forming an LED device with a metallic substrate
04/26/2005US6884645 Method for preparing a device structure having a wafer structure deposited on a composite substrate having a matched coefficient of thermal expansion
04/26/2005US6884644 Low temperature formation of backside ohmic contacts for vertical devices
04/26/2005US6884643 Semiconductor device, method for evaluating the same, and method for fabricating the same
04/26/2005US6884641 Site-specific methodology for localization and analyzing junction defects in mosfet devices
04/26/2005US6884639 Semiconductor wafer pod
04/26/2005US6884638 Method of fabricating a flash memory semiconductor device by determining the active region width between shallow trench isolation structures using an overdrive current measurement technique and a device thereby fabricated
04/26/2005US6884637 Inspection pattern, inspection method, and inspection system for detection of latent defect of multi-layer wiring structure
04/26/2005US6884635 Control of power delivered to a multiple segment inject electrode
04/26/2005US6884634 Specifying method for Cu contamination processes and detecting method for Cu contamination during reclamation of silicon wafers, and reclamation method of silicon wafers
04/26/2005US6884633 Semiconductor memory device using magneto resistive element and method of manufacturing the same
04/26/2005US6884631 Method of forming a ferroelectric film by direct annealing of the ferroelectric film using laser or lamp followed by a second annealing through a light transmission and/or absorption film
04/26/2005US6884571 Process comprising (A) an octakis(silsesquioxane) skeleton-containing polymer obtained by hydrosilylation polymerization of a compound represented by formula (I) defined in the specification with bis(substituted ethynyl) compound with
04/26/2005US6884569 Method of manufacturing TFT array
04/26/2005US6884566 Addition polymer containing organosilicon compound and unsaturated compound
04/26/2005US6884564 Fluorinated polymers having ester groups and photoresists for microlithography
04/26/2005US6884552 Focus masking structures, focus patterns and measurements thereof
04/26/2005US6884550 Insertion of dummy pattern; uniform etching; accuracy patterns
04/26/2005US6884523 Electronic component and method of manufacturing the same
04/26/2005US6884516 Internal member for plasma-treating vessel and method of producing the same
04/26/2005US6884475 Chemical vapor deposition method for depositing a high k dielectric film
04/26/2005US6884473 Method for fabricating metal silicide
04/26/2005US6884464 Methods for forming silicon comprising films using hexachlorodisilane in a single-wafer deposion chamber
04/26/2005US6884463 CVD process for forming a thin film
04/26/2005US6884462 Solvent prewet and method to dispense the solvent prewet
04/26/2005US6884365 Comprises octafluorocyclopentene; for dry etching/chemical vapor deposition/ashing; production of highly integrated/densified/large-sized semiconductor devices
04/26/2005US6884344 Hydrogen-dissolved water production apparatus
04/26/2005US6884338 Etching by using a bis(perfluoroalkanesulfonyl) imide acids or a tris(perfluoroalkanesulfonyl) methide, having acidity properties, providing smooth surface
04/26/2005US6884335 Electroplating using DC current interruption and variable rotation rate
04/26/2005US6884334 Vertically configured chamber used for multiple processes
04/26/2005US6884329 Plasma sputtering, two step processes performed at a low temperature, and a high temperature, electrodeposition, manufacturing semiconductor integrated circuits
04/26/2005US6884319 Susceptor of apparatus for manufacturing semiconductor device
04/26/2005US6884318 Plasma processing system and surface processing method
04/26/2005US6884317 Method and installation for etching a substrate
04/26/2005US6884313 Method and system for joining and an ultra-high density interconnect
04/26/2005US6884303 Process of thinning and blunting semiconductor wafer edge and resulting wafer
04/26/2005US6884298 Method and system for coating and developing
04/26/2005US6884297 Thin film deposition reactor
04/26/2005US6884295 Method of forming oxynitride film or the like and system for carrying out the same
04/26/2005US6884294 Coating film forming method and apparatus
04/26/2005US6884154 Method for apparatus for polishing outer peripheral chamfered part of wafer
04/26/2005US6884153 Apparatus for electrochemical processing
04/26/2005US6884150 Polishing pad sensor assembly with a damping pad
04/26/2005US6884147 Method for chemical-mechanical polish control in semiconductor manufacturing
04/26/2005US6884145 High selectivity slurry delivery system
04/26/2005US6884144 Methods and systems for planarizing microelectronic devices with Ge-Se-Ag layers
04/26/2005US6884066 Thermal process station with heated lid
04/26/2005US6884019 Conveying arm
04/26/2005US6883901 Piezoelectric element, liquid jetting head, and method for manufacturing thereof
04/26/2005US6883770 Load port mounting mechanism
04/26/2005US6883698 Planting device for planting solder balls onto a chip
04/26/2005US6883674 Holder for use in semiconductor device manufacturing and bio-medical sample processing
04/26/2005US6883638 Accelerometer transducer used for seismic recording
04/26/2005US6883574 Apparatus for application of adhesive tape to semiconductor devices
04/26/2005US6883539 Wafer container
04/26/2005US6883283 Semiconductor manufacturing facility and a semiconductor manufacturing method
04/26/2005US6883250 Non-contact cool-down station for wafers
04/26/2005US6883248 Apparatus for drying a substrate using an isopropyl alcohol vapor
04/26/2005US6883231 Method for fabricating a circuit device
04/21/2005WO2005036658A1 Group-iii nitride semiconductor device
04/21/2005WO2005036652A1 Organic semiconductor device, process for producing the same, and organic semiconductor apparatus
04/21/2005WO2005036651A1 Semiconductor device and production method therefor
04/21/2005WO2005036650A2 Insulated gate type semiconductor device and manufacturing method thereof
04/21/2005WO2005036642A2 A microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
04/21/2005WO2005036641A1 Method for separately optimizing thin gate dielectric of pmos and nmos transistors within the same semiconductor chip and device manufactured thereby
04/21/2005WO2005036640A1 Semiconductor device with nanoclusters
04/21/2005WO2005036639A1 Method of forming a through-substrate interconnect
04/21/2005WO2005036638A1 Semiconductor substrate, semiconductor device and process for producing semiconductor substrate
04/21/2005WO2005036637A1 Mems based contact conductivity electrostatic chuck
04/21/2005WO2005036636A1 Thermosetting resin wafer-holding pin
04/21/2005WO2005036635A1 Teaching tool for semiconductor wafer carrying robot
04/21/2005WO2005036633A1 Process for producing electronic member, and ic chip with adhesive
04/21/2005WO2005036632A1 Integrated electronic chip and interconnect device and process for making the same
04/21/2005WO2005036631A1 Schottky-barrier mosfet manufacturing method using isotropic etch process
04/21/2005WO2005036630A1 Composition for forming etching stopper layer
04/21/2005WO2005036629A1 Process for roughening surface of wafer
04/21/2005WO2005036628A1 Mounting device and method
04/21/2005WO2005036627A1 Absorber layer for dynamic surface annealing processing
04/21/2005WO2005036626A1 Junction forming method and object to be processed and formed by using same
04/21/2005WO2005036625A1 Techniques for patterning features in semiconductor devices
04/21/2005WO2005036623A1 Substrate transporting apparatus and method, exposure apparatus and method, and device producing method
04/21/2005WO2005036622A1 Substrate carrying apparatus, exposure apparatus, and method for producing device
04/21/2005WO2005036621A1 Substrate carrying apparatus, substrate carrying method, exposure apparatus, exposure method, and method for producing device
04/21/2005WO2005036619A1 Illumination optical device, and exposure device and method
04/21/2005WO2005036618A1 Stage device and exposure device
04/21/2005WO2005036617A1 Work single wafer processing system
04/21/2005WO2005036615A2 Apparatus to improve wafer temperature uniformity for face-up wet processing
04/21/2005WO2005036614A1 Selective heating using flash anneal
04/21/2005WO2005036613A2 Ultra high-speed si/sige modulation-doped field effect transistors on ultra thin soi/sgoi substrate
04/21/2005WO2005036612A2 Ferroelectric capacitor with a complex-oxide hard-mask top electrode and method for manufacturing the same
04/21/2005WO2005036611A1 Device and method for cleaning the edges of substrates
04/21/2005WO2005036604A2 Apparatus and method for supporting a flexible substrate during processing
04/21/2005WO2005036599A2 Non-volatile memory device
04/21/2005WO2005036598A2 Method of making a vertical electronic device
04/21/2005WO2005036597A2 Semiconductor device and making thereof
04/21/2005WO2005036596A2 Method and apparatus of etch process control in fabrications of microstructures
04/21/2005WO2005036594A2 Method and apparatus for efficient temperature control using a contact volume